公开(公告)号：US07808086B2

公开(公告)日：2010-10-05

申请号：US12129297

申请日：2008-05-29

申请人： Akimi Saiki ,  Hiroyuki Shoji ,  Gousuke Takahashi ,  Noriyuki Hasegawa ,  Fumio Takano ,  Kouji Sato

发明人： Akimi Saiki ,  Hiroyuki Shoji ,  Gousuke Takahashi ,  Noriyuki Hasegawa ,  Fumio Takano ,  Kouji Sato

IPC分类号： H01L23/495

CPC分类号： H01L23/49548 ,  H01L21/4842 ,  H01L21/561 ,  H01L23/49503 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.

摘要翻译： 本发明包括安装半导体元件的多个安装部分，安装在每个安装部分上的半导体元件电连接的多个电极，连接多个安装部分的角部分和 其具有支撑安装部的悬挂引线片和连接多个电极的电极连接片，以及具有形成在引线框架的厚度方向上的凹部的半冲切部和形成在引线框的厚度方向上的突起 对应于凹部，并且被密封半导体元件的密封树脂材料覆盖。 用于在形成半冲切部的情况下分散应力的应力分散部设置在角部。

公开(公告)号：US20080296746A1

公开(公告)日：2008-12-04

申请号：US12129297

申请日：2008-05-29

申请人： Akimi SAIKI ,  Hiroyuki SHOJI ,  Gousuke TAKAHASHI ,  Noriyuki HASEGAWA ,  Fumio TAKANO ,  Kouji SATO

发明人： Akimi SAIKI ,  Hiroyuki SHOJI ,  Gousuke TAKAHASHI ,  Noriyuki HASEGAWA ,  Fumio TAKANO ,  Kouji SATO

IPC分类号： H01L23/495 ,  H01R43/00 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L21/4842 ,  H01L21/561 ,  H01L23/49503 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/27013 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention includes a plurality of mounting portions on which a semiconductor element is mounted, a plurality of electrodes to which the semiconductor elements that are mounted on each of the mounting portions are electrically connected, a corner portion which connects the plurality of mounting portions and which has a hanging lead piece that supports the mounting portions and an electrode connection piece that connects the plurality of electrodes, and a half-blanking portion that has a concave portion formed in a thickness direction of the lead frame and a protrusion formed at a position corresponding to the concave portion, and which is covered with a sealing resin material that seals the semiconductor element. A stress-dispersing portion for dispersing stress that arises, when the half-blanking portion is formed, is provided in the corner portion.

摘要翻译： 本发明包括安装半导体元件的多个安装部分，安装在每个安装部分上的半导体元件电连接的多个电极，连接多个安装部分的角部分和 其具有支撑安装部的悬挂引线片和连接多个电极的电极连接片，以及具有形成在引线框架的厚度方向上的凹部的半冲切部和形成在引线框的厚度方向上的突起 对应于凹部，并且被密封半导体元件的密封树脂材料覆盖。 用于在形成半冲切部的情况下分散应力的应力分散部设置在角部。