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公开(公告)号：US20070265039A1
公开(公告)日：2007-11-15
申请号：US11762508
申请日：2007-06-13
申请人： Gregory Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
发明人： Gregory Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
IPC分类号： H04B1/38
CPC分类号： H04B1/08 , H04Q1/035 , H04Q1/116 , H04Q1/15 , H04Q2201/10 , H04Q2201/12 , H05K7/1425 , Y10T29/49826
摘要： A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation structures and may accommodate a high density of the circuitry cards. Embodiments may include one surface with one or more ridges for rigidity and ventilation and fin slots for receiving circuit card guide fins. Embodiments may include a surface with knockouts for receiving circuit card guides. Embodiments may also include multiple bracket hole patterns for mounting brackets for different racks or for a single multi-rack bracket having more than one mounting hole pattern. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation structures of the chassis and includes some components chosen for low-power consumption or reduced flammability.
摘要翻译： 公开了一种底盘和相关通信电路卡。 底盘具有散热结构，并且可以容纳高密度的电路卡。 实施例可以包括具有用于刚性和通风的一个或多个脊的一个表面和用于接收电路卡引导片的翅片槽。 实施例可以包括具有用于接收电路卡引导件的基座的表面。 实施例还可以包括用于安装用于不同机架的支架的多个支架孔图案或具有多于一个安装孔图案的单个多齿条支架。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风结构配合的一些组件，并且包括选择用于低功耗或降低可燃性的一些组件。
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公开(公告)号：US20100195298A1
公开(公告)日：2010-08-05
申请号：US12758852
申请日：2010-04-13
申请人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
发明人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
CPC分类号： H04B1/08 , H04Q1/035 , H04Q1/116 , H04Q1/15 , H04Q2201/10 , H04Q2201/12 , H05K7/1425 , Y10T29/49826
摘要： A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation structures and may accommodate a high density of the circuitry cards. Embodiments may include one surface with one or more ridges for rigidity and ventilation and fin slots for receiving circuit card guide fins. Embodiments may include a surface with knockouts for receiving circuit card guides. Embodiments may also include multiple bracket hole patterns for mounting brackets for different racks or for a single multi-rack bracket having more than one mounting hole pattern. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation structures of the chassis and includes some components chosen for low-power consumption or reduced flammability.
摘要翻译： 公开了一种底盘和相关通信电路卡。 底盘具有散热结构，并且可以容纳高密度的电路卡。 实施例可以包括具有用于刚性和通风的一个或多个脊的一个表面和用于接收电路卡引导片的翅片槽。 实施例可以包括具有用于接收电路卡引导件的基座的表面。 实施例还可以包括用于安装用于不同机架的支架的多个支架孔图案或具有多于一个安装孔图案的单个多齿条支架。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风结构配合的一些组件，并且包括选择用于低功耗或降低可燃性的一些组件。
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公开(公告)号：US07725142B2
公开(公告)日：2010-05-25
申请号：US11762508
申请日：2007-06-13
申请人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
发明人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
IPC分类号： H05K7/00
CPC分类号： H04B1/08 , H04Q1/035 , H04Q1/116 , H04Q1/15 , H04Q2201/10 , H04Q2201/12 , H05K7/1425 , Y10T29/49826
摘要： A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation structures and may accommodate a high density of the circuitry cards. Embodiments may include one surface with one or more ridges for rigidity and ventilation and fin slots for receiving circuit card guide fins. Embodiments may include a surface with knockouts for receiving circuit card guides. Embodiments may also include multiple bracket hole patterns for mounting brackets for different racks or for a single multi-rack bracket having more than one mounting hole pattern. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation structures of the chassis and includes some components chosen for low-power consumption or reduced flammability.
摘要翻译： 公开了一种底盘和相关通信电路卡。 底盘具有散热结构，并且可以适应高密度的电路卡。 实施例可以包括具有用于刚性和通风的一个或多个脊的一个表面和用于接收电路卡引导片的翅片槽。 实施例可以包括具有用于接收电路卡引导件的基座的表面。 实施例还可以包括用于安装用于不同机架的支架的多个支架孔图案或具有多于一个安装孔图案的单个多齿条支架。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风结构配合的一些组件，并且包括选择用于低功耗或降低可燃性的一些组件。
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公开(公告)号：US07245717B2
公开(公告)日：2007-07-17
申请号：US09861187
申请日：2001-05-18
申请人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
发明人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
IPC分类号： H05K5/02
CPC分类号： H04B1/08 , H04Q1/035 , H04Q1/116 , H04Q1/15 , H04Q2201/10 , H04Q2201/12 , H05K7/1425 , Y10T29/49826
摘要： A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation structures and may accommodate a high density of the circuitry cards. Embodiments may include one surface with one or more ridges for rigidity and ventilation and fin slots for receiving circuit card guide fins. Embodiments may include a surface with knockouts for receiving circuit card guides. Embodiments may also include multiple bracket hole patterns for mounting brackets for different racks or for a single multi-rack bracket having more than one mounting hole pattern. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation structures of the chassis and includes some components chosen for low-power consumption or reduced flammability.
摘要翻译： 公开了一种底盘和相关通信电路卡。 底盘具有散热结构，并且可以容纳高密度的电路卡。 实施例可以包括具有用于刚性和通风的一个或多个脊的一个表面和用于接收电路卡引导片的翅片槽。 实施例可以包括具有用于接收电路卡引导件的基座的表面。 实施例还可以包括用于安装用于不同机架的支架的多个支架孔图案或具有多于一个安装孔图案的单个多齿条支架。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风结构配合的一些组件，并且包括选择用于低功耗或降低可燃性的一些组件。
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公开(公告)号：US08014837B2
公开(公告)日：2011-09-06
申请号：US12758852
申请日：2010-04-13
申请人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
发明人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Derek Sayres , Eric Sit
IPC分类号： G06F15/16
CPC分类号： H04B1/08 , H04Q1/035 , H04Q1/116 , H04Q1/15 , H04Q2201/10 , H04Q2201/12 , H05K7/1425 , Y10T29/49826
摘要： A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation structures and may accommodate a high density of the circuitry cards. Embodiments may include one surface with one or more ridges for rigidity and ventilation and fin slots for receiving circuit card guide fins. Embodiments may include a surface with knockouts for receiving circuit card guides. Embodiments may also include multiple bracket hole patterns for mounting brackets for different racks or for a single multi-rack bracket having more than one mounting hole pattern. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation structures of the chassis and includes some components chosen for low-power consumption or reduced flammability.
摘要翻译： 公开了一种底盘和相关通信电路卡。 底盘具有散热结构，并且可以容纳高密度的电路卡。 实施例可以包括具有用于刚性和通风的一个或多个脊的一个表面和用于接收电路卡引导片的翅片槽。 实施例可以包括具有用于接收电路卡引导件的基座的表面。 实施例还可以包括用于安装用于不同机架的支架的多个支架孔图案或具有多于一个安装孔图案的单个多齿条支架。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风结构配合的一些组件，并且包括选择用于低功耗或降低可燃性的一些组件。
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公开(公告)号：US06590782B2
公开(公告)日：2003-07-08
申请号：US09825163
申请日：2001-04-03
申请人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Todd Husom , Eric Sit
发明人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Todd Husom , Eric Sit
IPC分类号： H05K700
CPC分类号： H05K7/1425 , H04Q1/03 , H04Q1/035 , H04Q1/116 , H04Q1/155 , H04Q2201/06 , H04Q2201/10 , H04Q2201/12 , H05K1/0216 , H05K1/14 , H05K7/186 , H05K2201/093 , H05K2201/09663
摘要： A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.
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公开(公告)号：US06707686B2
公开(公告)日：2004-03-16
申请号：US09860653
申请日：2001-05-18
申请人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Todd Husom , Eric Sit
发明人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Todd Husom , Eric Sit
IPC分类号： H05K714
CPC分类号： H05K7/1425 , H04Q1/03 , H04Q1/035 , H04Q1/10 , H04Q1/116 , H04Q2201/06 , H04Q2201/10 , H04Q2201/12 , H05K1/0216 , H05K1/14 , H05K1/18 , H05K7/186 , H05K2201/044 , H05K2201/093 , H05K2201/09354 , H05K2201/09663
摘要： A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.
摘要翻译： 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件和另一个边缘上的翅片的电路卡。 电路卡包括导体结构，例如具有成对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。
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公开(公告)号：US07639510B2
公开(公告)日：2009-12-29
申请号：US12013492
申请日：2008-01-14
申请人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Todd Husom , Eric Sit
发明人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Todd Husom , Eric Sit
CPC分类号： H04Q1/10 , H04Q1/023 , H04Q1/03 , H04Q1/035 , H04Q1/116 , H04Q2201/06 , H04Q2201/10 , H04Q2201/12 , H05K1/0216 , H05K1/14 , H05K1/18 , H05K7/1425 , H05K7/186 , H05K2201/044 , H05K2201/093 , H05K2201/09354 , H05K2201/09663
摘要： A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.
摘要翻译： 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一边缘上的翅片。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。
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公开(公告)号：US20080204995A1
公开(公告)日：2008-08-28
申请号：US12013492
申请日：2008-01-14
申请人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Todd Husom , Eric Sit
发明人： Gregory J. Fritz , Alejandra Anderson , Robin Berg , Todd Husom , Eric Sit
CPC分类号： H04Q1/10 , H04Q1/023 , H04Q1/03 , H04Q1/035 , H04Q1/116 , H04Q2201/06 , H04Q2201/10 , H04Q2201/12 , H05K1/0216 , H05K1/14 , H05K1/18 , H05K7/1425 , H05K7/186 , H05K2201/044 , H05K2201/093 , H05K2201/09354 , H05K2201/09663
摘要： A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.
摘要翻译： 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一边缘上的翅片。 电路卡包括导体结构，例如具有配对和分离的导体的多个板层。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。
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公开(公告)号：US07224947B2
公开(公告)日：2007-05-29
申请号：US11126853
申请日：2005-05-10
申请人： Eric Sit , Robin Berg, Jr. , Brian J. McClellan , Steven N. Skradde , David J. Streitz , John P. Anderson , Gary L. Steinkogler , Eric Comer
发明人： Eric Sit , Robin Berg, Jr. , Brian J. McClellan , Steven N. Skradde , David J. Streitz , John P. Anderson , Gary L. Steinkogler , Eric Comer
IPC分类号： H04B1/38
CPC分类号： H04B1/03 , H04B1/036 , H04B1/08 , H04B7/155 , H04Q1/03 , H04Q1/035 , H04Q1/116 , H04Q1/155 , H04Q2201/02 , H04Q2201/06 , H04Q2201/12
摘要： A telecommunications chassis, module, and repeater circuit for use with signals having data rates including STM-1 (155.52 megabits per second) are disclosed. The chassis provides structures for establishing shielding and heat dissipation for the circuitry modules it contains including an outer and an inner Faraday box with an integrated ventilation pattern for circulating air. The module provides its own structures for establishing shielding and heat dissipation including a Faraday box and a ventilation pattern. The repeater circuit provides the ability to bridge a data signal between a monitor jack of one device and a higher signal level input jack of another device through multiple amplification stages and circuit board structures. The telecommunications chassis, module, and repeater circuit can be used in conjunction.
摘要翻译： 公开了一种用于具有包括STM-1（155.52兆比特每秒）的数据速率的信号的电信底盘，模块和中继器电路。 底盘提供用于为其所包含的电路模块建立屏蔽和散热的结构，包括具有用于循环空气的集成通风模式的外部和内部法拉第箱。 该模块提供自己的结构，用于建立屏蔽和散热，包括法拉第箱和通风模式。 中继器电路提供通过多个放大级和电路板结构在一个器件的监视器插孔和另一个器件的较高信号电平输入插孔之间桥接数据信号的能力。 电信机箱，模块和中继器电路可以结合使用。
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