摘要:
A tilt mirror is disclosed. The tilt mirror can include: a reflection portion, which may reflect incident light; a first cantilever, which may be formed on either end of the reflection portion, and which may generate a stress in one direction; a second cantilever, which may be formed on either end of the reflection portion beside the first cantilever, and which may generate a stress in the other direction; and a connector portion, which may connect the reflection portion with one end of the first cantilever and with one end of the second cantilever such that the stress generated in the one direction and the stress generated in the other direction are transferred to the reflection portion. The tilt mirror provides a simple composition that can be utilized to alter the path for rays of light.
摘要:
According to the embodiment of the present invention, an infrared sensor chip may be provided that includes: a CMOS circuit board comprised of an active matrix, a row line selector and an output multiplexer; and a bolometer which is stacked on the CMOS circuit board and is comprised of an active cell and a reference cell, wherein, for the purpose of a parametric test for the bolometer at a wafer or chip state, the row line selector selects a cell to which a voltage is applied in the bolometer, and wherein the output multiplexer outputs current characteristics according to the voltage application.
摘要:
An optical modulator can be provided that includes a substrate; an insulation layer positioned on the substrate; a ribbon layer such that its center portion is spaced apart from the insulation layer; a piezoelectric actuator positioned on either end of the ribbon layer that provides the driving force which moves the center portion of the ribbon layer vertically; and a temperature compensation layer, which is made of a thermally contracting material having a negative coefficient of expansion, and which is formed on at least one position of an upper portion of the piezoelectric actuator, a lower portion of the piezoelectric actuator, and a lower surface of the ribbon layer corresponding to a position of the piezoelectric actuator. In the optical modulator, the problem of thermal deformation due to rises in temperature can be resolved, whereby the accuracy and reliability of operation of the component can be increased.