公开(公告)号：US6099386A

公开(公告)日：2000-08-08

申请号：US340404

申请日：1999-06-28

申请人： Pei-Wei Tsai ,  Huan-Jen Tseng ,  Chih-Hsien Chang ,  Yi-Hua Chin

发明人： Pei-Wei Tsai ,  Huan-Jen Tseng ,  Chih-Hsien Chang ,  Yi-Hua Chin

IPC分类号： B24B37/04 ,  B24B49/10 ,  B24B57/02 ,  H01L21/00 ,  B24B29/00

CPC分类号： H01L21/67253 ,  B24B37/04 ,  B24B49/10 ,  B24B57/02

摘要： The present invention provides a control device for maintaining a chemical mechanical polishing (CMP) machine in a wet mode, the CMP machine comprising a polishing pad, a slurry sprinkler for sprinkling liquid or deionized water, and at least one carrier head, the control device comprising a sensor positioned on the CMP machine for sensing the operational status of the slurry sprinkler and generating a corresponding sensing signal; and a control unit electrically connected to the sensor for measuring the time period over which the slurry sprinkler is closed wherein when the measured time period exceeds a predetermined length, the control unit will either send a warning signal or turn on the slurry sprinkler to sprinkle liquid onto the polishing pad according to a predetermined process so as to maintain the polishing pad in a wet mode.

摘要翻译： 本发明提供了一种用于在湿模式下保持化学机械抛光（CMP）机器的控制装置，所述CMP机器包括抛光垫，用于喷洒液体或去离子水的浆料喷洒器，以及至少一个载体头，所述控制装置 包括位于所述CMP机器上的用于感测所述浆料喷洒器的操作状态并产生相应感测信号的传感器; 以及控制单元，电连接到所述传感器，用于测量所述浆料喷洒器关闭的时间段，其中当所测量的时间段超过预定长度时，所述控制单元将发送警告信号或者打开所述浆料喷洒器以喷洒液体 按照预定的处理在抛光垫上，以便将抛光垫保持在湿模式。