公开(公告)号：US20130077265A1

公开(公告)日：2013-03-28

申请号：US13610145

申请日：2012-09-11

申请人： Yong Won Lee ,  Tae Sang Park ,  Hvo Young Shin ,  Ji Young Jang ,  Young Jun Moon ,  Soon Min Hong

发明人： Yong Won Lee ,  Tae Sang Park ,  Hvo Young Shin ,  Ji Young Jang ,  Young Jun Moon ,  Soon Min Hong

IPC分类号： H05K1/18

CPC分类号： H05K1/147 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/148 ,  H05K1/189 ,  H05K3/284 ,  H05K3/323 ,  H05K3/361 ,  H05K5/065 ,  H05K2201/055 ,  H05K2203/1316 ,  H01L2924/00012

摘要： A printed circuit board assembly capable of having an electronic component mounted at a wafer level by using a wafer itself as a printed circuit board, the printed circuit board assembly including a plurality of electronic components, a printed circuit board having the plurality of electronic components mounted thereon, a protection body configured to entirely cover the printed circuit board, and a connection unit having one end that is exposed to an outside of the protection body for the printed circuit board to be electrically connected to a sub board, wherein the printed circuit board comprises a wafer printed circuit board formed with a wafer.

摘要翻译： 一种印刷电路板组件，其能够通过使用晶片本身作为印刷电路板而具有安装在晶片级的电子部件，所述印刷电路板组件包括多个电子部件，安装有多个电子部件的印刷电路板 其上配置有完全覆盖印刷电路板的保护体，以及连接单元，该连接单元的一端暴露于用于印刷电路板的保护体的外部，以与电路板电连接，其中印刷电路板 包括形成有晶片的晶片印刷电路板。