公开(公告)号：US06319827B1

公开(公告)日：2001-11-20

申请号：US09720701

申请日：2001-03-01

申请人： Jacek Kowalski ,  Didier Serra ,  Frédéric Bertholio

发明人： Jacek Kowalski ,  Didier Serra ,  Frédéric Bertholio

IPC分类号： H01L2144

CPC分类号： G06K19/07747 ,  G06K19/07749 ,  G06K19/0775 ,  H01L23/49855 ,  H01L23/645 ,  H01L24/19 ,  H01L24/82 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H04B5/0087 ,  H01L2924/00 ,  H01L2924/00014

摘要： An electronic micromodule includes a support wafer, and an integrated circuit chip on the support wafer. The integrated circuit chip includes electrical connector areas, and at least one insulation layer is on the support wafer and the integrated circuit chip. The insulation layer includes openings to the electrical connector areas. At least one flat winding defining a coil is on the insulation layer and is connected to the electrical connector areas. A conducting material is in in each of the openings through the insulation layer for connecting the coil to the electrical zconnector areas.

摘要翻译： 电子微型模块包括支撑晶片和支撑晶片上的集成电路芯片。 集成电路芯片包括电连接器区域，并且至少一个绝缘层位于支撑晶片和集成电路芯片上。 绝缘层包括到电连接器区域的开口。 限定线圈的至少一个扁平绕组在绝缘层上并且连接到电连接器区域。 导电材料位于通过绝缘层的每个开口中，用于将线圈连接到电连接器区域。