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公开(公告)号：US07775681B2
公开(公告)日：2010-08-17
申请号：US11862084
申请日：2007-09-26
申请人： Yong Suk Kim , Hoon Hurh , Geun Ho Kim
发明人： Yong Suk Kim , Hoon Hurh , Geun Ho Kim
IPC分类号： F21V21/00
CPC分类号： H05K1/142 , G02F1/133603 , G02F2001/133612 , H05K1/0286 , H05K3/0052 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446
摘要： A backlight unit including a circuit board mounted with light emitting diodes and formed with connecting pads electrically connected with the light emitting diodes, a driver installed on one surface of the circuit board and configured to drive the light emitting diodes, a connector coupled to the connecting pads of the circuit board, in which the connector has a connecting direction changed toward the driver, and a connecting line for connecting the connector to the driver.
摘要翻译： 一种背光单元，包括安装有发光二极管并形成有与发光二极管电连接的连接焊盘的电路板，安装在电路板的一个表面上并被配置为驱动发光二极管的驱动器，连接器连接到连接 电路板的焊盘，其中连接器具有朝向驱动器的连接方向，以及用于将连接器连接到驱动器的连接线。
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2.发明申请LENS, MANUFACTURING METHOD THEREOF AND LIGHT EMITTING DEVICE PACKAGE USING THE SAME 审中-公开镜头及其制造方法及其发光装置公开(公告)号：US20100148205A1
公开(公告)日：2010-06-17
申请号：US12709113
申请日：2010-02-19
申请人： Yong Suk Kim , Hoon Hurh , Geun Ho Kim , Yu Ho Won
发明人： Yong Suk Kim , Hoon Hurh , Geun Ho Kim , Yu Ho Won
IPC分类号： H01L33/00
CPC分类号： G02B7/022 , H01L33/483 , H01L33/54
摘要： A lens and a light emitting device package formed by introducing surface mount technology (SMI) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion.
摘要翻译： 公开了通过引入表面贴装技术（SMI）形成的透镜和发光器件封装。 透镜包括折射入射光的折射部分和至少一个表面安装部分，其中表面安装部分的一部分形成在折射部分中。
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3.发明申请Lens, manufacturing method thereof and light emitting device package using the same 有权透镜及其制造方法以及使用其的发光器件封装公开(公告)号：US20080088953A1
公开(公告)日：2008-04-17
申请号：US11902779
申请日：2007-09-25
CPC分类号： G02B7/022 , H01L33/483 , H01L33/54
摘要： A lens and a light emitting device package formed by introducing surface mount technology (SMT) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion.
摘要翻译： 公开了通过引入表面贴装技术（SMT）形成的透镜和发光器件封装。 透镜包括折射入射光的折射部分和至少一个表面安装部分，其中表面安装部分的一部分形成在折射部分中。
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4.发明授权Lens, manufacturing method thereof and light emitting device package using the same 有权透镜及其制造方法以及使用其的发光器件封装公开(公告)号：US07733573B2
公开(公告)日：2010-06-08
申请号：US11902779
申请日：2007-09-25
申请人： Yong Suk Kim , Hoon Hurh , Geun Ho Kim , Yu Ho Won
发明人： Yong Suk Kim , Hoon Hurh , Geun Ho Kim , Yu Ho Won
CPC分类号： G02B7/022 , H01L33/483 , H01L33/54
摘要： A lens and a light emitting device package formed by introducing surface mount technology (SMT) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion.
摘要翻译： 公开了通过引入表面贴装技术（SMT）形成的透镜和发光器件封装。 透镜包括折射入射光的折射部分和至少一个表面安装部分，其中表面安装部分的一部分形成在折射部分中。
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公开(公告)号：US20080211987A1
公开(公告)日：2008-09-04
申请号：US11862084
申请日：2007-09-26
申请人： Yong Suk KIM , Hoon Hurh , Geun Ho Kim
发明人： Yong Suk KIM , Hoon Hurh , Geun Ho Kim
IPC分类号： G02F1/1335 , F21V17/00
CPC分类号： H05K1/142 , G02F1/133603 , G02F2001/133612 , H05K1/0286 , H05K3/0052 , H05K2201/10106 , H05K2201/10189 , H05K2201/10446
摘要： A backlight unit including a circuit board mounted with light emitting diodes and formed with connecting pads electrically connected with the light emitting diodes, a driver installed on one surface of the circuit board and configured to drive the light emitting diodes, a connector coupled to the connecting pads of the circuit board, in which the connector has a connecting direction changed toward the driver, and a connecting line for connecting the connector to the driver.
摘要翻译： 一种背光单元，包括安装有发光二极管并形成有与发光二极管电连接的连接焊盘的电路板，安装在电路板的一个表面上并被配置为驱动发光二极管的驱动器，连接器连接到连接 电路板的焊盘，其中连接器具有朝向驱动器的连接方向，以及用于将连接器连接到驱动器的连接线。
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