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公开(公告)号:US20240341074A1
公开(公告)日:2024-10-10
申请号:US18749271
申请日:2024-06-20
Applicant: Socionext Inc.
Inventor: Masanobu HIROSE , Yasunori MURASE
IPC: H10B10/00 , G11C11/412 , G11C11/419
CPC classification number: H10B10/12 , G11C11/412 , G11C11/419 , H10B10/18
Abstract: Nanosheets 21 to 23 are formed in line in this order in the X direction, and nanosheets 24 to 26 are formed in line in this order in the X direction. In a buried interconnect layer, a power line 11 is formed between the nanosheets 22 and 25 as viewed in plan. A face of the nanosheet 22 on a first side as one of the sides in the X direction is exposed from a gate interconnect 32. A face of the nanosheet 25 on a second side as the other side in the X direction is exposed from a gate interconnect 35.
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公开(公告)号:US20240341073A1
公开(公告)日:2024-10-10
申请号:US18748475
申请日:2024-06-20
Inventor: Chih-Chuan YANG , Kuo-Hsiu HSU , Chia-Hao PAO , Shih-Hao LIN
IPC: H10B10/00 , G11C11/412 , G11C11/417 , H01L27/092
CPC classification number: H10B10/12 , G11C11/412 , G11C11/417 , H01L27/092
Abstract: A four times contacted poly pitch (4CPP) static random-access memory (SRAM) cell layout is disclosed that forms six SRAM transistors from one OD region and four poly lines at a frontside of a substrate and provides a double-sided routing structure for word lines, bit lines, and/or voltage lines. For example, a vertical SRAM is disclosed that stacks transistors, vertically, to facilitate scaling needed for advanced IC technology nodes and improve memory performance. The vertical SRAM further includes a double-sided routing structure, which facilitates placement of bit lines, word lines, and voltage lines in a backside metal one (M1) layer and/or a frontside M1 layer to minimize line capacitance and line resistance.
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公开(公告)号:US12114473B2
公开(公告)日:2024-10-08
申请号:US17828123
申请日:2022-05-31
Inventor: Jhon-Jhy Liaw
IPC: G11C7/12 , G11C11/412 , G11C11/413 , G11C11/419 , H10B10/00 , G11C8/08 , G11C8/16
CPC classification number: H10B10/18 , G11C11/412 , G11C11/413 , G11C11/419 , G11C7/12 , G11C8/08 , G11C8/16
Abstract: Semiconductor devices are provided. A write port circuit is configured to perform a write function according to the write word line and the first and second write bit lines. The first read port circuit is configured to perform first read function according to the first read bit line and the first read word line. The second read port circuit is configured to perform second read function according to the second read bit line and the second read word line. The transistors of the first and second read port circuits share a first active structure extending in the first direction. The first read bit line and the second read bit line extend in the first direction in a first metallization layer, and the first write bit line and the second write bit line extend in the first direction in a second metallization layer over the first metallization layer.
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公开(公告)号:US20240331765A1
公开(公告)日:2024-10-03
申请号:US18741051
申请日:2024-06-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Ping-Wei Wang , Chia-Hao Pao , Choh Fei Yeap , Yu-Kuan Lin , Kian-Long Lim
IPC: G11C11/412 , G11C11/419 , H10B10/00
CPC classification number: G11C11/412 , G11C11/419 , H10B10/12
Abstract: Memory devices are provided. In an embodiment, a memory device includes a static random access memory (SRAM) array. The SRAM array includes a static random access memory (SRAM) array. The SRAM array includes a first subarray including a plurality of first SRAM cells and a second subarray including a plurality of second SRAM cells. Each n-type transistor in the plurality of first SRAM cells includes a first work function stack and each n-type transistor in the plurality of second SRAM cells includes a second work function stack different from the first work function stack.
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公开(公告)号:US12106801B2
公开(公告)日:2024-10-01
申请号:US17858376
申请日:2022-07-06
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Jhon Jhy Liaw
IPC: G11C11/412 , G11C11/419 , G11C5/02 , G11C7/10 , G11C7/12
CPC classification number: G11C11/419 , G11C11/412 , G11C5/025 , G11C7/1096 , G11C7/12
Abstract: An array of memory cells is arranged into a plurality of columns and rows. A first signal line extends through a first column of the plurality of columns. The first signal line is electrically coupled to the memory cells in the first column. A first end portion of the first signal line is configured to receive a logic high signal from a first circuit during a first operational state of the memory device and a logic low signal from the first circuit during a second operational state of the memory device. A second circuit includes a plurality of transistors. The transistors are configured to be turned on or off to electrically couple a second end portion of the first signal line to a logic low source when the first end portion of the first signal line is configured to receive the logic low signal from the first circuit.
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公开(公告)号:US12101921B2
公开(公告)日:2024-09-24
申请号:US17871764
申请日:2022-07-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shih-Hao Lin , Chih-Chuan Yang , Hsin-Wen Su , Kian-Long Lim , Chien-Chih Lin
IPC: H10B10/00 , G11C11/412 , H01L21/28 , H01L21/8238 , H01L27/092 , H01L29/08 , H01L29/10 , H01L29/49 , H01L29/66
CPC classification number: H10B10/12 , G11C11/412 , H01L21/28123 , H01L21/823807 , H01L21/823814 , H01L21/823821 , H01L21/823864 , H01L27/0922 , H01L27/0924 , H01L29/0847 , H01L29/1037 , H01L29/4991 , H01L29/66545 , H01L29/6656
Abstract: An N-type metal oxide semiconductor (NMOS) transistor includes a first gate and a first spacer structure disposed on a first sidewall of the first gate in a first direction. The first spacer structure has a first thickness in the first direction and measured from an outermost point of an outer surface of the first spacer structure to the first sidewall. A P-type metal oxide semiconductor (PMOS) transistor includes a second gate and a second spacer structure disposed on a second sidewall of the second gate in the first direction and measured from an outermost point of an outer surface of the second spacer structure to the second sidewall. The second spacer structure has a second thickness that is greater than the first thickness. The NMOS transistor is a pass-gate of a static random access memory (SRAM) cell, and the PMOS transistor is a pull-up of the SRAM cell.
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公开(公告)号:US20240296883A1
公开(公告)日:2024-09-05
申请号:US18418060
申请日:2024-01-19
Applicant: FlashSilicon Incorporation
Inventor: LEE WANG
IPC: G11C11/419 , G11C11/412 , G11C11/418
CPC classification number: G11C11/419 , G11C11/412 , G11C11/418
Abstract: A memory device is disclosed, comprising a 4T-SRAM cell and a read circuit. The 4T-SRAM cell comprising two P-type MOSFET devices for a data bit storage and two N-type MOSFET for accessing switches has benefits of less numbers of MOSFET devices for smaller cell size and low leakage current than the conventional 6T-SRAM cell. The read circuit comprises a latch and a discharge device. The latch with two output nodes is coupled between a supply voltage rail and a ground voltage rail. The discharge device is coupled to the two output nodes, a bit line pair and the ground voltage rail. Since one of two storage nodes for the 4T-SRAM cell is floating, the stored data in the 4T-SRAM cell is vulnerable for conventional read operations. The read circuit of the invention resolves the vulnerability issue of the 4T-SRAM cell.
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公开(公告)号:US12068027B2
公开(公告)日:2024-08-20
申请号:US17890290
申请日:2022-08-18
Inventor: Robert Giterman , Andreas Burg , Halil Andac Yigit
IPC: G11C11/41 , G11C11/412 , G11C11/419 , H01L27/088 , H01L29/78 , H10B10/00
CPC classification number: G11C11/419 , G11C11/412 , H01L27/0886 , H01L29/785 , H10B10/12
Abstract: A fin field-effect transistor (FinFET) based semiconductor memory array having a plurality of memory cells, each memory cell including a write transistor having a write wordline gate over a first fin connected to a write wordline gate contact, a write bitline contact in connection with the first fin, and a storage node contact in connection with the first fin, and a read transistor having a storage node gate over a second fin, the storage node gate connected to a storage node gate contact, the storage node gate contact connected to the storage node contact, a read wordline contact in connection with the second fin, and a read bitline contact in connection with the second fin, wherein the write wordline gate and the storage node gate are arranged in series to each other along an extension axis that coincides with an longitudinal axis of the write wordline gate and a longitudinal axis of the storage node gate.
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公开(公告)号:US12068026B2
公开(公告)日:2024-08-20
申请号:US17852677
申请日:2022-06-29
Applicant: STMicroelectronics International N.V.
Inventor: Harsh Rawat , Praveen Kumar Verma
IPC: G11C11/419 , G11C11/412
CPC classification number: G11C11/419 , G11C11/412
Abstract: A method of memory reset includes precharging bit lines of a memory array, asserting a signal at a reset node to remove the precharge voltage, and selecting write drivers associated with the bit lines associated with columns of the memory array that contain memory cells to be reset, with the assertion of the signal at the reset node also resulting in application of desired logic states to inputs of the selected write drivers to cause those selected write drivers to change a logic state of the bit lines associated with those write drivers. The method continues with asserting each word line associated with a row of the memory that contains memory cells to be reset to write desired logic states to all of the memory cells of the columns and rows of the memory to be reset during a single clock cycle, and then deasserting those word lines.
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公开(公告)号:US12068025B2
公开(公告)日:2024-08-20
申请号:US17856928
申请日:2022-07-01
Applicant: Arm Limited
Inventor: Rahul Mathur , Edward Martin McCombs, Jr. , Hsin-Yu Chen
IPC: G11C11/00 , G11C11/412 , G11C11/418
CPC classification number: G11C11/418 , G11C11/412
Abstract: Various implementations described herein are directed to a device having memory with banks of bitcells with each bank having a bitcell array. The device may have header circuitry that powers-up a selected bank and powers-down unselected banks during a wake-up mode of operation. In some instances, only the selected bank of the memory is powered-up with the header circuitry during the wake-up mode of operation.
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