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    HEAT-RESISTANT INSULATED WIRE
    7.
    发明公开
    HEAT-RESISTANT INSULATED WIRE 审中-公开

    公开(公告)号：US20230162886A1

    公开(公告)日：2023-05-25

    申请号：US17919181

    申请日：2021-04-16

    申请人： TOTOKU ELECTRIC CO., LTD.

    发明人： Katsuo HANYU ,  Hiroshi KITAZAWA ,  Shohei KOMAMURA ,  Yuichi NAKAJYO ,  Yuki SHIMIZU ,  Makoto MIYASHITA

    IPC分类号： H01B7/29 ,  H01B3/44

    CPC分类号： H01B7/292 ,  H01B3/445

    摘要： A heat-resistant insulated wire that is used for a wiring or a winding in a device, has a high partial discharge starting voltage, and can achieve heat resistance and oxidation suppression of a conductor surface. The heat-resistant insulated wire (10) comprising a conductor (1), a baked film layer (2) provided on an outer periphery of the conductor (1), and an insulating film (3) provided on the baked film layer (2). The baked film layer (2) is a thermosetting resin layer, and the insulating film (3) is an extrusion-coated fluororesin layer. Preferably the baked film layer (2) is a urethane resin layer and has a thickness within a range of 5 to 30 μm, and preferably a diameter of the conductor (1) is within a range of 0.08 to 0.30 mm and a thickness of the insulating film (3) is within a range of 0.05 to 0.10 mm.

    Surface Treating Magnet Wire Enamel Layers To Promote Layer Adhesion
    9.
    发明申请
    Surface Treating Magnet Wire Enamel Layers To Promote Layer Adhesion 审中-公开

    公开(公告)号：US20180322980A1

    公开(公告)日：2018-11-08

    申请号：US15966736

    申请日：2018-04-30

    申请人： Essex Group, Inc.

    发明人： Matthew Leach ,  Allan R. Knerr

    IPC分类号： H01B3/30 ,  H01B3/08 ,  H01B7/29

    CPC分类号： H01B3/30 ,  H01B3/081 ,  H01B7/292

    摘要： A method for forming an insulated winding wire with enhanced adhesion between enamel layers is described. A conductor may be provided, and a first enamel layer may be formed around the conductor. The first enamel layer may include a first thermoset polymeric material. An outer surface of the first enamel layer maybe modified, for example, by a plasma, corona, ultraviolet, or flame treatment. The surface modification may alter a surface energy of the first enamel layer. A second enamel layer may be formed on the first enamel layer, and the second enamel layer may include a second thermoset polymeric material.

    HIGH FREQUENCY CABLE
    10.
    发明申请
    HIGH FREQUENCY CABLE 审中-公开

    公开(公告)号：US20180075945A1

    公开(公告)日：2018-03-15

    申请号：US15701531

    申请日：2017-09-12

    申请人： JUNKOSHA INC.

    发明人： Hiromi Yasumoto

    IPC分类号： H01B7/29 ,  H01B7/02

    CPC分类号： H01B7/292 ,  H01B7/02 ,  H01P3/06

    摘要： An object of the present invention is to provide a high frequency cable which may, for example, be used in a high bandwidth of 70 GHz or more and has high heat resistance.A high frequency cable for a high bandwidth of 70 GHz or more, includes: one or a plurality of cable bodies, each of which includes a central conductor and a dielectric layer provided at an outer side of the central conductor; and an outer tube which is provided at an outer side of the cable body, in which the outer tube includes a first structure body in a helical shape and a second structure body in a helical shape, an inner diameter of the first structure body is smaller than that of the second structure body, the first structure body and the second structure body are mutually fitted in helical pitches, and each of the first structure body and the second structure body includes a material having a thermal conductivity of 9 W·m−1·K−1 or more, and in which in a bent state of the cable, a helix at an outer ring side of the second structure body is configured to move to an inner ring side of the second structure body so that the helix is fitted in a state of being embedded in a gap formed at an outer ring side of the first structure body and is contacted with the cable body.