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公开(公告)号:US20100288261A1
公开(公告)日:2010-11-18
申请号:US12777576
申请日:2010-05-11
申请人: Gregory Fritz Jones
发明人: Gregory Fritz Jones
IPC分类号: F24B3/00
摘要: An expandable fire pit assembly including a first and second planar member. The first planar member and the second planar member include an upper edge, a lower edge, a first end having a tab member, and a second end having a slot. The tab member of the first planar member engages the slot of the second planar member and the tab member of the second planar member engages the slot of the first planar member, thereby interlocking the first planar member and the second planar member together forming a ring. The fire pit assembly can also include a gas burner connected to one of the planar members and is attachable to a gas supply source.
摘要翻译: 一种包括第一和第二平面构件的可展开的火坑组件。 第一平面构件和第二平面构件包括上边缘,下边缘,具有突片构件的第一端和具有槽的第二端。 第一平面构件的突片构件接合第二平面构件的狭槽,并且第二平面构件的突片构件接合第一平面构件的狭槽,从而将第一平面构件和第二平面构件互锁在一起形成环。 火坑组件还可以包括连接到平面构件中的一个的气体燃烧器,并且可附接到气体供应源。
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公开(公告)号:US20070265039A1
公开(公告)日:2007-11-15
申请号:US11762508
申请日:2007-06-13
申请人: Gregory Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
发明人: Gregory Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
IPC分类号: H04B1/38
CPC分类号: H04B1/08 , H04Q1/035 , H04Q1/116 , H04Q1/15 , H04Q2201/10 , H04Q2201/12 , H05K7/1425 , Y10T29/49826
摘要: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation structures and may accommodate a high density of the circuitry cards. Embodiments may include one surface with one or more ridges for rigidity and ventilation and fin slots for receiving circuit card guide fins. Embodiments may include a surface with knockouts for receiving circuit card guides. Embodiments may also include multiple bracket hole patterns for mounting brackets for different racks or for a single multi-rack bracket having more than one mounting hole pattern. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation structures of the chassis and includes some components chosen for low-power consumption or reduced flammability.
摘要翻译: 公开了一种底盘和相关通信电路卡。 底盘具有散热结构,并且可以容纳高密度的电路卡。 实施例可以包括具有用于刚性和通风的一个或多个脊的一个表面和用于接收电路卡引导片的翅片槽。 实施例可以包括具有用于接收电路卡引导件的基座的表面。 实施例还可以包括用于安装用于不同机架的支架的多个支架孔图案或具有多于一个安装孔图案的单个多齿条支架。 电路卡包括导体结构,例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风结构配合的一些组件,并且包括选择用于低功耗或降低可燃性的一些组件。
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