Abstract:
This invention pertains to apparatus for processing end-taped electronic components. This apparatus provides means for high-speed trimming, bending, or combinations thereof, of the leads of these components. The dies as assembled portions are carried in blocks for easy removal from reciprocated slide members. Left- and right-hand die assemblies are carried in by blocks removably attached to slide members mounted in groove portions of a support block. This support block may be moved by screw threads on a shaft to provide desired fine adjustment of the trimming of the leads. Barrel-type eccentric cams are carried on this apparatus and are moved in timed relationship to each other and the motor drive. Each of these eccentric cams engages and reciprocably drives box-like follower members which move a slide member, and an associated die block and die assembly. The driven sprocket is positioned between and adjacent the reciprocated die assemblies at the processing station. Fixed guide means is provided to insure guiding of the tape and components at a high speed and positive alignment. The severed component is deposited into an accumulating bin.
Abstract:
The trimming apparatus and fixture for holding a PC board prior to and during trimming of an upper surface of the PC board utilizes a trimming blade rotated by a variable speed motor. This apparatus includes X and Y motion mechanism moved by hand grips that are spaced apart and cooperate with push button switches providing a safety control circuit. The X and Y motion mechanism employs linear ball bushings mounted and movable on hardened steel shafts. Removable holding fixtures are employed to hold and retain the PC boards during trimming. One holding fixture is used for PC boards that are not warped and not likely to warp. This fixture holds the PC board on three sides and a quick acting cam clamp is actuated to retain and release a PC board. Another fixture is adapted to hold and retain a PC board that is warped or likely to warp. Vacuum is used with a plurality of standoffs to establish the desired holding plane of this PC board. A quick opening aperture is uncovered to release both negative pressure and the PC board after trimming. A third fixture employs a top plate which is positioned by dowells. On this fixture and in this plate is formed a plurality of receiving openings for PC boards of small and/or irregular size. Vacuum is also employed as well as standoffs. The interior chamber of this fixture is provided with a quick opening lever plate that is manipulated to uncover an aperture and bring the interior of the fixture to atmospheric pressure.
Abstract:
This invention provides an apparatus and method of setting up apparatus for the automatic cutting and/or shaping of IC components carried in a tubular carrier and advanced for processing by gravity. A base plate is disposed at an angle of approximately forty degrees to the horizontal and provides a supporting means for gravitational feeding of these components from a removable U-shaped retainer to a guide and then to a die station. At this die station a resiliently tired feed wheel engages the body of the IC component which is metered and advanced with an intermittent motion. This motion is provided in a timed relationship with two rotating shafts which have pins moved in a precise orbit around a shaft centerline. These pins are one-hundred-eighty degrees out-of-phase with each other. The rotated feed wheel and attached tire are intermittently moved in a strict timed relationship to the movement of the two shafts by a one-way clutch driven by one of the shafts and by an eccentrically moved Pitman arm. The several stations in this apparatus retain these components by clamp means and manipulable thumb screws.