Bipolar transistor structure with a shallow isolation extension region providing reduced parasitic capacitance
    2.
    发明授权
    Bipolar transistor structure with a shallow isolation extension region providing reduced parasitic capacitance 失效
    具有浅隔离延伸区域的双极晶体管结构,提供降低的寄生电容

    公开(公告)号:US06864560B2

    公开(公告)日:2005-03-08

    申请号:US10249299

    申请日:2003-03-28

    摘要: A bipolar vertical transistor is formed in a silicon semiconductor substrate which has an upper surface with STI regions formed therein composed of a dielectric material formed in the substrate having inner ends and top surfaces. A doped collector region is formed in the substrate between a pair of the STI regions. A counterdoped intrinsic base region is formed on the upper surface of the substrate between the pair of the STI regions with a margin between the intrinsic base region and the pair of STI regions, the intrinsic base region having edges. A doped emitter region is formed above the intrinsic base region spaced away from the edges. A shallow isolation extension region composed of a dielectric material is next to the edges of the intrinsic base region formed in the margin between the STI regions and the intrinsic base region. An extrinsic base region covers the shallow isolation extension region and extends partially over the intrinsic base region in mechanical and electrical contact therewith, whereby the shallow isolation extension region reduces the base-to-collector parasitic capacitance of the bipolar transistor.

    摘要翻译: 双极性垂直晶体管形成在硅半导体衬底中,该硅半导体衬底具有形成有STI区域的上表面,该区域由形成在具有内端和顶表面的衬底中的电介质材料构成。 掺杂的集电极区域形成在一对STI区域之间的衬底中。 在本体基极区域和一对STI区域之间的边缘部分之间形成反向掺杂的本征基极区域,该反向掺杂的本征基极区域位于一对STI区域之间的衬底的上表面上,本征基极区域具有边缘。 掺杂的发射极区域形成在与边缘间隔开的本征基极区域上方。 由介电材料构成的浅隔离延伸区域紧邻在STI区域和本征基极区域之间的边缘中形成的本征基极区域的边缘。 外部基极区域覆盖浅隔离延伸区域并且在与本体基极区域机械和电接触的同时部分延伸,由此浅隔离延伸区域减小双极晶体管的基极到集电极寄生电容。