公开(公告)号：US6058496A

公开(公告)日：2000-05-02

申请号：US955442

申请日：1997-10-21

申请人： Pamela Sue Gillis ,  Kevin William McCauley ,  Ronald J. Prilik ,  Donald Lawrence Wheater ,  Francis Woytowich, Jr.

发明人： Pamela Sue Gillis ,  Kevin William McCauley ,  Ronald J. Prilik ,  Donald Lawrence Wheater ,  Francis Woytowich, Jr.

IPC分类号： G01R31/317 ,  G01R31/28

CPC分类号： G01R31/317

摘要： A method and apparatus for testing a semiconductor chip includes providing the semiconductor chip with a common input/output (I/O) or bidirectional I/O pad. The I/O pad is electrically coupled to an off-chip driver (OCD) and an off-chip receiver (OCR). The OCD, I/O pad, and OCR are combined in a common input/output (CIO) or bidirectional I/O configuration. The I/O pad is effectively open circuited by an external tester and a performance parameter of the IO circuits connected to the open circuited pad is tested.

摘要翻译： 用于测试半导体芯片的方法和装置包括为半导体芯片提供公共输入/输出（I / O）或双向I / O焊盘。 I / O焊盘电耦合到片外驱动器（OCD）和芯片外接收器（OCR）。 OCD，I / O焊盘和OCR组合在通用输入/输出（CIO）或双向I / O配置中。 I / O焊盘由外部测试仪有效地断开，测试连接到开路焊盘的IO电路的性能参数。