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1.发明申请Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same 有权三维多芯片和三轴传感器及其制造方法相同公开(公告)号：US20070170228A1
公开(公告)日：2007-07-26
申请号：US11336336
申请日：2006-01-20
Applicant: Yang Zhao , Feiming Huang , Zongya Li
Inventor： Yang Zhao , Feiming Huang , Zongya Li
IPC: B23K20/00
CPC classification number: G01P15/18 , B81B7/0074 , G01D11/245 , G01P1/023 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
Abstract: Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe, at least one X- and Y-axis sensor die, at least one integrated circuit, and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding before the leadframe, X- and Y-axis sensor die(s), integrated circuit(s), and the pre-molding are encapsulated to provide a final molding.
Abstract translation: 公开了用于在x方向，y方向和z方向上提供三轴测量的装置及其制造方法。 这些装置包括引线框架，至少一个X轴和Y轴传感器芯片，至少一个集成电路和Z轴传感器。 Z轴传感器在引线框架，X轴和Y轴传感器模具，集成电路和预成型之间被封装成预成型，以提供最终的成型。
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公开(公告)号：US07461535B2
公开(公告)日：2008-12-09
申请号：US11365574
申请日：2006-03-01
Applicant: Feiming Huang , Haidong Liu
Inventor： Feiming Huang , Haidong Liu
CPC classification number: G01P15/008 , G01P21/00
Abstract: A system and method for testing and calibrating integrated sensor devices that improves the manufacturing test throughput of the devices. The system includes a tester, a temperature controller, and at least one probe station including a thermal chuck. The chuck can be heated to specified temperatures to achieve variable heating of a wafer, PCB, or pallet disposed thereon. The temperature controller adjusts the temperature of the chuck to a first specified level. The tester performs at least one first measurement of the output offset of each integrated sensor embodied as a die on the wafer, or as a device on the PCB or pallet. Next, the temperature controller adjusts the temperature of the chuck to a second specified level, and the tester performs at least one second measurement of the output offset of each integrated sensor at the second temperature level. The offset temperature coefficient (OTC) of each sensor is calculated based upon the output offset measurements performed at the first and second temperature levels, and optimal settings for calibrating the respective sensors are determined based upon the calculated OTC values. After the temperature of the chuck is brought back down to the first specified level, the tester programs the output offset calibration settings into each sensor.
Abstract translation: 用于测试和校准集成传感器设备的系统和方法，其提高了设备的制造测试吞吐量。 该系统包括测试器，温度控制器和至少一个包括热卡盘的探测台。 卡盘可以被加热到指定的温度以实现其上放置的晶片，PCB或托盘的可变加热。 温度控制器将卡盘的温度调节到第一指定水平。 测试仪对作为芯片上的芯片的每个集成传感器的输出偏移进行至少一次测量，或作为PCB或托盘上的器件执行至少一次测量。 接下来，温度控制器将卡盘的温度调节到第二指定水平，并且测试仪在第二温度水平下对每个集成传感器的输出偏移进行至少一次测量。 基于在第一和第二温度水平下执行的输出偏移测量来计算每个传感器的偏移温度系数（OTC），并且基于所计算的OTC值来确定用于校准各个传感器的最佳设置。 在将卡盘的温度恢复到第一指定水平之后，测试仪将输出偏移校准设置编程到每个传感器中。
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公开(公告)号：US20070204672A1
公开(公告)日：2007-09-06
申请号：US11365574
申请日：2006-03-01
Applicant: Feiming Huang , Haidong Liu
Inventor： Feiming Huang , Haidong Liu
IPC: G01R17/14
CPC classification number: G01P15/008 , G01P21/00
Abstract: A system and method for testing and calibrating integrated sensor devices that improves the manufacturing test throughput of the devices. The system includes a tester, a temperature controller, and at least one probe station including a thermal chuck. The chuck can be heated to specified temperatures to achieve variable heating of a wafer, PCB, or pallet disposed thereon. The temperature controller adjusts the temperature of the chuck to a first specified level. The tester performs at least one first measurement of the output offset of each integrated sensor embodied as a die on the wafer, or as a device on the PCB or pallet. Next, the temperature controller adjusts the temperature of the chuck to a second specified level, and the tester performs at least one second measurement of the output offset of each integrated sensor at the second temperature level. The offset temperature coefficient (OTC) of each sensor is calculated based upon the output offset measurements performed at the first and second temperature levels, and optimal settings for calibrating the respective sensors are determined based upon the calculated OTC values. After the temperature of the chuck is brought back down to the first specified level, the tester programs the output offset calibration settings into each sensor.
Abstract translation: 用于测试和校准集成传感器设备的系统和方法，其提高了设备的制造测试吞吐量。 该系统包括测试器，温度控制器和至少一个包括热卡盘的探测台。 卡盘可以被加热到指定的温度以实现其上放置的晶片，PCB或托盘的可变加热。 温度控制器将卡盘的温度调节到第一指定水平。 测试仪对作为芯片上的芯片的每个集成传感器的输出偏移进行至少一次测量，或作为PCB或托盘上的器件执行至少一次测量。 接下来，温度控制器将卡盘的温度调节到第二指定水平，并且测试仪在第二温度水平下对每个集成传感器的输出偏移进行至少一次测量。 基于在第一和第二温度水平下执行的输出偏移测量来计算每个传感器的偏移温度系数（OTC），并且基于所计算的OTC值来确定用于校准各个传感器的最佳设置。 在将卡盘的温度恢复到第一指定水平之后，测试仪将输出偏移校准设置编程到每个传感器中。
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4.发明授权Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same 有权三维多芯片和三轴传感器及其制造方法相同公开(公告)号：US07536909B2
公开(公告)日：2009-05-26
申请号：US11336336
申请日：2006-01-20
Applicant: Yang Zhao , Feiming Huang , Zongya Li
Inventor： Yang Zhao , Feiming Huang , Zongya Li
CPC classification number: G01P15/18 , B81B7/0074 , G01D11/245 , G01P1/023 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
Abstract: Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe, at least one X- and Y-axis sensor die, at least one integrated circuit, and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding before the leadframe, X- and Y-axis sensor die(s), integrated circuit(s), and the pre-molding are encapsulated to provide a final molding.
Abstract translation: 公开了用于在x方向，y方向和z方向上提供三轴测量的装置及其制造方法。 这些装置包括引线框架，至少一个X轴和Y轴传感器芯片，至少一个集成电路和Z轴传感器。 Z轴传感器在引线框架，X轴和Y轴传感器模具，集成电路和预成型之间被封装成预成型，以提供最终的成型。
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