公开(公告)号：US07190238B2

公开(公告)日：2007-03-13

申请号：US11156416

申请日：2005-06-20

申请人： Yasunori Hosokawa ,  Toru Yoshikawa ,  Heiji Takado

发明人： Yasunori Hosokawa ,  Toru Yoshikawa ,  Heiji Takado

IPC分类号： H03B5/32

CPC分类号： H03H9/0514 ,  H03H9/0547

摘要： The present invention relates to a surface mounting crystal oscillator in which an IC chip, a crystal element, and a circuit component are connected together by wire bonding and are housed within a main container having a concave section. The main container has a pair of opposing inner wall step portions along both sides in the longitudinal direction, and this pair of inner wall step portions are also each divided into an upper step portion and a lower-step portion of different heights along the longitudinal direction. At least one of the upper step portions of the pair of inner wall step portions supports one end portion in the lengthwise direction of the crystal element so that the lengthwise direction of the crystal element is aligned in the widthwise direction of the main container. The circuit component is disposed on an inner base surface of the main container below the crystal element.

摘要翻译： 本发明涉及一种表面安装晶体振荡器，其中IC芯片，晶体元件和电路元件通过引线接合连接在一起，并且容纳在具有凹形部分的主容器内。 主容器沿纵向方向具有一对相对的内壁台阶部分，并且这对内壁台阶部分也分别被分成上下台阶部分和沿纵向的不同高度的下台阶部分 。 所述一对内壁台阶部的上部台阶部中的至少一个支撑在所述结晶体的长度方向上的一个端部，使得所述结晶体的长度方向在所述主容器的宽度方向上排列。 该电路部件设置在该主容器的内底面下方的晶体元件的下方。

公开(公告)号：US20050285691A1

公开(公告)日：2005-12-29

申请号：US11156416

申请日：2005-06-20

申请人： Yasunori Hosokawa ,  Toru Yoshikawa ,  Heiji Takado

发明人： Yasunori Hosokawa ,  Toru Yoshikawa ,  Heiji Takado

IPC分类号： H03H9/05 ,  H03B5/32

CPC分类号： H03H9/0514 ,  H03H9/0547

摘要： The present invention relates to a surface mounting crystal oscillator in which an IC chip, a crystal element, and a circuit component are connected together by wire bonding and are housed within a main container having a concave section. The main container has a pair of opposing inner wall step portions along both sides in the longitudinal direction, and this pair of inner wall step portions are also each divided into an upper step portion and a lower-step portion of different heights along the longitudinal direction. At least one of the upper step portions of the pair of inner wall step portions supports one end portion in the lengthwise direction of the crystal element so that the lengthwise direction of the crystal element is aligned in the widthwise direction of the main container. The circuit component is disposed on an inner base surface of the main container below the crystal element. In addition, the IC chip is disposed on an inner base surface of the main container that is formed between the pair of lower-step portions of the pair of inner wall step portions, and bonding wires from the IC chip are connected to those lower-step portions. The present invention provides a highly-reliable surface-mounting oscillator with small dimensions in plan view and heightwise, which is particularly suitable for voltage control.

摘要翻译： 本发明涉及一种表面安装晶体振荡器，其中IC芯片，晶体元件和电路元件通过引线接合连接在一起，并且容纳在具有凹形部分的主容器内。 主容器沿纵向方向具有一对相对的内壁台阶部分，并且这对内壁台阶部分也分别被分成上下台阶部分和沿纵向的不同高度的下台阶部分 。 所述一对内壁台阶部的上部台阶部中的至少一个支撑在所述结晶体的长度方向上的一个端部，使得所述结晶体的长度方向在所述主容器的宽度方向上排列。 该电路部件设置在该主容器的内底面下方的晶体元件的下方。 此外，IC芯片设置在形成在一对内壁台阶部的一对下台阶部之间的主容器的内底面上，并且来自IC芯片的接合线与那些下部台阶部分连接， 步骤部分。 本发明提供了在平面图和高度方面具有小尺寸的高度可靠的表面安装振荡器，其特别适用于电压控制。

公开(公告)号：US5939817A

公开(公告)日：1999-08-17

申请号：US531594

申请日：1995-09-21

申请人： Heiji Takado

发明人： Heiji Takado

IPC分类号： H03H9/05 ,  H01L41/053

CPC分类号： H03H9/1071 ,  H03H9/059 ,  H01L2224/4899 ,  H01L2924/01078 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195

摘要： A surface acoustic wave element 11 having an inter digital electrode 12 formed on one surface of a piezo-electric substrate is arranged in a recess of a package 13 with the one surface being faced to a bottom surface of the recess of the package 13. An elastic conductive pad 35 having pads electrically connected to the electrode of the surface acoustic wave element 11 and electrodes of the package 13 is provided between the one surface of the surface acoustic wave element 11 and the package 13. The conductive pad 35 includes wiring means 35a, with which it is possible to connect the surface acoustic wave element 11 to the package 13 even when the position of the surface acoustic wave element in which the interdigital electrode is formed is deviated from the position of the electrodes of the package 13. The package 13 includes a cap 30 for pressing down the surface acoustic wave element 11. The surface acoustic wave element 11 is mounted on the conductive pad 35 in the package 13 with a surface of the surface acoustic wave element 11 on which the interdigital electrode is formed being down. Since the package 13 is hermetically sealed by the cap 30 while the surface acoustic wave element 11 being pressed down, the wire bonding becomes unnecessary, causing mounting to be facilitated. Further, the improvement of the quality of the device and its miniaturization are realized.

摘要翻译： 具有形成在压电基板的一个表面上的数字间电极12的表面声波元件11被布置在封装13的凹部中，该一个表面面向封装13的凹部的底表面。 具有与声表面波元件11的电极电连接的焊盘和封装体13的电极的弹性导电焊盘35设置在表面声波元件11的一个表面和封装13之间。导电焊盘35包括布线装置35a 即使当形成叉指电极的表面声波元件的位置偏离了封装13的电极的位置时，也可以将表面声波元件11连接到封装13。 13包括用于按压表面声波元件11的盖30.声表面波元件11安装在封装13中的导电垫35上， 形成交叉指型电极的表面声波元件11的表面被倒下。 由于在按压表面声波元件11的同时，封装13被盖30气密地密封，所以不需要引线接合，从而便于安装。 此外，实现了设备的质量的提高及其小型化。