公开(公告)号：US12131985B2

公开(公告)日：2024-10-29

申请号：US17470519

申请日：2021-09-09

Applicant: CORNING INCORPORATED

Inventor： Mandakini Kanungo ,  Prantik Mazumder ,  Chukwudi Azubuike Okoro ,  Ah-Young Park ,  Scott Christopher Pollard ,  Rajesh Vaddi

IPC: C25D3/38 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/00 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/48 ,  H01L21/768 ,  H01L23/15 ,  H01L23/48 ,  H01L23/498 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/38 ,  C03C3/076 ,  C25D7/12 ,  H01L23/00 ,  H01L23/492 ,  H05K3/00 ,  H05K3/42

CPC classification number: H01L23/49827 ,  C03C3/06 ,  C03C15/00 ,  C03C17/06 ,  C03C17/10 ,  C03C23/0025 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H01L21/76877 ,  H01L23/15 ,  H01L23/481 ,  H01L23/49838 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/388 ,  C03C3/076 ,  C03C2218/115 ,  C25D3/38 ,  C25D7/123 ,  H01L21/486 ,  H01L23/4924 ,  H01L23/49866 ,  H01L23/564 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/0055 ,  H05K3/423 ,  H05K3/425 ,  H05K3/428 ,  H05K2201/068 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/0989 ,  H05K2201/10378 ,  H05K2203/1194 ,  H05K2203/1361 ,  H05K2203/143 ,  H05K2203/1438 ,  H05K2203/162 ,  Y10T428/24273 ,  Y10T428/24479 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: According to various embodiments described herein, an article comprises a glass or glass-ceramic substrate having a first major surface and a second major surface opposite the first major surface, and a via extending through the substrate from the first major surface to the second major surface over an axial length in an axial direction. The article further comprises a helium hermetic adhesion layer disposed on the interior surface; and a metal connector disposed within the via, wherein the metal connector is adhered to the helium hermetic adhesion layer. The metal connector coats the interior surface of the via along the axial length of the via to define a first cavity from the first major surface to a first cavity length, the metal connector comprising a coating thickness of less than 12 μm at the first major surface. Additionally, the metal connector coats the interior surface of the via along the axial length of the via to define a second cavity from the second major surface to a second cavity length, the metal connector comprising a coating thickness of less than 12 μm at the second major surface and fully fills the via between the first cavity and the second cavity.

公开(公告)号：US12060609B2

公开(公告)日：2024-08-13

申请号：US18324708

申请日：2023-05-26

Applicant: Illumina, Inc.

Inventor： Wayne N. George ,  Andrew A. Brown ,  Daniel Bratton ,  Hongji Ren ,  Ryan Christopher Smith

IPC: C12Q1/6874 ,  B05D3/06 ,  C09D133/26 ,  C09D135/00 ,  C12Q1/6806

CPC classification number: C12Q1/6874 ,  B05D3/06 ,  B05D3/065 ,  C09D133/26 ,  C09D135/00 ,  C12Q1/6806 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/2998 ,  Y10T428/31536 ,  Y10T428/31935

Abstract: The present disclosure relates to polymer coatings covalently attached to the surface of a substrate and the preparation of the polymer coatings, such as poly(N-(5-azidoacetamidylpentyl)acrylamide-co-acrylamide) (PAZAM), in the formation and manipulation of substrates, such as molecular arrays and flow cells. The present disclosure also relates to methods of preparing a substrate surface by using beads coated with a covalently attached polymer, such as PAZAM, and the method of determining a nucleotide sequence of a polynucleotide attached to a substrate surface described herein.

公开(公告)号：US11795564B2

公开(公告)日：2023-10-24

申请号：US16104477

申请日：2018-08-17

Applicant: Apple Inc.

Inventor： James A. Curran ,  James A. Dean ,  Todd S. Mintz

IPC: C25D11/24 ,  H05K5/02 ,  H05K5/04 ,  B32B15/00

CPC classification number: C25D11/243 ,  H05K5/0243 ,  H05K5/04 ,  B32B15/00 ,  Y10T428/24917

Abstract: This application relates to an enclosure for a portable electronic device. The enclosure includes an aluminum alloy substrate and an anodized layer overlaying and formed from the aluminum alloy substrate. The anodized layer includes pores, where the pores include (i) dye particles that impart the anodized layer with a color, and (ii) divalent metal cations.

公开(公告)号：US11738537B2

公开(公告)日：2023-08-29

申请号：US14067891

申请日：2013-10-30

Applicant: SAN DIEGO GAS & ELECTRIC COMPANY C/O SEMPRA ENERGY

Inventor： Eldridge M. Mount, III ,  Denis S. Sanford

IPC: B32B7/12 ,  B64B1/58 ,  B32B27/34 ,  B32B5/06 ,  B32B27/30 ,  B32B15/08 ,  B32B27/36 ,  B64B1/14 ,  B32B27/32 ,  A63H27/10

CPC classification number: B32B7/12 ,  B32B5/06 ,  B32B15/08 ,  B32B27/306 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B64B1/14 ,  B64B1/58 ,  A63H2027/1025 ,  B32B2250/42 ,  B32B2255/10 ,  B32B2255/20 ,  B32B2255/205 ,  B32B2307/206 ,  B32B2307/3065 ,  B32B2307/31 ,  B32B2307/718 ,  B32B2307/7163 ,  B32B2307/7242 ,  B32B2307/75 ,  B32B2605/00 ,  Y10T428/24917 ,  Y10T428/31504 ,  Y10T428/31678 ,  Y10T428/31739 ,  Y10T428/31743 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31938

Abstract: Non-conductive films for constructing lighter than air balloons are provided. A non-conductive film may include multiple layers of gas barrier polymers. An outer surface printable layer and an interior heat or ultrasonically sealable layer may also be included. Each gas barrier film may include multiple (e.g., from 3 to approximately 75) barrier layers. A gas barrier core has a nano-layer structure. A gas barrier core may also include a biodegradable film or a bio-based film. A non-conductive film may include a metal layer for enhancing gas barrier properties. The metal layer may be discontinuous. The metal layer may be conductive and coated with an insulating top coat.

公开(公告)号：US20180274117A1

公开(公告)日：2018-09-27

申请号：US15927571

申请日：2018-03-21

Applicant: VALEO SECURITE HABITACLE

Inventor： Olivier Renaud ,  Benoît Delande

IPC: C25D5/54 ,  C25D5/02 ,  C08L77/00 ,  C25D5/56 ,  C25D3/04

CPC classification number: C25D5/54 ,  C08L77/00 ,  C25D3/04 ,  C25D5/02 ,  C25D5/56 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: The present invention relates to a plastic part (1) with selective metallization comprising at least one first non-metallized portion (7) made from a first plastic material that cannot be metallized by electroplating and at least one second metallized portion (9) made from a second metallizable plastic material, the first plastic material being a mixture of polycarbonate and of a semiaromatic polyester and the second plastic material being a polyamide.

公开(公告)号：US10070518B2

公开(公告)日：2018-09-04

申请号：US14512815

申请日：2014-10-13

Applicant: Isola USA Corp.

Inventor： Tarun Amla ,  Johann R. Schumacher ,  Sascha Kreuer ,  Peggy Conn ,  Stanley E. Wilson

IPC: H05K1/03 ,  C08J5/24 ,  H01B3/40 ,  H05K1/02

CPC classification number: H05K1/0366 ,  C08J5/24 ,  C08J2300/22 ,  C08J2300/24 ,  H01B3/40 ,  H05K1/024 ,  H05K1/0248 ,  H05K1/0373 ,  H05K2201/0195 ,  Y10T428/24802 ,  Y10T428/2481 ,  Y10T428/24893 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: Prepregs and laminates made from resin compositions having a free resin portion and a resin impregnated reinforcing material portion where the resin includes one or more base resins and one or more high Dk materials wherein the one or more high Dk materials are present in the resin composition in an amount sufficient to impart the resin composition with a cured DkW that matches the DkWR of a resin impregnated reinforcing material to which the resin composition is applied to within plus or minus (±) 15%.

公开(公告)号：US10059798B2

公开(公告)日：2018-08-28

申请号：US14436202

申请日：2013-10-02

Applicant: DIC Corporation

Inventor： Kazuo Arita ,  Tomohiro Shimono

IPC: C08G63/137 ,  C08L63/00 ,  C08G63/00 ,  C09D167/00 ,  C09D163/00 ,  C09J167/00 ,  C09J163/00 ,  H05K1/03 ,  C08J5/24 ,  C08G59/62

CPC classification number: C08G63/00 ,  C08G59/62 ,  C08G63/137 ,  C08J5/24 ,  C08J2363/00 ,  C08J2367/00 ,  C08J2463/00 ,  C08J2467/00 ,  C08J2467/03 ,  C08L63/00 ,  C08L67/00 ,  C09D163/00 ,  C09D167/00 ,  C09J163/00 ,  C09J167/00 ,  H05K1/0353 ,  Y10T428/24917

Abstract: An active ester resin having a molecular structure represented by Structural Formula (1) where X represents a benzene ring or a naphthalene ring, each R1 independently represents a methyl group or a hydrogen atom, k is 0 or 1, n is 1 or 2, l is 1 or 2, and m is the average of a repeating unit and from 0.25 to 1.5. The active ester resin, as a curing agent, can be combined with an epoxy resin to form at least an epoxy resin composition, a cured product, a prepreg, a circuit board and a build-up film.

公开(公告)号：US10000655B2

公开(公告)日：2018-06-19

申请号：US14423420

申请日：2013-07-29

Applicant: LG CHEM, LTD.

Inventor： Joon-Koo Kang ,  Yeong-Rae Chang ,  Sung-Don Hong ,  Soon-Hwa Jung ,  Eun-Kyu Her

IPC: C09D133/14 ,  C08L33/04 ,  C09D135/02 ,  C08J7/04 ,  C09D105/16 ,  C09D4/06 ,  C08J5/18

CPC classification number: C09D133/14 ,  C08J5/18 ,  C08J7/042 ,  C08J7/047 ,  C08J2333/04 ,  C08J2367/02 ,  C08J2433/00 ,  C08J2433/08 ,  C08L33/04 ,  C09D4/06 ,  C09D105/16 ,  C09D135/02 ,  Y10T428/24917 ,  Y10T428/269 ,  Y10T428/2848 ,  Y10T442/10

Abstract: Disclosed herein is a hard coating composition used in forming a hard coating film exhibiting high hardness and excellent properties. The hard coating composition can be used to prepare a hard coating film exhibiting high impact resistance, high scratch resistance and high transparency and having excellent processability.

公开(公告)号：US09909026B2

公开(公告)日：2018-03-06

申请号：US14422437

申请日：2013-07-29

Applicant: LG CHEM, LTD.

Inventor： Joon-Koo Kang ,  Yeong-Rae Chang ,  Sung-Don Hong ,  Soon-Hwa Jung ,  Eun-Kyu Her

IPC: C09D133/14 ,  C08L33/04 ,  C09D135/02 ,  C08J7/04 ,  C09D105/16 ,  C09D4/06 ,  C08J5/18

CPC classification number: C09D133/14 ,  C08J5/18 ,  C08J7/042 ,  C08J7/047 ,  C08J2333/04 ,  C08J2367/02 ,  C08J2433/00 ,  C08J2433/08 ,  C08L33/04 ,  C09D4/06 ,  C09D105/16 ,  C09D135/02 ,  Y10T428/24917 ,  Y10T428/269 ,  Y10T428/2848 ,  Y10T442/10

Abstract: Disclosed is a hard coating film with high impact resistance and superior physical properties, including high hardness, scratch resistance and transparency, and high processability.

公开(公告)号：US09823246B2

公开(公告)日：2017-11-21

申请号：US13728798

申请日：2012-12-27

Applicant: The Board of Trustees of the Leland Stanford Junior University

Inventor： Hongjie Dai ,  Scott M. Tabakman ,  Guosong Hong ,  Bo Zhang

IPC: G01N33/553 ,  G01N21/65

CPC classification number: G01N33/553 ,  G01N21/658 ,  G01N2610/00 ,  Y10T428/24851 ,  Y10T428/24909 ,  Y10T428/24917

Abstract: Disclosed are nanostructured gold films which may be produced by solution-phase depositions of gold ions onto a variety of surfaces. The resulting plasmonic gold films are used for enhanced spectroscopic-based immunoassays in multiplexed microarray format with detection mechanisms based on either surface-enhanced Raman scattering or near-infrared fluorescence enhancement. The preparation of the films and subsequent modifications of the gold film surfaces afford increased sensitivity for various microarrays. The films are discontinuous, forming gold “islands.” Sensitivity, size, shape, and density of the nanoscopic gold islands comprising the discontinuous nanostructured gold film are controlled to enhance the intensity of Raman scattering and fluorescence in the near-infrared, allowing for improved measurements in clinical diagnostic or biomedical research applications.