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公开(公告)号:US08748902B2
公开(公告)日:2014-06-10
申请号:US13106545
申请日:2011-05-12
申请人: Hyo Chul Yun , Geum Jae Jo , Young Chun Kim , Dong Hyun Cho
发明人: Hyo Chul Yun , Geum Jae Jo , Young Chun Kim , Dong Hyun Cho
IPC分类号: H01L31/12
CPC分类号: H05B33/14 , C09K11/584 , C09K11/7701 , C09K11/7731 , C09K11/7734 , C09K11/7739 , C09K11/7792 , H01L33/504 , H01L33/508 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , Y02B20/181 , H01L2924/00012
摘要: The present invention relates to a method of manufacturing an LED device which emits light of multi-wavelengths. The invention also relates to a method of manufacturing LED devices which emit light of high quality from throughout the whole surface in a uniform manner. In particular, utilizing the manufacturing method of LED devices which emit light of multi-wavelengths makes it possible to produce LED devices of high quality in a simple and cost-efficient way, not by using adhesives, but by a sputtering or PLD method. In addition, since the characteristics of the desired emitted light can be controlled by controlling the amount and type of the phosphors during the manufacture of sputtering targets, high quality LED devices can be manufactured easily.
摘要翻译: 本发明涉及发射多波长光的LED器件的制造方法。 本发明还涉及以均匀的方式从整个表面发射高质量的LED的LED器件的制造方法。 特别地,利用发射多波长的光的LED器件的制造方法使得可以以简单且成本有效的方式制造高质量的LED器件,而不是通过使用粘合剂,而是通过溅射或PLD方法。 此外,由于可以通过在溅射靶的制造期间控制荧光体的量和类型来控制所需发射光的特性,因此可以容易地制造高质量的LED器件。
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公开(公告)号:US20110273083A1
公开(公告)日:2011-11-10
申请号:US13106545
申请日:2011-05-12
申请人: Hyo Chul Yun , Geum Jae Jo , Young Chun Kim , Dong Hyun Cho
发明人: Hyo Chul Yun , Geum Jae Jo , Young Chun Kim , Dong Hyun Cho
IPC分类号: H01J1/62
CPC分类号: H05B33/14 , C09K11/584 , C09K11/7701 , C09K11/7731 , C09K11/7734 , C09K11/7739 , C09K11/7792 , H01L33/504 , H01L33/508 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , Y02B20/181 , H01L2924/00012
摘要: The present invention relates to a method of manufacturing an LED device which emits light of multi-wavelengths. The invention also relates to a method of manufacturing LED devices which emit light of high quality from throughout the whole surface in a uniform manner. In particular, utilizing the manufacturing method of LED devices which emit light of multi-wavelengths makes it possible to produce LED devices of high quality in a simple and cost-efficient way, not by using adhesives, but by a sputtering or PLD method. In addition, since the characteristics of the desired emitted light can be controlled by controlling the amount and type of the phosphors during the manufacture of sputtering targets, high quality LED devices can be manufactured easily.
摘要翻译: 本发明涉及发射多波长光的LED器件的制造方法。 本发明还涉及以均匀的方式从整个表面发射高质量的LED的LED器件的制造方法。 特别地,利用发射多波长的光的LED器件的制造方法使得可以以简单且成本有效的方式制造高质量的LED器件,而不是通过使用粘合剂,而是通过溅射或PLD方法。 此外,由于可以通过在溅射靶的制造期间控制荧光体的量和类型来控制所需发射光的特性,因此可以容易地制造高质量的LED器件。
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公开(公告)号:US07965036B2
公开(公告)日:2011-06-21
申请号:US11621493
申请日:2007-01-09
申请人: Hyo Chul Yun , Geum Jae Jo , Young Chun Kim , Dong Hyun Cho
发明人: Hyo Chul Yun , Geum Jae Jo , Young Chun Kim , Dong Hyun Cho
IPC分类号: H01J1/62
CPC分类号: H05B33/14 , C09K11/584 , C09K11/7701 , C09K11/7731 , C09K11/7734 , C09K11/7739 , C09K11/7792 , H01L33/504 , H01L33/508 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , Y02B20/181 , H01L2924/00012
摘要: The present invention relates to a method of manufacturing an LED device which emits light of multi-wavelengths. The invention also relates to a method of manufacturing LED devices which emit light of high quality from throughout the whole surface in a uniform manner. In particular, utilizing the manufacturing method of LED devices which emit light of multi-wavelengths makes it possible to produce LED devices of high quality in a simple and cost-efficient way, not by using adhesives, but by a sputtering or PLD method. In addition, since the characteristics of the desired emitted light can be controlled by controlling the amount and type of the phosphors during the manufacture of sputtering targets, high quality LED devices can be manufactured easily.
摘要翻译: 本发明涉及发射多波长光的LED器件的制造方法。 本发明还涉及以均匀的方式从整个表面发射高质量的LED的LED器件的制造方法。 特别地,利用发射多波长的光的LED器件的制造方法使得可以以简单且成本有效的方式制造高质量的LED器件,而不是通过使用粘合剂,而是通过溅射或PLD方法。 此外,由于可以通过在溅射靶的制造期间控制荧光体的量和类型来控制所需发射光的特性,因此可以容易地制造高质量的LED器件。
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