摘要:
A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a widest lateral opening that is near a top surface of the semiconductor substrate. The widest lateral opening undercuts the gate structure.
摘要:
Disclosed is a system and method for aligning a free-space optical signal in an optical system having a light modulator having an array of pixels. In this system and method, certain pixels of the light modulator array are initially assigned for the modulation of the free-space optical signal. An alignment optical signal is generated and monitored, to determine whether the optical system components are properly aligned. The alignment optical signal is generated and propagated along a path that is substantially aligned with the path of the free-space optical signal. Detector elements are used to monitor the position (and shifts in the position) of the free-space optical signal. By reassigning the pixels of the array of the light modulator at the direction of a control system, it is possible for the light modulator to compensate for shifts in the alignment of the optical components within the system.
摘要:
An optical module having an integral optical waveguide with waveguide ports at each end. The optical waveguide receives an input light beam through a first waveguide port. The input light beam passes through the waveguide and is emitted from the second waveguide port, where it is reflected by the reflective surface. After being reflected by the reflective surface, the input light beam can be directed onto the surface of a DMD array, where the input light beam can be selectively reflected in a particular direction. The reflective surface may also comprise a diffractive grating, thereby enabling wavelength selective switching. In addition, the reflective surface may comprise a generally concave surface that converts a diverging input light beam into a generally collimated light beam, thereby facilitating more accurate selection and switching by the DMD array.
摘要:
Adding nitrogen to the Si—SiO2 interface at STI sidewalls increases carrier mobility in MOS transistors, but control of the amount of nitrogen has been problematic due to loss of the nitrogen during liner oxide growth. This invention discloses a method of forming STI regions which have a controllable layer of nitrogen atoms at the STI sidewall interface. Nitridation is performed on the STI sidewalls by exposure to a nitrogen-containing plasma, by exposure to NH3 gas at high temperatures, or by deposition of a nitrogen-containing thin film. Nitrogen is maintained at a level of 1.0·1015 to 3.0·1015 atoms/cm2, preferably 2.0·1015 to 2.4·1015 atoms/cm2, at the interface after growth of a liner oxide by adding nitrogen-containing gases to an oxidation ambient. The density of nitrogen is adjusted to maximize stress in a transistor adjacent to the STI regions. An IC fabricated according to the inventive method is also disclosed.
摘要翻译:在STI侧壁上向Si-SiO 2界面添加氮增加了MOS晶体管中的载流子迁移率,但是由于在衬里氧化物生长期间氮的损失,氮的量的控制是有问题的。 本发明公开了一种形成在STI侧壁界面具有可控氮原子层的STI区的方法。 通过暴露于含氮等离子体,通过在高温下暴露于NH 3气体,或通过沉积含氮薄膜,在STI侧壁上进行氮化。 在通过向氧化环境中加入含氮气体的衬垫氧化物生长之后的界面处,氮保持在1.0×10 15至3.0×10 15原子/ cm 2,优选2.0×10 15至2.4×10 15原子/ cm 2的水平。 调节氮的密度以使与STI区相邻的晶体管中的应力最大化。 还公开了根据本发明方法制造的IC。
摘要:
The present invention facilitates semiconductor fabrication by providing methods of fabrication that mitigate leakage and apply strain to channel regions of transistor devices. A semiconductor device having gate structures, channel regions, and active regions is provided (102). Extension regions of a first type of conductivity are formed within the active regions (104). Recesses are then formed within a portion of the active regions (106). Second type recess structures are formed (108) within the recesses, wherein the second type recess structures have a second type of conductivity opposite the first type and are comprised of a strain inducing material. Then, first type recess structures are formed (110) within the recesses and on the second type recess structures, wherein the first type recess structures have the first type of conductivity and are comprised of a strain inducing material.
摘要:
Adding nitrogen to the Si—SiO2 interface at STI sidewalls increases carrier mobility in MOS transistors, but control of the amount of nitrogen has been problematic due to loss of the nitrogen during liner oxide growth. This invention discloses a method of forming STI regions which have a controllable layer of nitrogen atoms at the STI sidewall interface. Nitridation is performed on the STI sidewalls by exposure to a nitrogen-containing plasma, by exposure to NH3 gas at high temperatures, or by deposition of a nitrogen-containing thin film. Nitrogen is maintained at a level of 1.0·1015 to 3.0·1015 atoms/cm2, preferably 2.0·1015 to 2.4·1015 atoms/cm2, at the interface after growth of a liner oxide by adding nitrogen-containing gases to an oxidation ambient. The density of nitrogen is adjusted to maximize stress in a transistor adjacent to the STI regions. An IC fabricated according to the inventive method is also disclosed.
摘要翻译:在STI侧壁上向Si-SiO 2界面添加氮增加了MOS晶体管中的载流子迁移率,但是由于在衬里氧化物生长期间氮的损失,氮的量的控制是有问题的。 本发明公开了一种形成在STI侧壁界面具有可控氮原子层的STI区的方法。 通过暴露于含氮等离子体,通过在高温下暴露于NH 3气体,或通过沉积含氮薄膜,在STI侧壁上进行氮化。 在通过向氧化环境中加入含氮气体的衬垫氧化物生长之后的界面处,氮气保持在1.0.1015至3.0.1015原子/ cm 2的水平,优选为2.0.1015至2.4.1015原子/ cm 2。 调节氮的密度以使与STI区相邻的晶体管中的应力最大化。 还公开了根据本发明方法制造的IC。
摘要:
A semiconductor device comprising a gate structure on a semiconductor substrate and a recessed-region in the semiconductor substrate. The recessed-region has a widest lateral opening that is near a top surface of the semiconductor substrate. The widest lateral opening undercuts the gate structure.
摘要:
The present invention facilitates semiconductor fabrication by providing methods of fabrication that tailor applied strain profiles to channel regions of transistor devices. A strain profile is selected for the channel regions (104). Recessed regions are formed (106) in active regions of a semiconductor device after formation of gate structures according to the selected strain profile. A recess etch (106) is employed to remove a surface portion of the active regions thereby forming the recess regions. Subsequently, a composition controlled recess structure is formed (108) within the recessed regions according to the selected strain profile. The recess structure is comprised of a strain inducing material, wherein one or more of its components are controlled and/or adjusted during formation (108) to tailor the applied vertical channel strain profile.
摘要:
A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a widest lateral opening that is near a top surface of the semiconductor substrate. The widest lateral opening undercuts the gate structure.
摘要:
A semiconductor device comprises a gate structure on a semiconductor substrate and a recessed region in the semiconductor substrate. The recessed region has a widest lateral opening that is near a top surface of the semiconductor substrate. The widest lateral opening undercuts the gate structure.