公开(公告)号：US20240313172A1

公开(公告)日：2024-09-19

申请号：US18576352

申请日：2022-07-05

申请人： ams-OSRAM International GmbH

发明人： Gunnar Petersen ,  Daniel Richter

IPC分类号： H01L33/50 ,  H01L21/66 ,  H01L33/00 ,  H01L33/46

CPC分类号： H01L33/508 ,  H01L33/0095 ,  H01L33/46 ,  H01L22/12 ,  H01L2933/0041 ,  H01L2933/0083

摘要： A includes A) providing a wafer having a plurality of semiconductor regions for each of the optoelectronic semiconductor chips, B) applying a color conversion layer directly onto the wafer, the color conversion layer being applied continuously over the plurality of the semiconductor regions, C) performing a color correction so that a color conversion strength of the color conversion layer is locally reduced and D) separating the wafer into the semiconductor chips, wherein the steps are performed in the recited order, and wherein the step C) includes one of the following three possibilities: 1) creating a plurality of cracks and/or bubbles within the color conversion layer, 2) delaminating the color conversion layer locally directly from an emission side of the semiconductor regions, or 3) performing a thickness reduction of the color conversion layer from a top surface, wherein the color conversion layer includes at least one intermediate layer, and wherein the intermediate layer is a mirror layer.

公开(公告)号：US12027651B2

公开(公告)日：2024-07-02

申请号：US17142964

申请日：2021-01-06

申请人： LUMILEDS LLC

发明人： Toni Lopez

IPC分类号： H01L33/50 ,  H01L33/00

CPC分类号： H01L33/505 ,  H01L33/005 ,  H01L33/508 ,  H01L2933/0041

摘要： A light-emitting device includes a substrate, a semiconductor diode structure, a wavelength-converting layer less than 50. microns thick with luminescent particles in an index-matched inorganic binder, optical sidewall coating, and an optical sidewall structure. The optical sidewall structure is interposed between substrate sidewalls and optical sidewall coating, and redirects side-propagating output light toward or within the wavelength-converting layer. The optical sidewall structure can be part of the wavelength-converting layer or part of an adhering layer between the substrate and the wavelength-converting layer.

公开(公告)号：US20240055565A1

公开(公告)日：2024-02-15

申请号：US18232593

申请日：2023-08-10

申请人： NINGBO SUNPU LED CO., LTD.

发明人： Yuanbao DU ,  Yaohua ZHANG ,  Guojun WANG ,  Fusheng CHEN ,  Xiaoqing ZHU ,  Qinghao ZHANG

IPC分类号： H01L33/50 ,  H01L25/075 ,  H01L33/52

CPC分类号： H01L33/508 ,  H01L25/0753 ,  H01L33/52 ,  H01L2933/005 ,  H01L2933/0041

摘要： An LED human centric lighting device includes a substrate, an LED light emitting chipset and at least two blue light chipsets with different color temperatures arranged on the substrate, a fluorescent colloid and an enclosure. The LED light emitting chipset includes multiple LED light emitting chips, and each of the blue light chipsets includes multiple blue light emitting chips with same color temperature. Each of the blue light chipsets forms a color temperature light emitting area, and the different color temperature light emitting areas are separated by the enclosure. The substrate is provided with a control circuit for controlling light emission of the corresponding color temperature light emitting area, and the fluorescent colloid is arranged in the enclosure. The LED light emitting chip and at least two blue light emitting chips with different color temperatures are assembled in the device, which can reduce a volume of the device.

公开(公告)号：US11854788B2

公开(公告)日：2023-12-26

申请号：US17203314

申请日：2021-03-16

申请人： X Display Company Technology Limited

发明人： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC分类号： H01L25/075 ,  G09G3/32 ,  H01L33/38 ,  H01L23/482 ,  H01L23/538 ,  G02F1/167 ,  H01L33/62 ,  H01L33/50 ,  H01L33/60 ,  G02B26/04 ,  H01L25/16 ,  H01L33/36 ,  H01L33/48 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K5/00 ,  G09G3/22 ,  H01L27/15 ,  F21V9/08 ,  H01L33/58 ,  F21Y105/10 ,  F21Y115/10 ,  F21Y113/13 ,  H01L33/20 ,  H01L33/40

CPC分类号： H01L25/0753 ,  F21V9/08 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/167 ,  H01L27/156 ,  H01L33/36 ,  H01L33/38 ,  H01L33/385 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L33/20 ,  H01L33/405 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

摘要： The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US11808436B2

公开(公告)日：2023-11-07

申请号：US17651891

申请日：2022-02-21

申请人： EPISTAR CORPORATION

发明人： Chi-Chih Pu ,  Chen-Hong Lee ,  Shih-Yu Yeh ,  Wei-Kang Cheng ,  Shyi-Ming Pan ,  Siang-Fu Hong ,  Chih-Shu Huang ,  Tzu-Hsiang Wang ,  Shih-Chieh Tang ,  Cheng-Kuang Yang

IPC分类号： F21V21/14 ,  H01L33/50 ,  H01L33/48 ,  H01L33/44 ,  F21K9/232 ,  F21V21/00 ,  H01L25/075 ,  F21V29/85 ,  F21V3/02 ,  F21V17/10 ,  F21V23/06 ,  H01L33/00 ,  F21Y107/00 ,  F21Y115/10 ,  H01L23/00

CPC分类号： F21V21/14 ,  F21K9/232 ,  F21V3/02 ,  F21V17/10 ,  F21V21/00 ,  F21V23/06 ,  F21V29/85 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/486 ,  H01L33/50 ,  H01L33/508 ,  F21Y2107/00 ,  F21Y2115/10 ,  H01L24/14 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L33/007 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/8592 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/45147 ,  H01L2924/00 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/48465 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/73204 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2924/00 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/12041 ,  H01L2924/00 ,  H01L2924/00011 ,  H01L2924/01015 ,  H01L2224/48465 ,  H01L2224/48227 ,  H01L2924/00

摘要： A light emitting apparatus, including: a first light emitting device with a first substrate having a first upper surface and first bottom surface, a plurality of first LED chips disposed on the first upper surface, emitting a light penetrating the first substrate, and a first wavelength conversion layer directly contacting the plurality of first LED chips and first upper surface, and a first shape in a cross-sectional view; a second wavelength conversion layer directly contacting the first bottom surface; a second shape in the cross-sectional view substantially the same as the first shape; a second light emitting device separated from the first light emitting device, including a second substrate and plurality of second LEDs disposed on the second substrate; a support base connected to the first light emitting device by a first angle and connected to the second light emitting device by a second angle; and a first support arranged between the support base and first light emitting device.

公开(公告)号：US11742463B2

公开(公告)日：2023-08-29

申请号：US17159528

申请日：2021-01-27

申请人： Lumileds LLC

发明人： Peter Josef Schmidt ,  Oleg Borisovich Shchekin ,  Walter Mayr ,  Hans-Helmut Bechtel ,  Danielle Chamberlin ,  Regina Mueller-Mach ,  Gerd Mueller

IPC分类号： H01L33/50

CPC分类号： H01L33/508 ,  H01L33/502 ,  H01L33/504 ,  H01L33/501

摘要： In a method according to embodiments of the invention, for a predetermined amount of light produced by a light emitting diode and converted by a phosphor layer comprising a host material and a dopant, and for a predetermined maximum reduction in efficiency of the phosphor at increasing excitation density, a maximum dopant concentration of the phosphor layer is selected.

公开(公告)号：US20230215993A1

公开(公告)日：2023-07-06

申请号：US17979600

申请日：2022-11-02

申请人： LG Display Co., Ltd.

发明人： Il-Soo Kim ,  YongSeok Kwak ,  KyuOh Kwon ,  SeungJun Lee

IPC分类号： H01L33/50 ,  H01L25/075

CPC分类号： H01L33/508 ,  H01L25/0753

摘要： A display device according to an embodiment of the present disclosure includes a substrate on which a plurality of sub-pixels are defined, a plurality of LEDs disposed in each of the plurality of sub-pixels, and a plurality of color conversion layers covering the plurality of LEDs. The plurality of color conversion layers each include a plurality of color conversion material layers that are stacked to be spaced apart from each other. Accordingly, according to the present disclosure, it is possible to minimize or reduce light lost inside the color conversion layer by separating the plurality of color conversion material layers from each other, and improve color conversion efficiency and luminance.

公开(公告)号：US11692677B2

公开(公告)日：2023-07-04

申请号：US17868677

申请日：2022-07-19

申请人： NICHIA CORPORATION

发明人： Yuichiro Tanda ,  Toshio Matsushita

IPC分类号： F21K9/232 ,  H01L33/62 ,  F21V9/32 ,  F21V9/38 ,  F21V13/14 ,  F21V9/30 ,  H05B33/04 ,  F21V29/70 ,  F21K9/235 ,  F21V3/02 ,  F21V19/00 ,  F21V31/00 ,  H01L25/075 ,  H01L33/50 ,  H01L33/54 ,  F21Y109/00 ,  F21Y101/00 ,  F21Y115/30 ,  F21Y115/10

CPC分类号： F21K9/232 ,  F21K9/235 ,  F21V3/02 ,  F21V9/30 ,  F21V9/32 ,  F21V9/38 ,  F21V13/14 ,  F21V19/006 ,  F21V29/70 ,  F21V31/005 ,  H01L25/0753 ,  H01L33/501 ,  H01L33/508 ,  H01L33/62 ,  H05B33/04 ,  F21Y2101/00 ,  F21Y2109/00 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0102 ,  H01L2924/01004 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/181 ,  H01L2224/73265 ,  H01L2224/32225 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2924/181 ,  H01L2924/00012

摘要： A light emitting device including a bulb having a side surface, a board elongated longer in a first direction than in a second direction perpendicular to the first direction, and a plurality of light emitting elements mounted on the board. Each of the plurality of light emitting elements has an upper surface and a lower surface opposite to the upper surface, where the lower surface is mounted on the board. The device includes a plurality of sets of metal plates and leads electrically connected to the plurality of light emitting elements, and a wavelength conversion member covering the light emitting elements and a portion of each of the metal plates. The board, the light emitting elements, the sets of metal plates and leads, and the wavelength conversion member are disposed in the bulb. The upper surface of each of the light emitting elements faces the side surface of the bulb.

公开(公告)号：US20190198723A1

公开(公告)日：2019-06-27

申请号：US16226313

申请日：2018-12-19

申请人： Lumileds LLC

发明人： Grigoriy BASIN ,  Mooi Guan NG ,  Lex Alan KOSOWSKY ,  Phillip BARTON

IPC分类号： H01L33/50 ,  H01L33/56 ,  C09K11/02 ,  H01L33/60

CPC分类号： H01L33/504 ,  C09K11/02 ,  H01L33/501 ,  H01L33/505 ,  H01L33/508 ,  H01L33/56 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/005

摘要： A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder filling the porous glass or silicon support structure.

公开(公告)号：US20190189679A1

公开(公告)日：2019-06-20

申请号：US16154949

申请日：2018-10-09

申请人： LG Display Co., Ltd.

发明人： YongSeok KWAK ,  Kiyong YANG ,  JinSu MOON ,  MyungWon SEO

IPC分类号： H01L27/15 ,  H01L25/18 ,  H01L33/00 ,  H01L33/50

CPC分类号： H01L27/15 ,  G09G3/32 ,  G09G3/3225 ,  H01L25/0753 ,  H01L25/18 ,  H01L27/1214 ,  H01L33/007 ,  H01L33/44 ,  H01L33/508

摘要： A light-emitting diode (LED) chip and a display device having the same are provided. A green LED is regrown on a blue LED to produce blue and green light, and a red phosphor is disposed on the blue or green LED to produce red light. Red light, green light, and blue light are to be produced using a single LED chip. The single LED chip forms three subpixels therein so as to facilitate a transfer process of the LED chip to a display panel. The LED chip is configured based on the blue, green, and blue LEDs so as to facilitate the fabrication and driving of the LED chip.