Abstract:
A heat-dissipating device includes a housing, a partitioning member, a finned structure, and a high thermal-conductivity strip. The housing defines an inner space, and has a top surface formed with a retaining groove, and an inlet and an outlet. The partitioning member is disposed in the inner space so as to divide the inner space into first and second compartments that are respectively connected to the inlet and the outlet. The finned structure includes a plurality of partitioning plates disposed in the first compartment so as to divide the first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path, and a plurality of heat-dissipating fins disposed in each of the partitioned sections. The conductive strip is secured in the retaining groove in the top surface of the housing and has a thermal conductivity higher than that of the housing.
Abstract:
A heat-dissipating device includes a housing, a partitioning member, a finned structure, and a high thermal-conductivity strip. The housing defines an inner space, and has a top surface formed with a retaining groove, and an inlet and an outlet. The partitioning member is disposed in the inner space so as to divide the inner space into first and second compartments that are respectively connected to the inlet and the outlet. The finned structure includes a plurality of partitioning plates disposed in the first compartment so as to divide the first compartment into a plurality of partitioned sections that are connected to form a continuous meandering fluid path, and a plurality of heat-dissipating fins disposed in each of the partitioned sections. The conductive strip is secured in the retaining groove in the top surface of the housing and has a thermal conductivity higher than that of the housing.
Abstract:
A liquid cooled heat sink includes: a casing defining an inner space and provided with a partitioning wall dividing the inner space into upper and lower chambers and formed with a fluid passage in fluid communication with the upper and lower chambers, the casing being formed with a fluid inlet in fluid communication with the upper chamber and adapted to be connected to an external cooling device; a fin unit provided in the lower chamber; and a pump mounted on the casing and having a suction end disposed in the upper chamber, extending through the partitioning wall, and in fluid communication with the lower chamber, and a discharging end disposed in the upper chamber and adapted to be connected to an external cooling device.
Abstract:
A heat dissipating device includes: a heat sink including a casing having upper and lower chambers, the casing being formed with a fluid inlet in fluid communication with the upper chamber, and a fin unit provided in the lower chamber; a pump mounted on the casing for withdrawing fluid from the lower chamber; and an external cooling unit including a radiator mounted on the casing and including first and second side tanks, conduits connected to the first and second side tanks, and a fin structure connected to the first and second side tanks and the conduits. The first side tank is in fluid communication with the pump. The second side tank is in fluid communication with the fluid inlet of the casing. A cooling fan faces toward the fin structure of the radiator.
Abstract:
A heat dissipation device of a vehicle lamp and an interposing element thereof are provided. The heat dissipation device is installed in a lamp room which is divided by the interposing element into a front partition and a rear partition. A heat sink is installed in the interposing elements. An air feeding fan is disposed in an air feeding channel of the interposing element, for drawing air in the front partition to the rear partition through the air feeding channel. Further, a back flow fan is disposed in the rear partition, for drawing air in the rear partition to the front partition through a back flow channel. Whereby, the air in the front partition is cooled down through an external air flow passing through the lamp cover. Then, the heat sink dissipates heat of the air flow with the relatively low temperature in the front partition to the rear partition.
Abstract:
A heat dissipation device has an inlet pipeline, an outlet pipeline, at least one heat-dissipating unit and at least one actuator. Each of the at least one heat-dissipating unit is connected to the inlet pipeline and the outlet pipeline and includes multiple heat-dissipating elements being connected to each other. The at least one actuator is mounted on the inlet pipeline. The heat dissipation device is mounted around a large-sized electronic appliance to absorb and dissipate the heat generated by the large-sized electronic appliance so as to effectively reduce the working temperature of the electronic appliance to normal level. Therefore, the large-sized electronic appliance can work safely and is power-saving and environmental friendly.
Abstract:
A heat dissipating device is adapted to be connected to a heat sink and includes: a radiator including first and second side tanks adapted to store a coolant therein, a fin structure disposed between and interconnecting the first and second side tanks, and connecting conduits connected to the fin structure and interconnecting and in fluid communication with the first and second side tanks, the radiator further including a buffer tank that is mounted on and that is in fluid communication with the first side tank and that has a coolant outlet adapted to be connected to the heat sink, the second side tank having a coolant inlet adapted to be connected to the heat sink; and a pump mounted directly on the buffer tank.
Abstract:
A liquid cooling device is mounted in a large-sized overhead projector to absorb heat generated by a light-generating device. The liquid cooling device has a water tank, a heat sink, a liquid block assembly and a pump. The water tank has an outlet hole formed on the middle of the water. The heat sink communicates with the water tank. The liquid block assembly contacts the light-generating device and is filled with a coolant and communicates with the heat sink via an inlet duct. The pump is mounted in the large-sized overhead projector and is in fluid communications with the water tank via an outlet duct mounted in the outlet hole of the water tank. Therefore, when the large-sized overhead projector is put upright or turned upside down, the outlet hole is always in the middle of the water tank, preventing the pump from idling and being damaged as the amount of coolant is reduced.
Abstract:
A liquid cooling device has a main liquid block, a pump, a heat sink, and at least one auxiliary liquid block that are in fluid communications. The auxiliary liquid block has a body and a partition that separates the body into a reservoir and a heat-absorbing chamber. The reservoir and the heat-absorbing chamber communicate with and other via a through hole on the partition. Since the heat-absorbing chamber is mounted to be adjacent to an electronic component that generates heat, the fluid in the heat-absorbing chamber absorbs the heat. When the fluid in the heat-absorbing chamber vaporizes and decreases the fluid in the reservoir has a higher level and thus flows to the heat-absorbing chamber via the through hole. Therefore, the heat-dissipating ability of the liquid cooling device is increased.
Abstract:
A heat-dissipating device includes a planar plate, a cap-like cover, a finned structure, and a discharge pipe. The cap-like cover includes a base wall, and a surrounding wall that interconnects the planar plate and the base wall, that cooperates with the planar plate and the base wall to define an inner space thereamong, and that defines an inlet. The finned structure includes a plurality of partitioning plates that form a continuous meandering fluid path, and a plurality of heat-dissipating fins that are disposed in the meandering fluid path. The discharge pipe is connected to the surrounding wall of the cap-like cover, is in fluid communication with the second compartment, and has an open end disposed adjacent to the base wall of the cap-like cover.