DEVICE AND METHOD FOR THE PROCESSING OF WAFERS
    1.
    发明申请
    DEVICE AND METHOD FOR THE PROCESSING OF WAFERS 审中-公开
    用于处理波形的装置和方法

    公开(公告)号:US20080014715A1

    公开(公告)日:2008-01-17

    申请号:US11777699

    申请日:2007-07-13

    IPC分类号: H01L21/30 H01L21/46

    摘要: A device and a method for the processing of wafers is disclosed. One embodiment provides a method and a device in which a system wafer is bonded to a carrier work piece by using a bonding substance so as to increase the stability of the system wafer. After processing of the system wafer, the bonding effect of the bonding substance is cancelled. The system wafer can easily be detached from the carrier work piece without cutting out the carrier work piece, so that the dust exposure and the mechanical stress of the system wafer which occurs during the cutting out of the carrier work piece is avoided.

    摘要翻译: 公开了一种用于处理晶片的装置和方法。 一个实施例提供了一种方法和装置,其中通过使用粘结物质将系统晶片结合到载体工件,以便提高系统晶片的稳定性。 在系统晶片的处理之后,取消接合物质的接合效果。 系统晶片可以容易地从载体工件分离而不会切割载体工件,从而避免了在载体工件切割期间发生的系统晶片的灰尘暴露和机械应力。

    Production of adipic acid from acidic wash waters
    4.
    发明授权
    Production of adipic acid from acidic wash waters 失效
    从酸性洗涤水中生产己二酸

    公开(公告)号:US4227021A

    公开(公告)日:1980-10-07

    申请号:US901235

    申请日:1978-04-28

    CPC分类号: C07C51/487

    摘要: An improved process for producing adipic acid from the acidic wash waters which arise in the process for oxidizing cyclohexane with air, by treatment with nitric acid at from 10.degree. to 50.degree. C., with removal of the heat of reaction by external cooling, wherein the reaction mixture is led, at a flow velocity of at least 2.0 m/sec, as a thin layer spirally in counter-current to the coolant, under conditions which do not perturb the flow of the reaction mixture.

    摘要翻译: 通过在10℃至50℃下用硝酸处理,通过外部冷却除去反应热而在由空气氧化环己烷的过程中产生的酸性洗涤水中生产己二酸的改进方法,其中 在不干扰反应混合物的流动的条件下,反应混合物以至少2.0m / sec的流速被引导为与冷却剂逆流螺旋形的薄层。