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1.发明授权Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol 失效用于处理含有抗蚀剂或焊接掩模和γ-丁内酯或苄醇的光刻显影剂和汽提废料流的方法
公开(公告)号：US5637442A
公开(公告)日：1997-06-10
申请号：US554639
申请日：1995-11-06
申请人： Anilkumar C. Bhatt , Gary S. Ksenak , Kostas I. Papathomas , James A. Shurtleff , Jerome J. Wagner
发明人： Anilkumar C. Bhatt , Gary S. Ksenak , Kostas I. Papathomas , James A. Shurtleff , Jerome J. Wagner
CPC分类号： G03F7/422 , G03F7/325 , G03F7/425 , Y10S210/908 , Y10S210/909
摘要： A method is disclosed for using the simple, environmentally friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers. Following removal of the developers and strippers, any residual monomers or polymers of the resist or solder mask as well as residual developing solution and stripping solution are rinsed from the printed circuit package. A method is also disclosed for treating the combined developer and stripper rinse effluents in an activated biomass to reduce the biological oxygen demand of the developer/stripper/resist/solder mask waste streams.
摘要翻译： 公开了一种使用简单的，环境友好的有机化合物γ-丁内酯和苄醇来开发和剥离自由基引发的可加成聚合抗蚀剂，阳离子固化的抗蚀剂和焊接掩模和Vacrel光致抗蚀剂的方法。 在所有情况下，显影剂和脱模剂包括γ-丁内酯或苄醇。 显影剂和脱模剂任选地还包括少量甲醇，乙醇，异丙醇，丙二醇单甲基乙酸酯，乙二醇单甲醚，甲酰胺，硝基甲烷，环氧丙烷或甲基乙基酮，丙酮和水。 在光刻图案的抗蚀剂或焊接掩模的显影期间，未聚合的区域溶解在所公开的显影剂中。 在剥离抗蚀剂或焊接掩模期间，聚合区域从公开的剥离器中的电路板脱粘。 在除去显影剂和剥离剂之后，从印刷电路封装中冲洗抗蚀剂或焊料掩模的任何残留单体或聚合物以及残留的显影溶液和剥离溶液。 还公开了一种用于处理活性生物质中的组合的显影剂和汽提漂洗废液以减少显影剂/汽提器/抗蚀剂/阻燃剂/焊料掩模废物流的生物需氧量的方法。
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2.发明授权Method for treating photolithographic developer and stripper waste streams containing resist or solder mask and gamma butyrolactone or benzyl alcohol 失效用于处理含有抗蚀剂或焊接掩模和γ-丁内酯或苄醇的光刻显影剂和汽提废料流的方法
公开(公告)号：US5571417A
公开(公告)日：1996-11-05
申请号：US365088
申请日：1994-12-28
申请人： Anilkumar C. Bhatt , Gary S. Ksenak , Kostas I. Papathomas , James A. Shurtleff , Jerome J. Wagner
发明人： Anilkumar C. Bhatt , Gary S. Ksenak , Kostas I. Papathomas , James A. Shurtleff , Jerome J. Wagner
CPC分类号： G03F7/422 , G03F7/325 , G03F7/425 , Y10S210/908 , Y10S210/909
摘要： A method is disclosed for using the simple, environmentally-friendly organic compounds gamma-butyrolactone and benzyl alcohol to develop and to strip free radical-initiated, addition polymerizable resists, cationically cured resists and solder masks and Vacrel photoresists. In all cases the developers and strippers include gamma butyrolactone or benzyl alcohol. The developers and strippers optionally also include a minor amount of methanol, ethanol, isopropyl alcohol, propylene glycol monomethylacetate, ethylene glycol monomethyl ether, formamide, nitromethane, propylene oxide, or methyl ethyl ketone, acetone and water. During development of the photopatterned resist or solder mask, the unpolymerized regions are dissolved in the disclosed developers. During stripping of the resist or solder mask, the polymerized regions are debonded from a circuit board in the disclosed strippers. Following removal of the developers and strippers, any residual monomers or polymers of the resist or solder mask as well as residual developing solution and stripping solution are rinsed from the printed circuit package. A method is also disclosed for treating the combined developer and stripper rinse effluents in an activated biomass to reduce the biological oxygen demand of the developer/stripper/resist/solder mask waste streams.
摘要翻译： 公开了一种使用简单的，环境友好的有机化合物γ-丁内酯和苄醇来开发和剥离自由基引发的可加成聚合抗蚀剂，阳离子固化的抗蚀剂和焊接掩模和Vacrel光致抗蚀剂的方法。 在所有情况下，显影剂和脱模剂包括γ-丁内酯或苄醇。 显影剂和脱模剂任选地还包括少量甲醇，乙醇，异丙醇，丙二醇单甲基乙酸酯，乙二醇单甲醚，甲酰胺，硝基甲烷，环氧丙烷或甲基乙基酮，丙酮和水。 在光刻图案的抗蚀剂或焊接掩模的显影期间，未聚合的区域溶解在所公开的显影剂中。 在剥离抗蚀剂或焊接掩模期间，聚合区域从公开的剥离器中的电路板脱粘。 在除去显影剂和剥离剂之后，从印刷电路封装中冲洗抗蚀剂或焊料掩模的任何残留单体或聚合物以及残留的显影溶液和剥离溶液。 还公开了一种用于处理活性生物质中的组合的显影剂和汽提漂洗废液以减少显影剂/汽提器/抗蚀剂/阻燃剂/焊料掩模废物流的生物需氧量的方法。
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公开(公告)号：US5310428A
公开(公告)日：1994-05-10
申请号：US994868
申请日：1992-12-22
CPC分类号： G03F7/3092
摘要： Disclosed is a method of thermally stabilizing an effluent stream from an industrial process, such as a photolithographic process, to allow thermally manageable recovery of the solvent. In the separation and recovery process the solvent is exposed to temperatures that can cause polymerization of the relatively small amounts of monomer still contained therein. This polymerization is an exothermic polymerization, which can accelerate the polymerization of the remaining monomer, potentially causing a thermally initiated, exothermic, run away polymerization. Run away, thermally initiated, exothermic polymerization can materially degrade the solvent. The thermally initiated, run away exothermic reaction is inhibited by the inclusion of a thermal stabilizer or polymerization inhibitor.
摘要翻译： 公开了一种热稳定来自工业过程（例如光刻工艺）的流出物流的方法，以允许溶剂的热处理回收。 在分离和回收过程中，溶剂暴露于可能导致其中仍然含有的相对少量单体的聚合的温度。 该聚合是放热聚合，其可以加速剩余单体的聚合，潜在地引起热引发的放热聚合。 逃逸，热引发，放热聚合可能会使溶剂物理降解。 通过包含热稳定剂或阻聚剂来抑制热引发的，逃逸的放热反应。
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4.发明授权Method of making same low moisture absorptive circuitized substrave with reduced thermal expansion 有权制造具有降低的热膨胀的相同的低吸湿电路化子串的方法公开(公告)号：US07416972B2
公开(公告)日：2008-08-26
申请号：US11730942
申请日：2007-04-05
IPC分类号： H01L21/4763
CPC分类号： H01L23/3735 , H01L23/145 , H01L23/3733 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2224/16225 , H01L2924/15311 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068
摘要： A method of making a circuitized substrate including a composite layer including a first dielectric sub-layer including a plurality of fibers having a low coefficient of thermal expansion and a second dielectric sub-layer of a low moisture absorptivity resin, the second dielectric sub-layer not including continuous or semi-continuous fibers or the like as part thereof. The substrate further includes at least one electrically conductive layer as part thereof.
摘要翻译： 一种制造电路化基板的方法，所述电路化基板包括复合层，所述复合层包括具有低热膨胀系数的多个纤维的第一介电子层和低吸湿性树脂的第二介电子层，所述第二介电子层 不包括连续或半连续纤维等作为其一部分。 衬底还包括至少一个作为其一部分的导电层。
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5.发明申请Multilayered circuitized substrate with p-aramid dielectric layers and method of making same 失效具有对芳族聚酰胺介电层的多层电路基板及其制造方法公开(公告)号：US20080191353A1
公开(公告)日：2008-08-14
申请号：US12081042
申请日：2008-04-10
IPC分类号： H01L23/485 , H05K3/30
CPC分类号： H01L23/145 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2924/0002 , H01L2924/12044 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068 , Y10T29/4913 , Y10T156/10 , H01L2924/00
摘要： A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
摘要翻译： 一种多层电路化基板，包括多个介电层，每个电介质层由浸渍有不含卤素的低吸湿性树脂的对芳族聚酰胺纸构成，所述不含卤素的低吸湿性树脂包括无机填料，但不包括连续或半连续的玻璃纤维作为其一部分， 电路层位于第一介电层上。 还提供了制造该基板的方法。
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公开(公告)号：US06199751B1
公开(公告)日：2001-03-13
申请号：US09533196
申请日：2000-03-23
IPC分类号： B23K2000
CPC分类号： H01L24/31 , B23K35/0244 , B23K35/26 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29409 , H01L2224/29411 , H01L2224/8319 , H01L2224/838 , H01L2924/01006 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0781 , H01L2924/14 , H05K3/321 , H05K2201/0218 , H05K2203/0425 , Y10T428/12014 , Y10T428/12181 , Y10T428/12569 , Y10T428/12646 , Y10T428/12889 , Y10T428/12896 , Y10T428/12903 , H01L2924/00 , H01L2924/00014
摘要： A technique of forming a metallurgical bond between pads on two surfaces is provided. A metal coating placed on each surface includes a first metal base layer and a second metal surface layer. The first and second metals include a low melting point constituent. A first ratio of the two metals forms a liquid phase with a second ratio of the two metals forming a solid phase. The volume of the base layer metal exceeds the volume necessary to form the solid phase between the base metal and the surface metal. Conductive metal particles are provided having a core metal and a coating metal dispersed in an uncured polymer material, at a volume fraction above the percolation threshold. The core metal and the coating metal together include a low melting point constituent. At a first ratio the components form a liquid phase and at a second ratio the two components form a solid phase. The polymer containing particles is placed between the two metal surfaces with the particles interfacing with each other and the surface layer of metal. The structure is heated to a temperature higher than the low melting liquid constituent to form a liquid phase which extends to include the surface of the pads and the surface of the particles, and thereafter form a solid phase by diffusion of the core material into the surface material and the base metal into the coating material.
摘要翻译： 提供了在两个表面上的焊盘之间形成冶金结合的技术。 放置在每个表面上的金属涂层包括第一金属基底层和第二金属表面层。 第一和第二种金属包括低熔点成分。 两种金属的第一比率形成液相，其中第二比例的两种金属形成固相。 基底层金属的体积超过在母材和表面金属之间形成固相所需的体积。 提供导电金属颗粒，其具有分散在未固化的聚合物材料中的芯金属和涂覆金属，其体积分数高于渗滤阈值。 核心金属和涂覆金属一起包括低熔点成分。 以第一比例，组分形成液相，并且以第二比例，两种组分形成固相。 含有聚合物的颗粒被放置在两个金属表面之间，其中颗粒彼此接合并且金属的表面层。 将该结构加热到比低熔点液体成分高的温度，形成液相，其延伸以包括焊盘的表面和颗粒的表面，然后通过将芯材扩散到表面中而形成固相 材料和贱金属进入涂料。
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公开(公告)号：US5656862A
公开(公告)日：1997-08-12
申请号：US59003
申请日：1993-05-06
CPC分类号： H01L24/81 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2224/81801 , H01L2224/83856 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01049 , H01L2924/0105 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H05K3/284 , H05K3/285 , H05K3/3431 , Y10T428/31504 , Y10T428/31547
摘要： Solder interconnection encapsulant, encapsulated structure and method for its fabrication and use, whereby the gap created by solder connections between a carrier substrate and a semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler, e.g., an aluminum nitride or aluminum oxide filler, having a maximum particle size of 31 microns.
摘要翻译： 焊接互连密封剂，封装结构及其制造和使用方法，由此通过固化含有脂环族聚环氧化物和/或可固化氰酸酯的制剂获得的组合物填充载体基底和半导体器件之间的焊料连接所产生的间隙，或 其预聚物; 填料，例如氮化铝或氧化铝填料，其最大粒度为31微米。
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公开(公告)号：US5089440A
公开(公告)日：1992-02-18
申请号：US624973
申请日：1990-12-10
CPC分类号： H01L24/81 , H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01029 , H01L2924/0103 , H01L2924/0105 , H01L2924/01082 , H01L2924/01087 , H01L2924/01092 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H05K3/284 , H05K3/285 , H05K3/3431 , Y10T29/49146
摘要： Solder interconnection whereby the gap created by solder connections between a carrier substrate and semiconductor device is filled with a composition obtained from curing a preparation containing a cycloaliphatic polyepoxide and/or curable cyanate ester or prepolymer thereof; filler having a maximum particle size of 31 microns and being at least substantially free of alpha particle emissions.
摘要翻译： 焊接互连，由此通过固化含有脂环族聚环氧化物和/或可固化的氰酸酯或其预聚物的制剂获得的组合物填充由载体基底和半导体器件之间的焊料连接所产生的间隙; 填料的最大粒度为31微米，至少基本上不含α粒子的排放。
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公开(公告)号：US20110017498A1
公开(公告)日：2011-01-27
申请号：US12460975
申请日：2009-07-27
CPC分类号： H05K3/4676 , H05K3/0023 , H05K2201/0209
摘要： A photosensitive dielectric composition adapted for forming a dielectric film layer for use in a circuitized substrate is provided according to one embodiment of the invention, the composition including an epoxide bearing component including at least one polyepoxide resin curable by electromagnetic radiation, a cyanate ester, a flexibilizer, a nanostructured toughener, a photoinitiator in a predetermined amount by weight of the resin component, and a ceramic filler, the photosensitive dielectric composition forming the dielectric film layer having no solvent therein. In an alternative embodiment, a heat activated dielectric composition is provided which is curable by heat and includes an epoxide bearing component including at least one polyepoxide resin curable by heat, a cyanate ester, a flexibilizer, a nanostructured toughener, a heat activated curing agent for accelerating reaction of the cyanate ester and polyepoxide resin components, and a ceramic filler. Methods of making circuitized substrates from the above compositions are also provided.
摘要翻译： 根据本发明的一个实施方案提供一种适用于形成用于电路化基底的电介质膜层的光敏电介质组合物，该组合物包括含环氧化物的组分，该组分包括至少一种可通过电磁辐射固化的聚环氧树脂，氰酸酯， 增韧剂，纳米结构增韧剂，预定量的树脂组分的光引发剂和陶瓷填料，所述光敏介电组合物形成在其中不溶剂的电介质膜层。 在另一个实施方案中，提供热活化电介质组合物，其可通过加热固化，并且包括含环氧化物的组分，其包含至少一种可热固化的聚环氧树脂，氰酸酯，增韧剂，纳米结构增韧剂，热活化固化剂 加速氰酸酯和聚环氧树脂组分的反应，以及陶瓷填料。 还提供了从上述组合物制备电路化基底的方法。
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10.发明申请Multilayered circuitized substrate with p-aramid dielectric layers and method of making same 失效具有对芳族聚酰胺介电层的多层电路基板及其制造方法公开(公告)号：US20090173426A1
公开(公告)日：2009-07-09
申请号：US12380617
申请日：2009-03-02
CPC分类号： H01L23/145 , H01L23/3733 , H01L23/3735 , H01L23/4922 , H01L23/49822 , H01L23/49827 , H01L23/564 , H01L2924/0002 , H01L2924/12044 , H05K1/0366 , H05K1/0373 , H05K3/4602 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K3/4688 , H05K2201/0209 , H05K2201/0278 , H05K2201/068 , Y10T29/4913 , Y10T156/10 , H01L2924/00
摘要： A multilayered circuitized substrate including a plurality of dielectric layers each comprised of a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin including an inorganic filler but not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on a first of the dielectric layers. A method of making this substrate is also provided.
摘要翻译： 一种多层电路化基板，包括多个介电层，每个电介质层由浸渍有不含卤素的低吸湿性树脂的对芳族聚酰胺纸构成，所述不含卤素的低吸湿性树脂包括无机填料，但不包括连续或半连续的玻璃纤维作为其一部分， 电路层位于第一介电层上。 还提供了制造该基板的方法。
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