公开(公告)号：US08337278B2

公开(公告)日：2012-12-25

申请号：US12203726

申请日：2008-09-03

申请人： Ignasi Palou-Rivera ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Ignasi Palou-Rivera ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： B24B49/00

CPC分类号： B24B37/042 ,  B24B49/02 ,  B24B49/12

摘要： Systems and methods for performing one or more measurements of a substrate at one or more radii along the substrate are described. Thickness measurements taken at various radii along the substrate can be averaged together to obtain an average value that reflects an overall substrate thickness. A more accurate measurement of the overall substrate thickness can be obtained by performing multiple measurements and averaging the measurements together. Using the average value, polishing can be adjusted to ensure that the substrate achieves a desired planarized thickness profile.

摘要翻译： 描述了在沿着衬底的一个或多个半径处进行衬底的一个或多个测量的系统和方法。 可以将沿着衬底的不同半径处的厚度测量值一起平均，以获得反映整个衬底厚度的平均值。 通过执行多次测量并将测量值平均化可以获得整个基板厚度的更准确的测量。 使用平均值，可以调整抛光以确保基板达到期望的平坦化厚度分布。