公开(公告)号：US20080088953A1

公开(公告)日：2008-04-17

申请号：US11902779

申请日：2007-09-25

申请人： Yong Kim ,  Hoon Hurh ,  Geun Kim ,  Yu Won

发明人： Yong Kim ,  Hoon Hurh ,  Geun Kim ,  Yu Won

IPC分类号： G02B7/02 ,  B29D11/00

CPC分类号： G02B7/022 ,  H01L33/483 ,  H01L33/54

摘要： A lens and a light emitting device package formed by introducing surface mount technology (SMT) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion.

摘要翻译： 公开了通过引入表面贴装技术（SMT）形成的透镜和发光器件封装。 透镜包括折射入射光的折射部分和至少一个表面安装部分，其中表面安装部分的一部分形成在折射部分中。

公开(公告)号：US20070210325A1

公开(公告)日：2007-09-13

申请号：US11701460

申请日：2007-02-02

申请人： Kwang Park ,  Yu Won

发明人： Kwang Park ,  Yu Won

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L33/642 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A lead frame and a light emitting device package using the same are disclosed. More particularly, a lead frame and a light emitting device package using the lead frame which can be easily manufactured and employ a multi-chip structure. The light emitting device package includes a first frame including a heat sink, a second frame coupled to an upper side of the first frame, the second frame including at least one pair of leads and a mount formed with a hole, and a molded structure for coupling the first and second frames to each other.

摘要翻译： 公开了一种引线框和使用该引线框的发光器件封装。 更具体地，引线框架和使用引线框架的发光器件封装，其可以容易地制造并采用多芯片结构。 发光器件封装包括第一框架，其包括散热器，耦合到第一框架的上侧的第二框架，第二框架包括至少一对引线和形成有孔的安装件，以及用于 将第一和第二框架彼此联接。