公开(公告)号：US5137940A

公开(公告)日：1992-08-11

申请号：US476700

申请日：1990-02-08

申请人： Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Hatuji Shiraishi ,  Koji Futatsumori

发明人： Kazutoshi Tomiyoshi ,  Toshio Shiobara ,  Hatuji Shiraishi ,  Koji Futatsumori

IPC分类号： C08K3/36 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08K3/36

摘要： A semiconductor encapsulating epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler is improved in melt flow and moldability when the filler comprises spherical silica having a mean particle size of 5 to 35 .mu.m and a specific surface area of up to 1.4 m.sup.2 /g. A mixture of (A) spherical silica having a mean particle size of 0.1 to 2 .mu.m, and (C) ground silica having a mean particle size of 2 to 15 .mu.m is also useful as the filler. A cured product thereof has a low coefficient of expansion and improved crack resistance upon soldering after moisture absorption.

摘要翻译： 包含环氧树脂，固化剂和无机填料的半导体封装环氧树脂组合物在熔体流动性和成型性方面得到改善，当填料包括平均粒度为5至35μm的球形二氧化硅和比表面积 至1.4m2 / g。 平均粒径为0.1〜2μm的（A）球状二氧化硅和（C）平均粒径为2〜15μm的研磨二氧化硅的混合物也可用作填料。 其固化产物在吸湿后焊接时具有低膨胀系数和改善的抗裂性。