Preparation method of loop heat pipe evaporator

    公开(公告)号:US11168945B2

    公开(公告)日:2021-11-09

    申请号:US16513037

    申请日:2019-07-16

    Abstract: A hot-press sintering method to prepare a loop heat pipe evaporator includes: putting a shell of the evaporator into a mould, uniformly and compactly filling corresponding positions in the mould with material powders of an evaporation core, a heat insulation core and a transmission core, applying a pressure high enough to tightly fit the evaporation core and the transmission core to the shell at corresponding sintering temperatures of powder materials for the evaporation core and the transmission core, carrying out hot-press sintering for molding, carrying out cooling after metallurgically bonding the powder materials of the evaporation core and the transmission core, and carrying out demolding to obtain the loop heat pipe evaporator, wherein the mould is provided with corresponding structures shaped like steam channels on positions where the evaporation core is provided with the steam channels.

    LOW-FREQUENCY VIBRATION ISOLATION SUPERSTRUCTURE UNIT, SUPERSTRUCTURE AND SUPERSTRUCTURE DESIGN METHOD

    公开(公告)号:US20240426361A1

    公开(公告)日:2024-12-26

    申请号:US18674859

    申请日:2024-05-25

    Abstract: The present disclosure discloses a low-frequency vibration-isolating superstructure unit, a superstructure and a method of designing a superstructure, is capable of solving the problem that it is difficult to meet the requirements of miniaturization and lightening of vibration-isolating devices, and the problem of reduced structural rigidity and strength caused by vibration isolation. The low-frequency vibration-isolating superstructure unit includes: an outer protective structure (1), an inner mass block (2) and a bending structure (3); the outer protective structure (1) is a concave structure and one side with an opening is placed vertically; the inner mass block (2) is arranged on the side of the outer protective structure (1) close to the vertical inner wall, the inner mass block (2) is connected with the bending structure (3) only at the top close to the side with the opening of the concave structure; the bending structure (3) is arranged on the side of the outer protective structure (1) close to the opening, the bending structure (3) includes shaped structures (18) vertically spliced, a top vertical beam (12) and a top transverse beam (13).

    PREPARATION METHOD OF LOOP HEAT PIPE EVAPORATOR

    公开(公告)号:US20200011611A1

    公开(公告)日:2020-01-09

    申请号:US16513037

    申请日:2019-07-16

    Abstract: A hot-press sintering method to prepare a loop heat pipe evaporator includes: putting a shell of the evaporator into a mould, uniformly and compactly filling corresponding positions in the mould with material powders of an evaporation core, a heat insulation core and a transmission core, applying a pressure high enough to tightly fit the evaporation core and the transmission core to the shell at corresponding sintering temperatures of powder materials for the evaporation core and the transmission core, carrying out hot-press sintering for molding, carrying out cooling after metallurgically bonding the powder materials of the evaporation core and the transmission core, and carrying out demolding to obtain the loop heat pipe evaporator, wherein the mould is provided with corresponding structures shaped like steam channels on positions where the evaporation core is provided with the steam channels.

    Low-frequency band Dipole Unit, Multi-frequency band Array Antenna and Adjustment Method Therefor

    公开(公告)号:US20240372262A1

    公开(公告)日:2024-11-07

    申请号:US18657794

    申请日:2024-05-08

    Abstract: Disclosed are a low-frequency band dipole unit, a multi-frequency band array antenna and an adjustment method therefor. The low-frequency band dipole unit includes a first microstrip dipole arm (1), a second microstrip dipole arm (2) and a support structure (3). The first microstrip dipole arm (1) and the second microstrip dipole arm (2) are each in a T-shaped thin arm structure with two vertical arms upwards, each have a thickness in the order of millimeters, and are each in a straight line when viewed from above. The support structure (3) has a slot structure for clamping and supporting the first microstrip dipole arm (1) and the second microstrip dipole arm (2). The multi-frequency band array antenna has a plurality of columns and/or quasi-columns therein, and at least one column or quasi-column of the plurality of columns and/or quasi-columns is composed of the foregoing low-frequency band dipole units completely. The low-frequency band dipole unit has weak coupling and low blocking characteristics, is flexibly nested, and has a great arrangement freedom. The multi-frequency band array antenna has good arrangement freedom and beam adjustment freedom.

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