公开(公告)号：US5980722A

公开(公告)日：1999-11-09

申请号：US960511

申请日：1997-10-29

申请人： Tetsuya Kuroda ,  Hidezumi Katoh ,  Hitoshi Muramatsu

发明人： Tetsuya Kuroda ,  Hidezumi Katoh ,  Hitoshi Muramatsu

IPC分类号： C25D11/04 ,  C23C28/00 ,  C25D5/44 ,  C25D7/00 ,  C25D7/04 ,  C25D11/06 ,  C25D11/16 ,  C25D19/00 ,  C25F3/04 ,  C25D5/34

CPC分类号： C23C28/044 ,  C25D11/06 ,  C25D5/44

摘要： A method of plating an aluminum alloy, of which the steps are small in number and the productivity is improved as compared with conventional zincate conversion or anodic oxidation methods and which attains a decrease in cost and obviates the use of mixed acids, and a plated aluminum alloy of which the coating has excellent adhesion, the method comprising the steps of carrying out anodic etching of a silicon-containing aluminum alloy to protrude silicon from the surface of the aluminum alloy, optionally carrying out anodic oxidation of the aluminum alloy on its surface from which the silicon is protruded, and plating the aluminum alloy, and the plated aluminum alloy containing silicon in a state where the silicon bridges the aluminum alloy and the plating layer.

摘要翻译： 与常规的锌酸盐转化或阳极氧化方法相比，其数量少且生产率提高的铝合金电镀方法，其成本降​​低并且避免使用混合酸，并且镀铝 该方法包括以下步骤：对含铝铝合金进行阳极蚀刻以从铝合金表面突出硅，可选地在其表面上进行铝合金的阳极氧化 其中硅突出并镀铝合金，并且在硅与铝合金和电镀层桥接的状态下含有硅的镀铝合金。