Pad Metallisation Process
    1.
    发明申请
    Pad Metallisation Process 审中-公开
    垫金属过程

    公开(公告)号:US20070269591A1

    公开(公告)日:2007-11-22

    申请号:US11660009

    申请日:2005-07-28

    IPC分类号: H05K3/24

    摘要: A method of treating an electronic component comprising an insulating substrate with conductive areas formed thereon to metallise the surface of at least one of the conductive areas comprises the steps of: a) applying a protective barrier to areas of the component which are not to be treated, b) cleaning the unprotected areas of the component, c) applying a layer of nickel to the cleaned areas, d) applying a layer of gold to the nickel coated areas, and e) removing the protective barrier. An electronic component comprising an insulating substrate with at least one conductive area formed thereon, wherein said at least one conductive area is coated with a layer of nickel, the layer of nickel being in turn coated with a layer of gold is also claimed.

    摘要翻译: 一种处理电子部件的方法,包括其上形成有导电区域的绝缘基板,以对至少一个导电区域的表面进行金属化,包括以下步骤:a)对不被处理的部件的区域施加保护屏障 ,b)清洁组件的未保护区域,c)将镍层施加到清洁的区域,d)在镀镍区域上涂一层金,e)去除保护屏障。 一种电子部件,包括其上形成有至少一个导电区域的绝缘基板,其中所述至少一个导电区域涂覆有镍层,还要求具有一层金的镍层。