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公开(公告)号：US12096569B2
公开(公告)日：2024-09-17
申请号：US17078108
申请日：2020-10-23
发明人： Chun-Ta Yeh , Kuo-Pin Cheng , Chin-Long Lin
CPC分类号： H05K3/44 , H01L21/4882 , H01L23/3672 , H05K1/056 , H05K3/10 , H05K3/202 , H05K3/4608 , H05K1/0204 , H05K1/0209 , H05K1/05 , H05K2203/13
摘要： An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.
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公开(公告)号：US20240224421A1
公开(公告)日：2024-07-04
申请号：US18610636
申请日：2024-03-20
申请人： TOPPAN HOLDINGS INC.
发明人： Ryoma TANABE , Masahito Tanabe , Fusao Takagi
CPC分类号： H05K1/056 , H01L23/142 , H01L23/32 , H05K3/4626
摘要： A wiring board unit capable of reducing the stress inside the wiring board to reduce the risk of a crack being formed from a location where stress is concentrated. To achieve this, the present invention includes a first wiring board and a second wiring board bonded to the first wiring board. A semiconductor element being resin-sealed on a surface side of the second wiring board opposite to a surface for bonding with the first wiring board. A tensile strength of an insulating resin material used for the second wiring board and a width of a Cu pattern formed on the side opposite to the first wiring board give a value smaller than 0.5 when substituted in Formula 1 below.
1
/
(
1
+
Exp
(
-
A
)
)
A
=
-
1
5
.45
-
0.1654
×
Tensile
strength
+
11.31
×
log
(
Cu
pattern
width
)
(
1
)-
3.发明公开公开(公告)号：US20240199829A1
公开(公告)日：2024-06-20
申请号：US18588831
申请日：2024-02-27
申请人： AGC Inc.
发明人： Seigo KOTERA , Wataru KASAI , Junetsu NAKAMURA , Takatoshi YAOITA
IPC分类号： C08J5/18 , B29C71/02 , B29K27/18 , B29K105/00 , C08F214/26 , C08J5/12 , H05K1/05 , H05K3/02
CPC分类号： C08J5/18 , B29C71/02 , C08F214/265 , C08J5/121 , H05K1/056 , H05K3/022 , B29C2071/022 , B29K2027/18 , B29K2105/0085 , C08F2800/10 , C08J2327/18 , H05K2201/015
摘要： To provide a dielectric film which is excellent in dielectric properties and stability in the electric corrosion test and which is suitable for producing a high-precision printed board.
A roll film comprising a melt-processable fluororesin as the main component and having a thickness of from 1 to 100 μm, the dimensional change rate of which is less than 1.0%, in terms of an absolute value, in each of MD and TD, when heated at 150° C. for 30 minutes and then cooled to 25° C., based on the dimension at 25° C.-
公开(公告)号：US20240196528A1
公开(公告)日：2024-06-13
申请号：US18138893
申请日：2023-04-25
发明人： Sangik CHO , Mi Jung PARK , Mi Geum KIM , Yong Su LEE , Sung HAN , Jong Eun PARK
摘要： A printed circuit board includes: a first metal layer; an organic insulating layer covering at least a portion of the first metal layer and having a via hole exposing at least a portion of an upper surface of the first metal layer; a first seed metal layer disposed on an upper surface of the organic insulating layer; a second seed metal layer disposed on the first seed metal layer and extending onto a wall surface of the via hole and the exposed upper surface of the first metal layer; and a second metal layer disposed on the second seed metal layer and filling at least a portion of the via hole, wherein the first seed metal layer includes a first sputtering layer including titanium (Ti), and the second seed metal layer includes an electroless plating layer.
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公开(公告)号：US20240150567A1
公开(公告)日：2024-05-09
申请号：US18056323
申请日：2022-11-17
发明人： JEN-CHI CHIANG , MENG-HUEI CHEN
CPC分类号： C08L25/08 , C08J5/244 , H05K1/0366 , H05K1/056 , B32B5/024 , C08J2325/08 , C08J2425/10 , C08J2471/12 , C08L2205/03
摘要： A resin composition and the uses of it are provided. The resin composition comprises:
(A) a polyfunctional vinyl aromatic copolymer; and
(B) a diene compound, represented by the following formula (I)
wherein, in formula (I), R10 and R11 are independently H, a C1-C6 linear or branched alkyl, with the proviso that R10 and R11 are not simultaneously H; and
the polyfunctional vinyl aromatic copolymer (A) is prepared by copolymerizing one or more divinyl aromatic compounds with one or more monovinyl aromatic compounds.-
公开(公告)号：US20240117119A1
公开(公告)日：2024-04-11
申请号：US18275302
申请日：2022-02-04
发明人： Shintaro Hara , Fumiaki Ishikawa , Kyoka Susuki
CPC分类号： C08G73/1067 , C08K3/22 , C08L79/08 , H05K1/056 , C08K2003/2227 , H05K2201/0154
摘要： A polyimide resin composition includes a polyimide resin and a filler dispersed in the polyimide resin, in which the polyimide resin has a dicarboxylic acid group or an acid anhydride group of the dicarboxylic acid group at both ends, and the filler includes at least one inorganic compound selected from the group consisting of aluminum oxide, aluminum hydroxide, magnesium oxide, and magnesium hydroxide on a surface thereof.
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公开(公告)号：US11895770B2
公开(公告)日：2024-02-06
申请号：US17281845
申请日：2019-09-27
发明人： Yuki Inoue , Tatsuya Arisawa , Shun Yamaguchi
IPC分类号： H05K1/05 , G01N23/2273 , H05K1/09 , B32B15/08 , H05K3/00
CPC分类号： H05K1/056 , B32B15/08 , G01N23/2273 , H05K1/09 , H05K3/002 , H05K2201/0166 , H05K2201/0355
摘要： A copper-clad laminate includes an insulating layer and a copper foil in contact with at least one surface of the insulating layer, in which the insulating layer contains a cured product of a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond, a chromium element amount on an exposed surface on which the insulating layer is exposed by an etching treatment of the copper-clad laminate with a copper chloride solution, measured by X-ray photoelectron spectroscopy is 7.5 at % or less with respect to a total element amount measured by X-ray photoelectron spectroscopy, and a surface roughness of the exposed surface is 2.0 μm or less in terms of ten-point average roughness.
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公开(公告)号：US20230199954A1
公开(公告)日：2023-06-22
申请号：US18111738
申请日：2023-02-20
申请人： Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. , GARUDA TECHNOLOGY CO., LTD.
发明人： LIN-JIE GAO , YONG-CHAO WEI
CPC分类号： H05K1/114 , H05K3/0041 , H05K1/056 , H05K3/3452 , H05K3/421 , H05K2203/0415 , H05K2201/0191 , H05K2201/09036 , H05K2201/09509 , H05K2201/0358 , H05K2201/0195
摘要： A circuit board includes an inner circuit substrate and an outer circuit substrate electrically connected to the inner circuit substrate. The outer circuit substrate includes an outer dielectric layer and an outer circuit layer facing the inner circuit substrate embedded in the outer dielectric layer. A portion of the outer circuit layer facing away from the inner circuit substrate protruding from the outer dielectric layer. The circuit board can increase contact area between the outer circuit layer and the outer dielectric layer, improving adhesion between the outer circuit layer and the outer dielectric layer, and reducing a thickness of the outer circuit substrate, thereby reducing the overall thickness of the circuit board.
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公开(公告)号：US11665859B2
公开(公告)日：2023-05-30
申请号：US17349573
申请日：2021-06-16
申请人： G2F Tech Co., Ltd.
发明人： Jie-Qi Lu
CPC分类号： H05K7/20509 , H05K1/056
摘要： The present invention provides a heat dissipation conductive flexible board, which is assembled from: at least a single layer thin board, the structure of which includes a first conductive thin layer and a first functional thin layer, and at least a double layer thin board, the structure of which includes a second conductive thin layer, a second functional thin layer, and a third functional thin layer. A spraying, coating, or printing method is used to manufacture the single layer thin board and the double layer thin board; after which the single layer thin board and the double layer thin board are laminated together to form the heat dissipation conductive flexible board having a multi-layer conductive structure.
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公开(公告)号：US10039180B2
公开(公告)日：2018-07-31
申请号：US15511841
申请日：2016-04-05
IPC分类号： C03C8/16 , H05K1/02 , C03C8/20 , C03C8/02 , C03C3/062 , C03C3/076 , C03C4/16 , C09K5/14 , H05K1/05 , H05K3/46 , C03B19/00
CPC分类号： H05K1/0204 , C03B19/00 , C03C3/062 , C03C3/076 , C03C4/16 , C03C8/02 , C03C8/16 , C03C8/20 , C03C2204/00 , C03C2205/00 , C09K5/14 , H05K1/0209 , H05K1/0271 , H05K1/0373 , H05K1/05 , H05K1/056 , H05K3/4608 , H05K2201/0209 , H05K2201/068
摘要： A dielectric tape suitable for use in an electronic device is provided. A dielectric slip composition comprises an organic vehicle and a dielectric glass composition comprising at least about 20 wt % and no more than about 50 wt % silicon dioxide, based upon 100% total weight of the glass composition, at least about 10 wt % and no more than about 50 wt % alkali metal oxides, based upon 100% total weight of the glass composition, and at least about 1 wt % and no more than about 10 wt % of at least one transition metal oxide. A method of forming an electronic device is also provided. The method includes the steps of applying at least one dielectric tape to at least one non-planar surface of a substrate, and subjecting the at least one dielectric tape to one or more thermal treatment steps to form a dielectric layer.
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