公开(公告)号：US20100043962A1

公开(公告)日：2010-02-25

申请号：US12196868

申请日：2008-08-22

申请人： Chih-Ming Chang ,  Hsin-En Chung ,  Yu-Feng Tseng

发明人： Chih-Ming Chang ,  Hsin-En Chung ,  Yu-Feng Tseng

IPC分类号： B32B37/06

CPC分类号： B32B37/26 ,  B32B38/0004 ,  B32B2305/076 ,  B32B2310/0843 ,  B32B2457/08 ,  H05K3/28 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49117

摘要： A fabrication method of a rigid-flex circuit board is described as follows. Firstly, a flexible circuit board and at least a cover layer are provided. The cover layer covers a surface of the flexible circuit board. A protection layer is then formed on the cover layer. Next, a substrate is laminated to the surface of the flexible circuit board. The substrate has a conductive layer and a prepreg disposed between the conductive layer and the cover layer. The prepreg has an opening for accommodating the protection layer. Thereafter, the conductive layer is patterned for forming a patterned conductive layer. Afterwards, the protection layer is removed.

摘要翻译： 刚挠电路板的制造方法如下所述。 首先，提供柔性电路板和至少覆盖层。 覆盖层覆盖柔性电路板的表面。 然后在覆盖层上形成保护层。 接下来，将基板层压到柔性电路板的表面。 衬底具有导电层和设置在导电层和覆盖层之间的预浸料。 预浸料坯具有用于容纳保护层的开口。 此后，对导电层进行图案化以形成图案化的导电层。 之后，保护层被去除。

公开(公告)号：US07942999B2

公开(公告)日：2011-05-17

申请号：US12196868

申请日：2008-08-22

申请人： Chih-Ming Chang ,  Hsin-En Chung ,  Yu-Feng Tseng

发明人： Chih-Ming Chang ,  Hsin-En Chung ,  Yu-Feng Tseng

IPC分类号： B32B37/00 ,  B32B37/06

CPC分类号： B32B37/26 ,  B32B38/0004 ,  B32B2305/076 ,  B32B2310/0843 ,  B32B2457/08 ,  H05K3/28 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/09127 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49117

摘要： A fabrication method of a rigid-flex circuit board is described as follows. Firstly, a flexible circuit board and at least a cover layer are provided. The cover layer covers a surface of the flexible circuit board. A protection layer is then formed on the cover layer. Next, a substrate is laminated to the surface of the flexible circuit board. The substrate has a conductive layer and a prepreg disposed between the conductive layer and the cover layer. The prepreg has an opening for accommodating the protection layer. Thereafter, the conductive layer is patterned for forming a patterned conductive layer. Afterwards, the protection layer is removed.

摘要翻译： 刚挠电路板的制造方法如下所述。 首先，提供柔性电路板和至少覆盖层。 覆盖层覆盖柔性电路板的表面。 然后在覆盖层上形成保护层。 接下来，将基板层压到柔性电路板的表面。 衬底具有导电层和设置在导电层和覆盖层之间的预浸料。 预浸料坯具有用于容纳保护层的开口。 此后，对导电层进行图案化以形成图案化的导电层。 之后，保护层被去除。