FULL CMOS SRAM
    1.
    发明申请
    FULL CMOS SRAM 失效
    全CMOS SRAM

    公开(公告)号:US20100195375A1

    公开(公告)日:2010-08-05

    申请号:US12686545

    申请日:2010-01-13

    IPC分类号: G11C11/00 H01L27/11

    摘要: A full complementary metal-oxide semiconductor (CMOS) static random access memory (SRAM) may have a reduced cell size by arranging a word line of a pair of transistors arranged on the uppermost layer of the SRAM. First and second transistors may be arranged on first and second active regions. Third and fourth transistors may be arranged on first and second semiconductor layers formed over the first and second active regions. Fifth and sixth transistors may be arranged on the third and fourth semiconductor layers over the first and second semiconductor layers. A word line may be arranged in a straight line between the first and second gates of the first and second transistors and between the third and fourth gates of the third and fourth transistors.

    摘要翻译: 通过布置在SRAM的最上层的一对晶体管的字线,完全互补的金属氧化物半导体(CMOS)静态随机存取存储器(SRAM)可以具有减小的单元尺寸。 第一和第二晶体管可以布置在第一和第二有源区上。 第三和第四晶体管可以布置在形成在第一和第二有源区上的第一和第二半导体层上。 第五和第六晶体管可以布置在第一和第二半导体层上的第三和第四半导体层上。 字线可以布置在第一和第二晶体管的第一和第二栅极之间以及第三和第四晶体管的第三和第四栅极之间的直线上。