Scan-bypass architecture without additional external latches
    1.
    发明授权
    Scan-bypass architecture without additional external latches 失效
    扫描旁路架构,无需额外的外部锁存器

    公开(公告)号:US5925143A

    公开(公告)日:1999-07-20

    申请号:US857974

    申请日:1997-05-16

    摘要: A scan architecture for testing integrated circuit chips containing scannable memory devices, such as register arrays, is operable in a bypass mode during which only a small portion of the memory cells in each device or array is inserted in the scan path to substantially reduce scan path length, test time and test data volume during testing of other logic components in the circuit chip. Additional decoder logic is employed to select a small number of words in the device or array during the scan-bypass mode, and multiplexor circuitry removes the bypassed words from the scan path. By leaving the small number of the register array words in the scan path, observability of logic upstream of the array, and controllability of logic downstream of the array, is preserved during the bypass mode without the need for additional shift register latches and other external logic components.

    摘要翻译: 用于测试包含可扫描存储器设备(诸如寄存器阵列)的集成电路芯片的扫描架构可在旁路模式中操作,在该旁路模式期间,每个器件或阵列中只有一小部分存储器单元插入到扫描路径中以基本上减少扫描路径 电路芯片中其他逻辑元件测试期间的长度,测试时间和测试数据量。 采用附加解码器逻辑在扫描旁路模式期间在器件或阵列中选择少量字,并且多路复用器电路从扫描路径中去除旁路字。 通过将少量的寄存器阵列字留在扫描路径中,在旁路模式期间保留阵列上游逻辑的可观察性和阵列下游逻辑的可控性,而不需要额外的移位寄存器锁存器和其他外部逻辑 组件。

    Self-timed AC CIO wrap method and apparatus
    4.
    发明授权
    Self-timed AC CIO wrap method and apparatus 失效
    自定义AC CIO包装方法和装置

    公开(公告)号:US6058496A

    公开(公告)日:2000-05-02

    申请号:US955442

    申请日:1997-10-21

    IPC分类号: G01R31/317 G01R31/28

    CPC分类号: G01R31/317

    摘要: A method and apparatus for testing a semiconductor chip includes providing the semiconductor chip with a common input/output (I/O) or bidirectional I/O pad. The I/O pad is electrically coupled to an off-chip driver (OCD) and an off-chip receiver (OCR). The OCD, I/O pad, and OCR are combined in a common input/output (CIO) or bidirectional I/O configuration. The I/O pad is effectively open circuited by an external tester and a performance parameter of the IO circuits connected to the open circuited pad is tested.

    摘要翻译: 用于测试半导体芯片的方法和装置包括为半导体芯片提供公共输入/输出(I / O)或双向I / O焊盘。 I / O焊盘电耦合到片外驱动器(OCD)和芯片外接收器(OCR)。 OCD,I / O焊盘和OCR组合在通用输入/输出(CIO)或双向I / O配置中。 I / O焊盘由外部测试仪有效地断开,测试连接到开路焊盘的IO电路的性能参数。