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    Multifunction integrated optics chip having improved polarization extinction ratio
    2.
    发明授权
    Multifunction integrated optics chip having improved polarization extinction ratio 有权
    具有改善的偏振消光比的多功能集成光学芯片

    公开(公告)号：US06351575B1

    公开(公告)日：2002-02-26

    申请号：US09469665

    申请日：1999-12-23

    申请人： Lorrie L. Gampp ,  Gregory Zimmerman ,  Arthur R. Martinez ,  Thomas M. Flaherty ,  Christine E. Geosling

    发明人： Lorrie L. Gampp ,  Gregory Zimmerman ,  Arthur R. Martinez ,  Thomas M. Flaherty ,  Christine E. Geosling

    IPC分类号： G02B612

    CPC分类号： G02B6/126 ,  G02B6/122

    摘要： An integrated optics chip includes an optical waveguide network formed on a surface of an electrooptically active material. The optical waveguide network has an input facet where an optical signal may be input to the optical waveguide network and an output facet where optical signals may be output from the optical waveguide network. One or more trenches is formed in the bottom surface of the surface and arranged to extend into the substrate toward the optical waveguide network to a depth of at least 70% of the thickness. The trenches prevent light rays incident thereon from inside the substrate from propagating to the output facet. In particular, the trenches prevent light scattered at the input facet or from scattering centers in the optical waveguide network from reflecting from the bottom surface of the substrate to the output facet. A cover may be mounted to the top surface of the substrate to provide structural strength to the integrated optics chip. The cover preferably extends substantially the entire length of the substrate. One or more side grooves may be formed in the sides of the substrate and cover. A light absorbing material may be placed in the trenches and grooves. An electrode pattern may be formed on the top surface of the substrate adjacent the optical waveguide network, and a plurality of access electrodes may be formed on sides of the substrate and cover to provide electrical signals to the electrodes.

    摘要翻译： 集成光学芯片包括形成在电光活性材料的表面上的光波导网络。 光波导网络具有可以将光信号输入到光波导网络的输入小面和可以从光波导网络输出光信号的输出小面。 一个或多个沟槽形成在表面的底表面中，并布置成朝向光波导网络延伸到衬底的至少70％厚度的深度。 沟槽防止从衬底内部入射到其上的光线传播到输出小面。 特别地，沟槽防止在输入小面处散射的光或光波导网络中的散射中心从基板的底表面反射到输出小面。 盖可以安装到基板的顶表面以向集成光学芯片提供结构强度。 盖优选地基本上延伸到基板的整个长度上。 可以在基板和盖的侧面中形成一个或多个侧槽。 光吸收材料可以放置在沟槽和沟槽中。 可以在邻近光波导网络的基板的顶表面上形成电极图案，并且可以在基板和盖的侧面上形成多个接入电极，以向电极提供电信号。