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公开(公告)号:US12132154B2
公开(公告)日:2024-10-29
申请号:US17483118
申请日:2021-09-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Dongkuk Lee , Daesup Kim , Dongmyung Shin , Wooseok Jang , Sunhwan Hwang
CPC classification number: H01L33/504 , H01L33/0095 , H01L33/60 , H01L33/62 , H01L2933/0041
Abstract: A semiconductor light emitting device is provided. The device includes: an LED chip having a lower surface, an upper surface, and a side surface between the upper surface and the lower surface; first and second conductive bumps disposed on first and second conductive bumps provided on the lower surface; a first wavelength conversion layer having a first region provided on the upper surface of the LED chip and a second region which extends past the side surface of the LED chip; a second wavelength conversion layer having a first surface contacting the side surface of the LED chip, a second surface, a third surface connecting the first surface and the second surface, and contacting the second region, and a fourth surface located opposite to the third surface and inclined; and a reflective resin portion provided on the lower surface of the LED chip and the fourth surface.
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公开(公告)号:US12125951B2
公开(公告)日:2024-10-22
申请号:US17530543
申请日:2021-11-19
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Erik Johansson , Robert Fitzmorris , Kevin Wiese , James Wyckoff
CPC classification number: H01L33/504 , H01L25/167 , H01L33/005 , H01L33/54 , H01L33/56 , H01L2933/0041 , H01L2933/005
Abstract: A structure comprising a nanoparticle converting electromagnetic radiation of a first wavelength into electromagnetic radiation of a second wavelength range, an interlayer at least partially surrounding the nanoparticle, and an encapsulation at least partially surrounding the interlayer is specified, wherein the interlayer comprises a plurality of first amphiphilic ligands and a plurality of second amphiphilic ligands and the first ligands and the second ligands are intercalated.
Furthermore, an agglomerate comprising a plurality of structures, an optoelectronic device as well as methods for producing a structure and an agglomerate are disclosed.-
公开(公告)号:US20240325679A1
公开(公告)日:2024-10-03
申请号:US18739080
申请日:2024-06-10
Applicant: KORRUS, INC.
Inventor: Paul Kenneth PICKARD , Robert Harris , Qinghua Zeng
CPC classification number: A61M21/02 , H01L33/504 , A61M2021/0044 , A61M2205/587
Abstract: A light source comprising a pump LED for emitting a pump light having a peak wavelength of 420 to 430 nm, one or more wavelength converting materials configured for absorbing a portion of said pump light and converting said portion to converted light, and wherein emitted light is a combination of said converted light and said pump light, said emitted light having a first SPD between 380 and 780 nm having a first power, a second SPD between 440 and 490 nm having a second power, wherein said second power is no greater than 2% of said first power, and wherein said emitted light has a CRI of at least 85, an Rf of at least 60 a CIE whiteness of at least 70.
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公开(公告)号:US20240304764A1
公开(公告)日:2024-09-12
申请号:US18276022
申请日:2022-02-10
Inventor: Shozo OSHIO , Mitsuru NITTA , Ryosuke SHIGITANI
CPC classification number: H01L33/504 , C09K11/77348 , C09K11/7774 , C09K11/7776
Abstract: Disclosed is a light-emitting device provided with a solid-state light-emitting element and a phosphor and emits output light. The spectral distribution of the output light has a first light component and a second light component derived from fluorescence emitted by the phosphor, and has a first minimum value between the first light component and the second light component. The first light component is a fluorescent component having a maximum intensity value within a wavelength range of 560 nm or more and less than 700 nm. The second light component is a fluorescent component having a maximum intensity value within a wavelength range of 700 nm or more and less than 2500 nm. The maximum intensity value of the second light component is greater than that of the first light component. The first minimum value is less than 50% of the maximum intensity value of the second light component.
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公开(公告)号:US12087888B2
公开(公告)日:2024-09-10
申请号:US17603963
申请日:2020-04-14
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Manuela Peter
CPC classification number: H01L33/502 , H01L25/0753 , H01L27/156 , H01L33/42 , H01L33/504 , H01L33/30 , H01L33/32
Abstract: An optoelectronic component may include at least one light-emitting semiconductor layer sequence and at least one luminescence conversion layer having a transparent conductive oxide and at least one dopant for forming luminescence centers.
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公开(公告)号:US12087741B2
公开(公告)日:2024-09-10
申请号:US17055206
申请日:2019-05-08
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Koji Kusunoki , Yosuke Tsukamoto , Kensuke Yoshizumi
IPC: H01L25/075 , H01L27/12 , H01L29/786 , H01L33/50 , H01L33/58 , H01L33/62
CPC classification number: H01L25/0753 , H01L27/1225 , H01L29/78651 , H01L29/7869 , H01L33/504 , H01L33/58 , H01L33/62 , H01L2933/0041 , H01L2933/0058 , H01L2933/0066
Abstract: A display device with a high luminance, a high contrast, and low power consumption is provided. The display device includes a transistor, a light-emitting element, a coloring layer, a phosphor layer, a first electrode, and a second electrode. The light-emitting element is electrically connected to the first electrode and the second electrode, the first electrode is electrically connected to the transistor, and the second electrode is positioned on the same plane as the first electrode. The coloring layer is positioned over the light-emitting element, the phosphor layer is positioned between the light-emitting element and the coloring layer, and the phosphor layer, the light-emitting element, and the coloring layer include a region in which they overlap with one another. The light-emitting element includes a light-emitting diode chip, and the phosphor layer has a function of emitting light of a complementary color of an emission color of the light-emitting element.
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公开(公告)号:US20240290918A1
公开(公告)日:2024-08-29
申请号:US18403558
申请日:2024-01-03
Applicant: Saphlux, Inc.
IPC: H01L33/50 , H01L25/075 , H01L33/46
CPC classification number: H01L33/504 , H01L25/0753 , H01L33/46 , H01L2933/0025 , H01L2933/0041 , H01L2933/0091
Abstract: In accordance with one or more aspects of the present disclosure, a semiconductor device is provided. The semiconductor device may include: a plurality of light-emitting devices comprising a first light-emitting device, a second light-emitting device, and a third light-emitting device; and a light-conversion device with embedded quantum dots. In some embodiments, a first portion of the light-conversion device includes a first plurality of quantum dots for converting light produced by the first light-emitting device into light of a first color, and a second portion of the light-conversion device includes a second plurality of quantum dots for converting light produced by the second light-emitting device into light of a second color. The third light-emitting device emits light of a third color.
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公开(公告)号:US20240266482A1
公开(公告)日:2024-08-08
申请号:US18163391
申请日:2023-02-02
Applicant: CreeLED, Inc.
Inventor: Andre Pertuit , Michael Check , David Suich , Colin Blakely , Robert Wilcox
CPC classification number: H01L33/58 , H01L33/26 , H01L33/504
Abstract: Solid-state lighting devices including light-emitting diodes (LEDs) and more particularly material arrangements in cover structures for LEDs that tailor light emissions are disclosed. Material arrangements include light-filtering particles or ionic species that are integrated within materials of covers structures that cover LED chips within LED packages. Light-filtering materials may be configured to selectively filter one or more portions of light provided by LED chips and/or lumiphoric materials within LED packages. Dispersing light-filtering materials within covers structures provides protection and mechanical support for the light-filtering materials. Additionally, arrangements and concentrations of light-filtering materials within cover structures may be varied horizontally and/or vertically to tailor emission patterns of corresponding LED packages. Material arrangements include light-filtering species incorporated at an atomic level within cover structures. Further material arrangements include photochromic particles configured to proportionally scatter light based on relative intensities of light from LED chips.
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公开(公告)号:US12046627B2
公开(公告)日:2024-07-23
申请号:US17658960
申请日:2022-04-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Yong-Min Kwon , Geun-Woo Ko , Jung-Wook Lee , Jong-Hyun Lee , Pun-Jae Choi
CPC classification number: H01L27/156 , H01L21/02104 , H01L25/0753 , H01L33/504 , H01L33/56 , H01L33/60 , H01L33/62
Abstract: A semiconductor light-emitting device includes a plurality of light-emitting device structures separated from each other and arranged in a matrix form. A pad region at least partially surrounds the plurality of light-emitting device structures. The pad region is disposed outside of the plurality of light-emitting device structures. A partition structure is disposed on a first surface of the plurality of light-emitting device structures and is further disposed between adjacent light-emitting device structures of the plurality of light-emitting device structures. The partition structure defines a plurality of pixel spaces within the plurality of light-emitting device structures. A fluorescent layer is disposed on the first surface of the plurality of light-emitting device structures and fills each of the plurality of pixel spaces.
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公开(公告)号:US12040316B2
公开(公告)日:2024-07-16
申请号:US17546498
申请日:2021-12-09
Applicant: Shanghai Tianma Microelectronics Co., Ltd.
Inventor: Quanpeng Yu
IPC: H01L33/50 , H01L25/075 , H01L33/38 , H01L33/62
CPC classification number: H01L25/0753 , H01L33/382 , H01L33/62 , H01L33/504
Abstract: Provided are display panel and display device. Display panel includes first substrate, second substrate, bank layer on side of first substrate facing second substrate, color resistance layer on side of first substrate facing second substrate, and light-emitting elements. Bank layer includes bank structures defining bank openings. Color resistance layer includes color resistance modules spaced apart. Color resistance modules is disposed in correspondence to bank openings and include blue color resistance module. Light-emitting elements is disposed in correspondence to bank openings. Projection of light-emitting element on first substrate does not overlap projection of bank structure on first substrate. Bank structures include first bank structure and second bank structure. Blue color resistance module adjacent to at least one first bank structure. Width of the first bank structure is greater than width of the second bank structure. Bank structures designed with different widths facilitate mitigating the crosstalk of laterally-leaked light, enhancing display effect.
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