公开(公告)号：US4627587A

公开(公告)日：1986-12-09

申请号：US632158

申请日：1984-07-18

申请人： Diane R. McCutchan ,  Gretchen W. Roeding ,  Gordon R. Kibby

发明人： Diane R. McCutchan ,  Gretchen W. Roeding ,  Gordon R. Kibby

IPC分类号： B64D11/06 ,  B64D25/04

CPC分类号： B64D11/0629 ,  B64D11/06 ,  B64D11/0633 ,  B64D25/04

摘要： An improved cushion of buoyant material for an airplane seat in which the cushion is removably attached to the seat, such as by Velcro strips. The cushion has straps to receive the arms of the passenger sitting on the cushion whereby the passenger can become coupled to the cushion and cause the cushion to be separated from the seat by pulling the cushion away from the seat. The cushion is formed from a number of hinged sections which pivot forwardly and partially around the passenger to stabilize the passenger when the passenger is in the water and coupled to the cushion by the straps. Actuating devices cause the forward pivoting of the hinged sections when the cushion is pulled away from the seat.

摘要翻译： 用于飞机座椅的改进的浮力材料缓冲垫，其中衬垫可移除地附接到座椅，例如通过魔术贴条带。 坐垫具有带子，用于接收坐在坐垫上的乘客的臂，由此乘客可以联接到坐垫，并且通过将坐垫从座椅上拉出而使得坐垫与座椅分离。 缓冲垫由多个铰接部分形成，该铰接部分向前和部分地绕着乘客枢转，以便当乘客在水中并且通过带子耦合到衬垫时使乘客稳定。 当垫子从座椅上拉出时，致动装置导致铰接部分的向前枢转。

公开(公告)号：US4874722A

公开(公告)日：1989-10-17

申请号：US188185

申请日：1988-04-28

申请人： George A. Bednarz ,  Reginald W. Smith ,  Gretchen W. Roeding ,  Howard R. Test

发明人： George A. Bednarz ,  Reginald W. Smith ,  Gretchen W. Roeding ,  Howard R. Test

IPC分类号： H01L21/50 ,  H01L23/495

CPC分类号： H01L21/50 ,  H01L23/49555 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1815 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/53174

摘要： A method of producing a cavity package semiconductor device is disclosed. The method includes providing a bar pad having a plurality of bar pad straps, each strap extending outwardly from the outer edge of the bar pad and spaced about the edge of the bar pad; mounting integrated circuits having bond pads on the bar pad; molding a packing material onto a central portion of lead fingers and the bar straps to grip and surround each lead finger with package material, with a portion of each lead finger extending externally from the ring at both the exterior and interior thereof and to secure the bar pad straps therein; electrically coupling the bond pads to the portion of desired ones of the lead fingers extending toward the interior of the ring; and enclosing both ends of the ring to provide a cavity in the ring to suspend a bar pad with the integrated circuit thereon within the cavity with the bar pad straps.

摘要翻译： 公开了一种制造空腔封装半导体器件的方法。 该方法包括提供具有多个条形垫带的条形垫，每条带从条形垫的外边缘向外延伸并且围绕条形垫的边缘间隔开; 安装集成电路在接线板上具有接合焊盘; 将包装材料成型到引线指的中心部分上，并且条带以包裹材料夹持和围绕每个引线指，每个引线指的一部分在外部和内部都从环向外延伸，并固定条 垫带; 将接合焊盘电耦合到朝向环的内部延伸的所述引线指的所需引线部分; 并且封闭环的两端以在环中提供空腔，以使具有集成电路的条形垫在带有条形垫带的空腔内悬挂在其上。