公开(公告)号：US11923103B2

公开(公告)日：2024-03-05

申请号：US17240281

申请日：2021-04-26

Applicant: Carnegie Mellon University

Inventor： Carmel Majidi ,  Chengfeng Pan ,  Kitty Kumar

IPC: H05K1/02 ,  C25D1/04 ,  C25D5/02 ,  C25D5/56 ,  H01B1/12 ,  H01B1/22 ,  H05K1/03 ,  H05K3/02

CPC classification number: H01B1/12 ,  C25D1/04 ,  C25D5/022 ,  C25D5/56 ,  H01B1/22 ,  H05K1/0393 ,  H05K3/027 ,  H05K2201/0108 ,  H05K2203/107

Abstract: A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.

公开(公告)号：US20240043711A1

公开(公告)日：2024-02-08

申请号：US18382630

申请日：2023-10-23

Applicant: C3 Nano, Inc.

Inventor： Ying-Syi Li ,  Xiqiang Yang ,  Yu Kambe ,  Xiaofeng Chen ,  Hua Gu ,  Steven Michael Lam ,  Melanie Maniko Inouye ,  Arthur Yung-Chi Cheng ,  Alex Da Zhang Tan ,  Christopher S. Scully ,  Ajay Virkar

IPC: C09D11/52 ,  H05K1/02 ,  H05K1/09 ,  H01B1/22 ,  C09D101/02 ,  C09D139/06 ,  B05D3/02 ,  B05D5/06 ,  H01B13/30 ,  C09D11/08 ,  C09D11/10 ,  C09D11/14 ,  G06F3/044 ,  H01B1/02 ,  B05D1/00 ,  B05D1/02 ,  B05D1/18 ,  B05D1/26 ,  B05D1/28 ,  C09D11/102 ,  C09D11/106 ,  C23C30/00

CPC classification number: C09D11/52 ,  H05K1/0274 ,  H05K1/097 ,  H01B1/22 ,  C09D101/02 ,  C09D139/06 ,  B05D3/0254 ,  B05D5/06 ,  H01B13/30 ,  C09D11/08 ,  C09D11/10 ,  C09D11/14 ,  G06F3/0445 ,  H01B1/02 ,  B05D1/005 ,  B05D1/02 ,  B05D1/18 ,  B05D1/265 ,  B05D1/28 ,  C09D11/102 ,  C09D11/106 ,  C23C30/00 ,  H05K2201/10151 ,  H05K2201/10128 ,  H05K2201/0108 ,  H05K2201/026 ,  G06F3/044 ,  G06F3/045

Abstract: Fusing nanowire inks are described that can also comprise a hydrophilic polymer binder, such as a cellulose based binder. The fusing nanowire inks can be deposited onto a substrate surface and dried to drive the fusing process. Transparent conductive films can be formed with desirable properties.

公开(公告)号：US11888084B2

公开(公告)日：2024-01-30

申请号：US17817942

申请日：2022-08-05

Applicant: nLIGHT, Inc.

Inventor： Ken Gross

IPC: H01L31/18 ,  G21K5/04 ,  H05K3/02 ,  G06F3/044 ,  G06F3/041 ,  H05K1/03

CPC classification number: H01L31/1884 ,  G06F3/044 ,  G06F3/04164 ,  G21K5/04 ,  H05K3/02 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0393 ,  H05K3/027 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/026 ,  H05K2203/1142 ,  Y02E10/50

Abstract: Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

公开(公告)号：US11674890B2

公开(公告)日：2023-06-13

申请号：US17407985

申请日：2021-08-20

Applicant: HAESUNG DS CO., LTD.

Inventor： Jin Woo Lee ,  Byung Moon Lee ,  Jin Kee Hong ,  Jong Woo Kim

IPC: G01N21/17 ,  H05K1/02 ,  G01L9/00 ,  G01K11/26 ,  H05K3/28 ,  H05K1/18

CPC classification number: G01N21/1702 ,  G01K11/265 ,  G01L9/0025 ,  H05K1/0274 ,  G01N2021/1708 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/1316

Abstract: Provided are an optical sensor device using surface acoustic waves and an optical sensor device package. The optical sensor device includes: a substrate including a first light sensing area and a temperature sensing area and including a piezo electric material; a first input electrode and a first output electrode which are disposed in the first light sensing area and are apart from each other with a first delay gap therebetween; a first sensing film overlapping the first delay gap and configured to cover at least some portions of the first input electrode and the first output electrode; and a second input electrode and a second output electrode which are disposed in the temperature sensing area and are apart from each other with a second delay gap therebetween. The second delay gap is exposed to air.

公开(公告)号：US20190191569A1

公开(公告)日：2019-06-20

申请号：US16283808

申请日：2019-02-24

Applicant: Cambrios Film Solutions Corporation

Inventor： David Jones ,  Florian Pschenitzka ,  Xina Quan ,  Michael A. Spaid ,  Jeffrey Wolk

IPC: H05K3/24 ,  B82Y30/00 ,  B82Y10/00 ,  H01L31/18 ,  H01L29/41

CPC classification number: H05K3/245 ,  B82Y10/00 ,  B82Y30/00 ,  G02F1/13439 ,  H01L29/0669 ,  H01L29/413 ,  H01L31/1884 ,  H01L51/0048 ,  H01L51/5206 ,  H05K1/097 ,  H05K3/249 ,  H05K2201/0108 ,  H05K2201/026 ,  Y02E10/50

Abstract: Composite transparent conductors are described, which comprise a primary conductive medium based on metal nanowires and a secondary conductive medium based on a continuous conductive film.

公开(公告)号：US20180355495A1

公开(公告)日：2018-12-13

申请号：US16108407

申请日：2018-08-22

Applicant: Global Solar Energy, Inc.

Inventor： Scott WIEDEMAN

IPC: C25D1/20 ,  C25D1/08 ,  H01L31/02 ,  H01L31/0224 ,  H01L31/18 ,  H05K3/20 ,  C25D1/04 ,  H05K1/03

CPC classification number: C25D1/20 ,  C25D1/04 ,  C25D1/08 ,  H01L31/02008 ,  H01L31/022425 ,  H01L31/18 ,  H05K1/0393 ,  H05K3/205 ,  H05K2201/0108 ,  H05K2203/0726 ,  H05K2203/1545 ,  Y02E10/50

Abstract: A conductive grid formation system, apparatus, and related methods may include a drum having a conductive surface, an insulation layer coating said surface, and a grid pattern formed in the insulation layer to expose portions of the conductive surface. The drum surface may be rotated into and out of a chemical bath, such that a metallic grid is electrodeposited in the exposed portions of the conductive surface. A polymer sheet may be laminated to the surface of the drum and then removed, such that the metallic grid attaches to the polymer sheet and is removed with the polymer sheet. Heat, pressure, and/or adhesive may be utilized in various steps of the process, to facilitate preferential adhesion of the metallic grid to the polymer sheet.

公开(公告)号：US10085349B2

公开(公告)日：2018-09-25

申请号：US15560445

申请日：2016-03-17

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Akihiko Hanya

IPC: H01L21/00 ,  H05K3/12 ,  H05K3/10 ,  H05K1/14 ,  H05K1/18 ,  H01B1/22 ,  H01L23/00 ,  B22F1/02 ,  H01L23/498

CPC classification number: H05K3/1283 ,  B22F1/02 ,  B22F1/025 ,  B22F7/08 ,  B22F2999/00 ,  H01B1/22 ,  H01L23/49822 ,  H01L24/17 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/81 ,  H01L2224/83192 ,  H05K1/097 ,  H05K1/145 ,  H05K1/186 ,  H05K3/102 ,  H05K2201/0108 ,  H05K2201/10106 ,  H05K2203/1131 ,  B22F2001/0092 ,  B22F1/0014 ,  B22F3/10 ,  B22F2202/11

Abstract: A method for producing an electronic device capable of connecting an electronic component precisely with a high-density circuit pattern includes applying a solution wherein conductive nanoparticles with a particle diameter of less than 1 μm and an insulating material are dispersed, or applying a solution wherein the conductive nanoparticles are coated with an insulating material layer, to a surface of an optically transparent substrate in a desired shape. A film of the conductive nanoparticles coated with the insulating material is formed. The electronic component is mounted on the film. The film is irradiated with light from a backside surface of the optically transparent substrate, and the light sinters the conductive nanoparticles. Accordingly, a first circuit pattern connected to electrodes of the electronic component is formed, and the first circuit pattern is adhered to the electrodes of the electronic component.

公开(公告)号：US20180218669A1

公开(公告)日：2018-08-02

申请号：US15937581

申请日：2018-03-27

Applicant: LightnTec GmbH & Co. KG

Inventor： Manuel Huebner ,  Florian Kall

IPC: G09G3/32 ,  H05K1/18 ,  H05K1/02 ,  H05K3/34

CPC classification number: G09G3/32 ,  G09G2320/0626 ,  G09G2380/02 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/0011 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10151 ,  H05K2201/10174 ,  H05K2201/10522 ,  H05K2203/0143 ,  H05K2203/1545

Abstract: An illuminated display includes a plurality of illumination means, in particular a plurality of LEDs, which are arranged on a transparent base member. The transparent base member reduces visible light on average by a maximum of 40%. Preferably, the transparent base member is constructed in the form of a film, or in a further preferred manner in the form of a plastics material film. The illumination means are supplied with voltage by means of strip conductors. The strip conductors are electrically connected at one end preferably to a control unit and at the other end to at least one illumination means.

公开(公告)号：US20180196346A1

公开(公告)日：2018-07-12

申请号：US15741993

申请日：2017-01-04

Applicant: LG CHEM, LTD.

Inventor： Yong Goo SON ,  Seung Heon LEE ,  Han Min SEO ,  Chang Yoon LIM ,  Ji Eun MYUNG ,  Kiseok LEE

IPC: G03F7/20 ,  H05K3/00 ,  G03F7/16 ,  G03F7/32 ,  G03F7/038

CPC classification number: G03F7/2002 ,  G03F7/038 ,  G03F7/162 ,  G03F7/168 ,  G03F7/322 ,  H01L51/5212 ,  H05K1/0274 ,  H05K1/09 ,  H05K3/0011 ,  H05K3/12 ,  H05K2201/0108 ,  H05K2201/0326 ,  H05K2201/0376 ,  H05K2201/09681 ,  H05K2203/0264 ,  H05K2203/0278

Abstract: The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.

公开(公告)号：US20180192510A1

公开(公告)日：2018-07-05

申请号：US15859234

申请日：2017-12-29

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Tetsuyuki TSUCHIDA

IPC: H05K1/02 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/03 ,  H05K3/02

CPC classification number: H05K1/0271 ,  H01L21/4857 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/562 ,  H01L24/16 ,  H01L27/14618 ,  H01L2224/16235 ,  H01L2924/3512 ,  H05K1/0274 ,  H05K1/0306 ,  H05K3/02 ,  H05K2201/0108 ,  H05K2201/10121

Abstract: A wiring substrate that helps prevent cracking of a base material at the time of formation of a light transmissive portion, has high light transmittance, and allows formation of fine wiring, and a method for manufacturing the same. The wiring substrate includes: a base material with light transmittance; a laminated body formed by laminating a metal layer and a resin layer on at least one side of the base material; and a light transmissive portion as an opening provided in part of the laminated body. The wiring substrate is characterized in that at least part of side surfaces defining the light transmissive portion is formed from the resin layer, and adjacent the surface of the base material, part of the metal layer is adjacent to the resin layer constituting at least part of the side surfaces defining the light transmissive portion and is disposed to surround the resin layer.