公开(公告)号：US06853941B2

公开(公告)日：2005-02-08

申请号：US10136710

申请日：2002-04-30

Applicant: Hui Wang ,  Kenichi Kanai ,  Hiroyasu Koike

Inventor： Hui Wang ,  Kenichi Kanai ,  Hiroyasu Koike

IPC: G01R31/305 ,  G01R31/00

CPC classification number: G01R31/305

Abstract: Methods and apparatus, including computer program products, implementing and using techniques for open-loop waveform acquisition. In general, in one aspect, the invention provides a method for open-loop waveform acquisition. The method includes acquiring an S-curve of an acquisition loop of an electron-beam probe system. The S-curve represents a response of the acquisition loop to changes of potential differences between the acquisition loop and a device under test. The method includes calibrating the acquisition loop to obtain a linear region in the acquired S-curve and using the linear portion of the acquired S-curve to calculate voltage at a probe point of the device under test.

Abstract translation: 方法和设备，包括计算机程序产品，实现和使用开环波形采集技术。 通常，一方面，本发明提供了一种开环波形采集方法。 该方法包括获取电子束探针系统的采集环路的S曲线。 S曲线表示采集环路对采集环路和被测器件之间的电位差的变化的响应。 该方法包括校准采集环路以获得所获得的S曲线中的线性区域，并且使用获取的S曲线的线性部分来计算被测器件的探针点处的电压。

公开(公告)号：US4285659A

公开(公告)日：1981-08-25

申请号：US31609

申请日：1979-04-19

Applicant: Hiroyasu Koike

Inventor： Hiroyasu Koike

IPC: B29C45/26 ,  B29C45/27

CPC classification number: B29C45/2602 ,  B29C45/27 ,  B29C2045/388 ,  B29K2101/12 ,  Y10S425/051

Abstract: The present invention relates to a mold device for an injection molding machine which consists of an injection machine and a mold device. The mold device is divided into two portions, namely, a mounting portion and a molding portion, which are designed so that they may be handled individually and/or integrally. The present invention further provides an arrangement in which the molding portion may be installed on the mounting portion with considerable transverse tolerance, despite employment of a hot runner system therein.

Abstract translation: 本发明涉及一种由注射机和模具装置组成的注射成型机的模具装置。 模具装置被分成两部分，即，安装部分和模制部分，其被设计成使得它们可以单独地和/或整体地被处理。 本发明还提供了一种结构，其中尽管在其中使用了热流道系统，其中模制部分可以以相当大的横向公差安装在安装部分上。