公开(公告)号：US20060125064A1

公开(公告)日：2006-06-15

申请号：US11344094

申请日：2006-02-01

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Hiroyuki Takeno ,  Hiroshi Shimoji ,  Fumio Murakami ,  Keiko Kurakawa

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Hiroyuki Takeno ,  Hiroshi Shimoji ,  Fumio Murakami ,  Keiko Kurakawa

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： It is intended to improve the production yield of QFN (Quad Flat Non-leaded package) and attain a multi-pin structure. After a resin sealing member for sealing a semiconductor chip is formed by molding, a peripheral portion of the resin sealing member and a lead frame are both cut along a cutting line which is positioned inside (on a central side of the resin sealing member) of a line (molding line) extending along an outer edge of the resin sealing member, whereby the whole surface (upper and lower surfaces and both side faces) of each of leads exposed to side faces (cut faces) of the resin sealing member is covered with resin, thus preventing the occurrence of metallic burrs on the cut faces of the leads.

摘要翻译： 旨在提高QFN（四方扁平无铅封装）的生产成本，达到多引脚结构。 在通过模塑形成用于密封半导体芯片的树脂密封构件之后，树脂密封构件的周边部分和引线框架都沿着位于树脂密封构件的内侧（树脂密封构件的中心侧）上的切割线切割 沿着树脂密封构件的外缘延伸的线（成型线），从而覆盖暴露于树脂密封构件的侧面（切割面）的各个引线的整个表面（上下表面和两个侧面） 树脂，从而防止在引线的切割面上发生金属毛刺。

公开(公告)号：US07019388B2

公开(公告)日：2006-03-28

申请号：US10729950

申请日：2003-12-09

申请人： Fujio Ito ,  Hiromichi Suzuki ,  Hiroyuki Takeno ,  Hiroshi Shimoji ,  Fumio Murakami ,  Keiko Kurakawa

发明人： Fujio Ito ,  Hiromichi Suzuki ,  Hiroyuki Takeno ,  Hiroshi Shimoji ,  Fumio Murakami ,  Keiko Kurakawa

IPC分类号： H01L23/495

CPC分类号： H01L24/97 ,  H01L21/565 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： It is intended to improve the production yield of QFN (Quad Flat Non-leaded package) and attain a multi-pin structure. After a resin sealing member for sealing a semiconductor chip is formed by molding, a peripheral portion of the resin sealing member and a lead frame are both cut along a cutting line which is positioned inside (on a central side of the resin sealing member) of a line (molding line) extending along an outer edge of the resin sealing member, whereby the whole surface (upper and lower surfaces and both side faces) of each of leads exposed to side faces (cut faces) of the resin sealing member is covered with resin, thus preventing the occurrence of metallic burrs on the cut faces of the leads.

摘要翻译： 旨在提高QFN（四方扁平无铅封装）的生产成本，达到多引脚结构。 在通过模塑形成用于密封半导体芯片的树脂密封构件之后，树脂密封构件的周边部分和引线框架都沿着位于树脂密封构件的内侧（树脂密封构件的中心侧）上的切割线切割 沿着树脂密封构件的外缘延伸的线（成型线），从而覆盖暴露于树脂密封构件的侧面（切割面）的各个引线的整个表面（上下表面和两个侧面） 树脂，从而防止在引线的切割面上发生金属毛刺。