摘要:
A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portions. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.
摘要:
According to one embodiment, a storage medium that stores position information indicating positions of a plurality of tracks in a radial direction in the tracks, wherein the position information includes: a first pattern in which a feed angle indicating a phase difference between the tracks is an angle obtained by adding a predetermined angle to +90°; a second pattern in which the feed angle is an angle obtained by adding the predetermined angle to −90°; and a third pattern in which the feed angle is the same as that of the first pattern.
摘要:
An information processing device connected with a plurality of devices through a network, comprises: a scheduling part for configuring a change date and time to change settings for each of the plurality of devices; a device status determination part for determining if each of the plurality of devices is ready for settings change at the same time as the scheduled change time on the day before the scheduled change date; a device status controlling part for causing the device not ready for the settings change to become ready for the settings change on the scheduled change date and time when it is determined by the device status determination part that one or more of the plurality of devices are not ready for the settings change; and a settings changing part for changing the settings for each of the plurality of devices on the scheduled change date and time.
摘要:
A heat pipe hinge structure for an electronic device comprises a heat pipe hinge member and a hinge portion. The heat pipe hinge member is made of a high heat-conductive material disposed at a coupling portion in which a pair of housing portions to be opened and closed are coupled. The heat pipe hinge member comprises a heat pipe hinge main body to receive a heat from a heat generating component disposed in one of the pair of housing portions, and a heat pipe holding portion provided in a vicinity of the heat pipe hinge main body to pivotably hold by an elastic member at least a part of a first heat pipe disposed in other of the pair of housing portion. The hinge portion is made of a low heat-conductive material to fix the heat pipe hinge member on at least one housing portion of the pair of housing portions.
摘要:
A cooling system for an electronic device including a heat generating component within a case, wherein the heat generating component is installed on a bottom plate of the case, the bottom plate has a ventilating hole for air passage formed therein, and a foot portion installed outer surface of the case for maintaining a prescribed vertically opened space below the lower surface of the case.