公开(公告)号：US20240283425A1

公开(公告)日：2024-08-22

申请号：US18651849

申请日：2024-05-01

Applicant: SEIKO EPSON CORPORATION

Inventor： Junichi TAKEUCHI ,  Tomoyuki KAMAKURA ,  Ryuta NISHIZAWA ,  Yukihiro HASHI

IPC: H03H9/09 ,  H03H9/05 ,  H03H9/125

CPC classification number: H03H9/09 ,  H03H9/0514 ,  H03H9/125

Abstract: A resonator device includes: a base; a resonator element that includes a resonator substrate and an electrode; a conductive layer that is disposed on the base; a metal bump that is disposed between the conductive layer and the resonator element, and that electrically couples the conductive layer and the electrode while bonding the conductive layer and the resonator element; and at least one of a first low elastic modulus layer that is interposed between the base and the conductive layer, that overlaps the metal bump in a plan view of the base, and that has an elastic modulus smaller than that of the metal bump, and a second low elastic modulus layer that is interposed between the resonator substrate and the electrode, that overlaps the metal bump in the plan view of the base, and that has an elastic modulus smaller than that of the metal bump.

公开(公告)号：US20240120903A1

公开(公告)日：2024-04-11

申请号：US18222532

申请日：2023-07-17

Applicant: Suzhou HunterSun Electronics Co., Ltd.

Inventor： Hairui LIU ,  Zhiguo LAI ,  Qinghua YANG

IPC: H03H9/54 ,  H03H9/02 ,  H03H9/05

CPC classification number: H03H9/542 ,  H03H9/02125 ,  H03H9/0514

Abstract: A semiconductor device including a first functional module arranged on a first substrate and having a chip, an electrical connection component and a sealing ring, where the sealing ring surrounds the chip, and the chip is electrically connected to the electrical connection component; a second functional module having a packaging substrate, where the packaging substrate includes at least two metal layers and a dielectrical layer between the metal layers; a third functional module having multiple redistribution lines and multiple micro through holes for electrical connection between the first functional module and the second functional module, where the electrical connection component in the first functional module is electrically connected to the third functional module; and a second substrate, where the second substrate is sealed with the first substrate.

公开(公告)号：US20230223908A1

公开(公告)日：2023-07-13

申请号：US17987891

申请日：2022-11-16

Applicant: Wuhan MEMSonics Technologies Co.,Ltd.

Inventor： Yang ZOU ,  Yao CAI ,  Binghui LIN ,  Tiancheng LUO ,  Chao GAO ,  Dawdon CHEAM ,  Bowoon SOON ,  Chengliang SUN

IPC: H03H3/02 ,  H03H9/17 ,  H03H9/13 ,  H03H9/05 ,  H03H9/02 ,  H03H9/56

CPC classification number: H03H3/02 ,  H03H9/172 ,  H03H9/133 ,  H03H9/0514 ,  H03H9/02015 ,  H03H9/566 ,  H03H2003/021

Abstract: The present disclosure provides a single crystal film bulk acoustic resonator, a manufacturing method for a single crystal film bulk acoustic resonator, and a filter, and relates to the technical field of filters. The method includes: sequentially forming a buffer layer, a piezoelectric layer, and a first electrode that are stacked on a temporary base substrate; forming a first bonding layer on the first electrode; providing a substrate; etching the substrate to form a plurality of first bumps on a surface of the substrate; forming a second bonding layer covering top surfaces of the plurality of first bumps on the surface of the substrate; and bonding the second bonding layer located at the top surfaces of the plurality of first bumps to the first bonding layer. During bonding, the area of the top surfaces of the first bumps can be controlled by etched grooves, so the area of the second bonding layer located at the top surfaces of the first bumps can be controlled, thereby realizing the control of a bonding area. By controlling the bonding area, the balance between the bonding requirement and the bonding reliability is realized.

公开(公告)号：US09929716B2

公开(公告)日：2018-03-27

申请号：US14932109

申请日：2015-11-04

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Moon Chul Lee ,  Duck Hwan Kim ,  Yeong Gyu Lee ,  Chul Soo Kim ,  Jie Ai Yu ,  Sang Uk Son

IPC: H03H9/05 ,  H03H3/02 ,  H03H9/17

CPC classification number: H03H9/0514 ,  H03H3/02 ,  H03H9/0504 ,  H03H9/173 ,  H03H2003/021

Abstract: There are provided an acoustic resonator and a method of manufacturing the same. The acoustic resonator includes a resonance part including a first electrode, a second electrode, and a piezoelectric layer disposed between the first and second electrodes. The acoustic resonator also includes a substrate disposed below the resonance part and including a via hole penetrating through the substrate and a connection conductor disposed in the via hole and connected to at least one of the first and second electrodes.

公开(公告)号：US09634641B2

公开(公告)日：2017-04-25

申请号：US14524857

申请日：2014-10-27

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Gohki Nishimura ,  Takuma Kuroyanagi ,  Naoyuki Tasaka ,  Sachiko Tanaka

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/70 ,  H03H9/72 ,  H03H9/17

CPC classification number: H03H9/0566 ,  H01L2224/16225 ,  H03H9/0514 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/10 ,  H03H9/1007 ,  H03H9/1064 ,  H03H9/173 ,  H03H9/706 ,  H03H9/725

Abstract: An electronic device includes: a first substrate, a first function part in its first surface, an adhesive layer on the first surface so as to surround the first function part, a second substrate bonded to the first substrate by the adhesive layer to form a gap between the first and second substrates, a first via interconnection piercing the first substrate to connect the first surface and an opposite second surface, a second via interconnection piercing the second substrate to connect a third surface of the second substrate opposite to the first substrate and a fourth surface opposite to the third surface, a first terminal provided on the second surface and connected to the first via interconnection, a second terminal provided on the fourth surface and connected to the second via interconnection. The first function part is connected to at least one of the first and second via interconnections.

公开(公告)号：US20170005259A1

公开(公告)日：2017-01-05

申请号：US15197712

申请日：2016-06-29

Applicant: NIHON DEMPA KOGYO CO., LTD.

Inventor： Hiroaki MIZUMURA

IPC: H01L41/29 ,  H01L41/313 ,  H01L41/047

CPC classification number: H03H9/0509 ,  H03H9/0514 ,  H03H9/1014

Abstract: A piezoelectric device includes a crystal element, excitation electrodes, extraction electrodes, a base, and first and second wiring electrodes on the base and connected to the extraction electrodes. The crystal element is connectedly secured to the first wiring electrode with conductive adhesive at an end part at a side of the one side on one surface of the crystal element. The fixing and the wire bonding are performed such that a secured position with the conductive adhesive overlaps a bonding position on the crystal element side by the wire bonding in a crystal element thickness direction. The first wiring electrode is disposed at an end part at a side of one side of the base and has a planar shape and a size so as to planarly encompass at least a region formed by projecting a part where the conductive adhesive contacts the crystal element to the base side.

Abstract translation: 压电装置包括晶体元件，激励电极，引出电极，基极以及基极上的第一和第二布线电极，并连接到引出电极。 晶体元件在晶体元件的一个表面的一侧的端部的端部处以导电粘合剂连接固定到第一布线电极。 执行固定和引线接合，使得具有导电粘合剂的固定位置通过在晶体元件厚度方向上的引线接合而与晶体元件侧的接合位置重叠。 第一布线电极设置在基底的一侧的一侧的端部，并且具有平面形状和尺寸，以至少平面地包围至少一个通过将导电粘合剂与晶体元件接触的部分突出而形成的区域， 基地。

公开(公告)号：US20160142041A1

公开(公告)日：2016-05-19

申请号：US14795736

申请日：2015-07-09

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Eiji KUWAHARA

IPC: H03H9/64

CPC classification number: H03H9/0566 ,  H03H9/0514 ,  H03H9/059 ,  H03H9/1007 ,  H03H9/1085 ,  H03H9/706 ,  H03H9/725

Abstract: An acoustic wave device includes: an acoustic wave chip including an acoustic wave element formed therein; a multilayered substrate including the acoustic wave chip mounted on an upper surface thereof; a first ground terminal formed on a lower surface of the multilayered substrate and electrically coupled to a ground electrode of the acoustic wave chip; a second ground terminal formed on the lower surface; a signal terminal formed on the lower surface and electrically coupled to a signal electrode of the acoustic wave chip; and a shield layer formed at least on the upper surface, on the lower surface, or between the lower surface and the upper surface of the multilayered substrate so as to overlap with at least a part of the acoustic wave chip, not electrically coupled to the first ground terminal in the multilayered substrate, and electrically coupled to the second ground terminal.

Abstract translation: 声波装置包括：形成有声波元件的声波芯片; 包括安装在其上表面上的声波芯片的多层基片; 第一接地端子，形成在所述多层基板的下表面上并电耦合到所述声波芯片的接地电极; 形成在下表面上的第二接地端子; 信号端子，其形成在所述下表面上并电耦合到所述声波芯片的信号电极; 以及至少形成在多层基板的上表面，下表面或下表面与上表面之间的屏蔽层，以便与声波芯片的至少一部分重叠，而不与电耦合到 第一接地端子，并且电耦合到第二接地端子。

公开(公告)号：US20150123744A1

公开(公告)日：2015-05-07

申请号：US14524857

申请日：2014-10-27

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Gohki NISHIMURA ,  Takuma KUROYANAGI ,  Naoyuki TASAKA ,  Sachiko TANAKA

IPC: H03H9/72 ,  H03H9/17 ,  H01L41/047 ,  H01L41/08

CPC classification number: H03H9/0566 ,  H01L2224/16225 ,  H03H9/0514 ,  H03H9/0571 ,  H03H9/0576 ,  H03H9/059 ,  H03H9/10 ,  H03H9/1007 ,  H03H9/1064 ,  H03H9/173 ,  H03H9/706 ,  H03H9/725

Abstract: An electronic device includes: a first substrate, a first function part in its first surface, an adhesive layer on the first surface so as to surround the first function part, a second substrate bonded to the first substrate by the adhesive layer to form a gap between the first and second substrates, a first via interconnection piercing the first substrate to connect the first surface and an opposite second surface, a second via interconnection piercing the second substrate to connect a third surface of the second substrate opposite to the first substrate and a fourth surface opposite to the third surface, a first terminal provided on the second surface and connected to the first via interconnection, a second terminal provided on the fourth surface and connected to the second via interconnection. The first function part is connected to at least one of the first and second via interconnections.

Abstract translation: 电子设备包括：第一基板，其第一表面中的第一功能部件，第一表面上的包围第一功能部件的粘合剂层，通过粘合剂层粘合到第一基板上以形成间隙的第二基板 在所述第一和第二基板之间，穿过所述第一基板以连接所述第一表面和相对的第二表面的第一通孔互连件，刺穿所述第二基板以连接所述第二基板的与所述第一基板相对的第三表面的第二通孔互连和 与所述第三表面相对的第四表面，设置在所述第二表面上并连接到所述第一通孔互连件的第一端子，设置在所述第四表面上并连接到所述第二通孔互连件的第二端子。 第一功能部分连接到第一和第二通孔互连中的至少一个。

公开(公告)号：US20140339957A1

公开(公告)日：2014-11-20

申请号：US14227663

申请日：2014-03-27

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Motoyuki TAJIMA ,  Kaoru SAKINADA

IPC: H01L41/047 ,  H01L41/25 ,  H01L41/29

CPC classification number: H03H9/1092 ,  H01L2224/11 ,  H01L2224/16225 ,  H01L2924/19105 ,  H03H9/0514 ,  H03H9/059 ,  H03H9/105 ,  Y10T29/49204

Abstract: An acoustic wave device includes: a substrate; a pad formed on the substrate; a cap formed of an inorganic insulating material and located on the substrate, the cap including a cavity located in a surface of the cap at a substrate side and a penetration hole formed in a location overlapping with the pad; a terminal filling the penetration hole, coupled to the pad on the substrate, and formed of solder; and a functional element formed on an upper surface of the substrate and in the cavity, the functional element exciting an acoustic wave.

Abstract translation: 声波装置包括：基板; 衬垫，形成在衬底上; 由无机绝缘材料形成并位于所述基板上的盖，所述盖包括位于所述盖的基板侧的表面中的空腔和形成在与所述垫重叠的位置的贯通孔; 填充穿透孔的端子，耦合到衬底上的焊盘，并由焊料形成; 以及形成在所述基板的上表面和所述空腔中的功能元件，所述功能元件激发声波。

公开(公告)号：US20140241132A1

公开(公告)日：2014-08-28

申请号：US14188366

申请日：2014-02-24

Applicant: SII CRYSTAL TECHNOLOGY INC.

Inventor： Masanori TAMURA

IPC: H03H9/21 ,  G04C11/00 ,  H03B5/36

CPC classification number: H03H9/21 ,  H03B5/36 ,  H03H9/0514 ,  H03H9/1014

Abstract: A piezoelectric vibrator is provided in which a piezoelectric vibrating piece is accommodated in a package, the piezoelectric vibrating piece including: a pair of vibrating arm sections; a base section to which each base end of the pair of vibrating arm sections is connected; and a support arm section that is connected to the base section between the pair of vibrating arm sections and extends from the base section to the same side as the vibrating arm sections, in which the piezoelectric vibrating piece is supported within the package in mount sections provided in the support arm section, and in which the mount sections are provided in a region which is defined between a position of which a distance from an end section of the base section opposite to the side where the support arm section is connected to the side of a leading end of the support arm section is 25% of a width dimension of the base section along the width direction and a position of which the distance is 65% of the width dimension.

Abstract translation: 提供一种压电振动器，其中压电振动片容纳在封装中，压电振动片包括：一对振动臂部分; 所述一对振动臂部的每个基端连接到的基部; 以及支撑臂部，其连接到所述一对振动臂部之间的基部，并且从所述基部延伸到与所述振动臂部相同的一侧，其中所述压电振动片被支撑在所述封装内的安装部中，所述安装部设置 在所述支撑臂部分中，并且其中所述安装部分设置在区域中，所述区域被限定在所述区域中，所述区域的距离所述基部的端部的与所述支撑臂部分的相对侧的距离的距离 支撑臂部的前端部是宽度方向的基部的宽度尺寸的25％，距离为宽度尺寸的65％的位置。