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公开(公告)号：US07836566B1
公开(公告)日：2010-11-23
申请号：US12764700
申请日：2010-04-21
Applicant: Roy H. Olsson , Ihab F. El-Kady , Frederick McCormick , James G. Fleming , Carol Fleming, legal representative
Inventor： Roy H. Olsson , Ihab F. El-Kady , Frederick McCormick , James G. Fleming
Abstract: A microfabricated bulk wave acoustic bandgap device comprises a periodic two-dimensional array of scatterers embedded within the matrix material membrane, wherein the scatterer material has a density and/or elastic constant that is different than the matrix material and wherein the periodicity of the array causes destructive interference of the acoustic wave within an acoustic bandgap. The membrane can be suspended above a substrate by an air or vacuum gap to provide acoustic isolation from the substrate. The device can be fabricated using microelectromechanical systems (MEMS) technologies. Such microfabricated bulk wave phononic bandgap devices are useful for acoustic isolation in the ultrasonic, VHF, or UHF regime (i.e., frequencies of order 1 MHz to 10 GHz and higher, and lattice constants of order 100 μm or less).
Abstract translation: 微制造体声波带隙装置包括嵌入在基质材料膜内的散射体的周期性二维阵列，其中散射体材料具有与基质材料不同的密度和/或弹性常数，并且其中阵列的周期性引起 声波在声带隙内的破坏性干扰。 膜可以通过空气或真空间隙悬浮在基底上方，以提供与基底的声学隔离。 该器件可以使用微机电系统（MEMS）技术制造。 这样的微制造体声波带隙设备可用于超声波，VHF或UHF方式（即1MHz至10GHz及更高等级的频率和等级为100μm以下的晶格常数）的声学隔离。
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公开(公告)号：US20050018972A1
公开(公告)日：2005-01-27
申请号：US09749285
申请日：2000-12-26
Applicant: Gene Anderson , Marcelino Armendariz , Johnny Baca , Robert Bryan , Richard Carson , Edwin Duckett , Frederick McCormick , Gregory Miller , David Peterson , Terrance Smith
Inventor： Gene Anderson , Marcelino Armendariz , Johnny Baca , Robert Bryan , Richard Carson , Edwin Duckett , Frederick McCormick , Gregory Miller , David Peterson , Terrance Smith
CPC classification number: G02B6/4277 , G02B6/421 , G02B6/4249 , G02B6/4269 , G02B6/4281 , G02B6/4283 , G02B6/4286 , G02B6/4292 , H05K1/189
Abstract: This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heat that is generated from the flexible printed circuit board.
Abstract translation: 本发明涉及一种光发射器，接收器或收发器模块，更具体地，涉及一种用于将第一光学连接器连接到第二光学连接器的装置。 所述装置包括：（1）具有至少第一端和至少第二端的壳体，所述壳体的第一端能够接收第一光学连接器，并且壳体的第二端能够接收第二光学连接器 ; （2）从壳体的第一端延伸到壳体的第二端的纵向腔; 和（3）包括壳体的至少一部分的电磁屏蔽。 本发明还涉及一种用于容纳柔性印刷电路板的装置，该装置包括：（1）至少具有第一表面和第二表面的安装结构; （2）沿着安装结构的第一和第二表面的对准脊，对准脊起到对准和固定柔性印刷电路板的作用，所述柔性印刷电路板缠绕并附接到安装结构的第一和第二表面; 和（3）适于安装结构的一系列散热脊，散热脊用于散发由柔性印刷电路板产生的热量。
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公开(公告)号：US07733198B1
公开(公告)日：2010-06-08
申请号：US11748832
申请日：2007-05-15
Applicant: Roy H. Olsson , Ihab F. El-Kady , Frederick McCormick , James G. Fleming , Carol Fleming, legal representative
Inventor： Roy H. Olsson , Ihab F. El-Kady , Frederick McCormick , James G. Fleming
IPC: H03H9/00
Abstract: A microfabricated bulk wave acoustic bandgap device comprises a periodic two-dimensional array of scatterers embedded within the matrix material membrane, wherein the scatterer material has a density and/or elastic constant that is different than the matrix material and wherein the periodicity of the array causes destructive interference of the acoustic wave within an acoustic bandgap. The membrane can be suspended above a substrate by an air or vacuum gap to provide acoustic isolation from the substrate. The device can be fabricated using microelectromechanical systems (MEMS) technologies. Such microfabricated bulk wave phononic bandgap devices are useful for acoustic isolation in the ultrasonic, VHF, or UHF regime (i.e., frequencies of order 1 MHz to 10 GHz and higher, and lattice constants of order 100 μm or less).
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