公开(公告)号：US5571417A

公开(公告)日：1996-11-05

申请号：US365088

申请日：1994-12-28

申请人： Anilkumar C. Bhatt ,  Gary S. Ksenak ,  Kostas I. Papathomas ,  James A. Shurtleff ,  Jerome J. Wagner

发明人： Anilkumar C. Bhatt ,  Gary S. Ksenak ,  Kostas I. Papathomas ,  James A. Shurtleff ,  Jerome J. Wagner

IPC分类号： G03F7/32 ,  G03F7/42 ,  C02F3/02

CPC分类号： G03F7/422 ,  G03F7/325 ,  G03F7/425 ,  Y10S210/908 ,  Y10S210/909

摘要： A method is disclosed for using the simple, environmentally-friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers. Following removal of the developers and strippers, any residual monomers or polymers of the resist or solder mask as well as residual developing solution and stripping solution are rinsed from the printed circuit package. A method is also disclosed for treating the combined developer and stripper rinse effluents in an activated biomass to reduce the biological oxygen demand of the developer/stripper/resist/solder mask waste streams.

摘要翻译： 公开了一种使用简单的，环境友好的有机化合物γ-丁内酯和苄醇来开发和剥离自由基引发的可加成聚合抗蚀剂，阳离子固化的抗蚀剂和焊接掩模和Vacrel光致抗蚀剂的方法。 在所有情况下，显影剂和脱模剂包括γ-丁内酯或苄醇。 显影剂和脱模剂任选地还包括少量甲醇，乙醇，异丙醇，丙二醇单甲基乙酸酯，乙二醇单甲醚，甲酰胺，硝基甲烷，环氧丙烷或甲基乙基酮，丙酮和水。 在光刻图案的抗蚀剂或焊接掩模的显影期间，未聚合的区域溶解在所公开的显影剂中。 在剥离抗蚀剂或焊接掩模期间，聚合区域从公开的剥离器中的电路板脱粘。 在除去显影剂和剥离剂之后，从印刷电路封装中冲洗抗蚀剂或焊料掩模的任何残留单体或聚合物以及残留的显影溶液和剥离溶液。 还公开了一种用于处理活性生物质中的组合的显影剂和汽提漂洗废液以减少显影剂/汽提器/抗蚀剂/阻燃剂/焊料掩模废物流的生物需氧量的方法。

公开(公告)号：US5637442A

公开(公告)日：1997-06-10

申请号：US554639

申请日：1995-11-06

申请人： Anilkumar C. Bhatt ,  Gary S. Ksenak ,  Kostas I. Papathomas ,  James A. Shurtleff ,  Jerome J. Wagner

发明人： Anilkumar C. Bhatt ,  Gary S. Ksenak ,  Kostas I. Papathomas ,  James A. Shurtleff ,  Jerome J. Wagner

IPC分类号： G03F7/32 ,  G03F7/42 ,  B01D53/72 ,  B01D53/14 ,  G03F7/30

CPC分类号： G03F7/422 ,  G03F7/325 ,  G03F7/425 ,  Y10S210/908 ,  Y10S210/909

摘要： A method is disclosed for using the simple, environmentally friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers. Following removal of the developers and strippers, any residual monomers or polymers of the resist or solder mask as well as residual developing solution and stripping solution are rinsed from the printed circuit package. A method is also disclosed for treating the combined developer and stripper rinse effluents in an activated biomass to reduce the biological oxygen demand of the developer/stripper/resist/solder mask waste streams.

摘要翻译： 公开了一种使用简单的，环境友好的有机化合物γ-丁内酯和苄醇来开发和剥离自由基引发的可加成聚合抗蚀剂，阳离子固化的抗蚀剂和焊接掩模和Vacrel光致抗蚀剂的方法。 在所有情况下，显影剂和脱模剂包括γ-丁内酯或苄醇。 显影剂和脱模剂任选地还包括少量甲醇，乙醇，异丙醇，丙二醇单甲基乙酸酯，乙二醇单甲醚，甲酰胺，硝基甲烷，环氧丙烷或甲基乙基酮，丙酮和水。 在光刻图案的抗蚀剂或焊接掩模的显影期间，未聚合的区域溶解在所公开的显影剂中。 在剥离抗蚀剂或焊接掩模期间，聚合区域从公开的剥离器中的电路板脱粘。 在除去显影剂和剥离剂之后，从印刷电路封装中冲洗抗蚀剂或焊料掩模的任何残留单体或聚合物以及残留的显影溶液和剥离溶液。 还公开了一种用于处理活性生物质中的组合的显影剂和汽提漂洗废液以减少显影剂/汽提器/抗蚀剂/阻燃剂/焊料掩模废物流的生物需氧量的方法。