公开(公告)号：US20150028725A1

公开(公告)日：2015-01-29

申请号：US14233637

申请日：2012-06-21

申请人： Laurent Levin ,  Gustavo Greca

发明人： Laurent Levin ,  Gustavo Greca

IPC分类号： H01L41/047 ,  H01L41/083

CPC分类号： H01L41/0477 ,  B06B1/0611 ,  H01L41/0471 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/277 ,  H01L41/297

摘要： An ultrasonic transducer includes a stack of flat electrodes between which are interposed ceramic wafers of substantially same surface area as the electrodes, stacked contours of the ceramic wafers and electrode wafers defining substantially flat or cylindrical side faces of the stack. A method of manufacturing the transducer includes: alternatively stacking a ceramic wafer and an electrode wafer, placing between each ceramic wafer and its two neighbouring electrodes a composition of which at least 75% by weight, or at least 80% by weight, that includes silver nanoparticles having a grain size of smaller than or equal to 80 nanometres, or smaller than or equal to 60 nanometres; and compressing the stack by heating to a temperature of less than or equal to 280° C., or between 200° C. and 250° C.

摘要翻译： 超声波换能器包括一堆平坦电极，它们之间插入与电极基本相同的表面积的陶瓷晶片，陶瓷晶片和电极晶片的堆叠轮廓限定了堆叠的基本上平坦或圆柱形的侧面。 一种制造换能器的方法包括：交替堆叠陶瓷晶片和电极晶片，在每个陶瓷晶片和其两个相邻电极之间放置组合物，其中至少75重量％，或至少80重量％，包括银 粒度小于或等于80纳米，或小于或等于60纳米的纳米颗粒; 并通过加热到低于或等于280℃，或在200℃和250℃之间的温度来压缩该叠层。

公开(公告)号：US09780288B2

公开(公告)日：2017-10-03

申请号：US14233637

申请日：2012-06-21

申请人： Laurent Levin ,  Gustavo Greca

发明人： Laurent Levin ,  Gustavo Greca

IPC分类号： H01L41/083 ,  H01L41/047 ,  H01L41/297 ,  B06B1/06 ,  H01L41/277

CPC分类号： H01L41/0477 ,  B06B1/0611 ,  H01L41/0471 ,  H01L41/0472 ,  H01L41/083 ,  H01L41/277 ,  H01L41/297

摘要： An ultrasonic transducer includes a stack of flat electrodes between which are interposed ceramic wafers of substantially same surface area as the electrodes, stacked contours of the ceramic wafers and electrode wafers defining substantially flat or cylindrical side faces of the stack. A method of manufacturing the transducer includes: alternatively stacking a ceramic wafer and an electrode wafer, placing between each ceramic wafer and its two neighboring electrodes a composition of which at least 75% by weight, or at least 80% by weight, that includes silver nanoparticles having a grain size of smaller than or equal to 80 nanometers, or smaller than or equal to 60 nanometers; and compressing the stack by heating to a temperature of less than or equal to 280° C., or between 200° C. and 250° C.