公开(公告)号：US06483331B2

公开(公告)日：2002-11-19

申请号：US09823958

申请日：2001-03-28

申请人： Hiroyuki Tamaru ,  Mitsuo Fujii

发明人： Hiroyuki Tamaru ,  Mitsuo Fujii

IPC分类号： G01R3102

CPC分类号： G01R31/31905 ,  G01R1/06761 ,  G01R1/07307 ,  G01R1/07364 ,  G01R31/2886

摘要： A connection portion having a plurality of pads is provided on a test board. On the connection portion, a plurality of anisotropic conductive sheets, the sheet for the power source and the sheet for grounding are provided in an alternate manner. The connection portion and the semiconductor device are connected via the anisotropic conductive sheet, the sheet for the power source and the sheet for grounding. When the pin arrangement of the semiconductor device is changed, the sheet for the power source and the sheet for the grounding are changed.

摘要翻译： 具有多个焊盘的连接部分设置在测试板上。 在连接部分上，以交替的方式设置多个各向异性导电片，用于电源的片和用于接地的片。 连接部分和半导体器件经由各向异性导电片，用于电源的片和用于接地的片连接。 当半导体器件的引脚布置改变时，用于电源的片材和用于接地的片材改变。

公开(公告)号：US06566899B2

公开(公告)日：2003-05-20

申请号：US10256704

申请日：2002-09-27

申请人： Hiroyuki Tamaru ,  Mitsuo Fujii

发明人： Hiroyuki Tamaru ,  Mitsuo Fujii

IPC分类号： G01R3102

CPC分类号： G01R31/31905 ,  G01R1/06761 ,  G01R1/07307 ,  G01R1/07364 ,  G01R31/2886

摘要： A connection portion having a plurality of pads is provided on a test board. On the connection portion, a plurality of anisotropic conductive sheets, the sheet for the power source and the sheet for grounding are provided in an alternate manner. The connection portion and the semiconductor device are connected via the anisotropic conductive sheet, the sheet for the power source and the sheet for grounding. When the pin arrangement of the semiconductor device is changed, the sheet for the power source and the sheet for the grounding are changed.