Thermoformed cover for electronic device and method for forming
    3.
    发明申请
    Thermoformed cover for electronic device and method for forming 审中-公开
    电子装置热成型盖及成型方法

    公开(公告)号:US20070241021A1

    公开(公告)日:2007-10-18

    申请号:US11403236

    申请日:2006-04-12

    IPC分类号: B65D85/00

    摘要: A thermoformed cover and related method for forming the thermoformed cover for an electronic device including at least one body element is made from a thermoplastic sheet having characteristics and properties to accommodate the mechanical requirements of the cover for the electronic device. The thermoplastic sheet has characteristics such that when the thermoplastic sheet is heated to a suitable temperature, the thermoplastic sheet becomes pliable and stretchable. At least a portion of the heated thermoplastic sheet is made to conform by vacuum, pressure or other suitable means to a mold arranged to substantially correspond to the desired cover for the electronic device. A thermoformed cover corresponding to the desired cover for the electronic device is formed in at least a portion of the thermoplastic sheet and the thermoformed cover is cut away or otherwise separated from the thermoplastic sheet. The thermoformed integrated cover may be arranged to replace or to envelop the cover of the electronic device or may be arranged as a protective insert cover between the body element and the cover of the electronic device.

    摘要翻译: 用于形成包括至少一个主体元件的电子设备的热成型盖的热成型盖和相关方法由具有特性和性质的热塑性片制成,以适应电子设备的盖的机械要求。 热塑性片材具有这样的特征,即当将热塑性片材加热到合适的温度时,热塑性片材变得柔软且可拉伸。 加热的热塑性片材的至少一部分被制成符合真空,压力或其它合适的方式到被布置为基本上对应于电子设备的期望的盖子的模具。 在热塑性片材的至少一部分中形成对应于电子设备的期望盖的热成型盖,并且热成型盖被切割或以其它方式与热塑性片材分离。 热成型的一体式盖可以被布置成更换或包封电子装置的盖,或者可以布置成在主体元件和电子装置的盖之间的保护插入盖。