SYSTEM FOR PROVIDING A SUBSTANTIALLY UNIFORM POTENTIAL PROFILE
    1.
    发明申请
    SYSTEM FOR PROVIDING A SUBSTANTIALLY UNIFORM POTENTIAL PROFILE 审中-公开
    用于提供大量均匀潜力配置文件的系统

    公开(公告)号:US20100123502A1

    公开(公告)日:2010-05-20

    申请号:US12500433

    申请日:2009-07-09

    摘要: A system for providing at least two output signals to produce a substantially uniform potential profile includes a signal generator adapted to emit a frequency at least about 30 megahertz, a splitter in communication with the signal generator, and a signal manipulator in communication with the splitter. The splitter is adapted to split the signal of the signal generator into the two output signals, and the signal manipulator is adapted to manipulate a phase, a gain, or an impedance of the two output signals. The signal manipulator manipulates the two output signals so that the two output signals produce the substantially uniform potential profile.

    摘要翻译: 用于提供至少两个输出信号以产生基本上均匀的电位分布的系统包括适于发射至少约30兆赫的频率的信号发生器,与信号发生器通信的分路器以及与分路器通信的信号操纵器。 分路器适于将信号发生器的信号分成两个输出信号,并且信号操纵器适于操纵两个输出信号的相位,增益或阻抗。 信号操纵器操纵两个输出信号,使得两个输出信号产生基本均匀的电位分布。

    Heat sink for use in cooling an integrated circuit
    2.
    发明授权
    Heat sink for use in cooling an integrated circuit 失效
    用于冷却集成电路的散热器

    公开(公告)号:US06400012B1

    公开(公告)日:2002-06-04

    申请号:US08932308

    申请日:1997-09-17

    IPC分类号: H01L2334

    摘要: An apparatus for removing heat from an electronic component. In one embodiment, a heat generating device is mounted to a top-side surface of a package substrate. A fluid flow channel that is defined at least partially by a portion of the back-side surface of the substrate is provided for passing a cooling medium. This configuration permits the cooling medium to be in direct contact with the back-side surface of the substrate, thus, reducing the overall thermal resistance between the heat generating device and cooling medium.

    摘要翻译: 一种用于从电子部件移除热量的装置。 在一个实施例中,将发热装置安装到封装基板的顶侧表面。 设置有至少部分地由衬底的背侧表面的一部分限定的流体流动通道用于通过冷却介质。 这种构造允许冷却介质与基板的背面直接接触,从而降低发热装置与冷却介质之间的整体热阻。

    RF power control device for RF plasma applications
    3.
    发明授权
    RF power control device for RF plasma applications 有权
    射频等离子体应用的射频功率控制装置

    公开(公告)号:US06791274B1

    公开(公告)日:2004-09-14

    申请号:US10620129

    申请日:2003-07-15

    IPC分类号: H01J724

    CPC分类号: H01J37/32174 H01J37/32082

    摘要: There is provided by this invention an improved rf power control device for plasma applications for optimization of the feedback control voltage in the presence of harmonic and non-harmonic spurious frequencies. In this system, an oscillator and mixer, similar to those normally used in radio receiver applications are placed at the sampled output of the solid state rf signal source used for plasma ignition. The sampled output is mixed to a low frequency and filtered to remove the spurious frequencies that is created in the non-linear plasma. In this way, the feedback power control essentially ignores the spurious frequencies. In this application, the oscillator and mixer do not interfere with other desirable system characteristics and effectively isolate the feedback control voltage from changes in plasma spurious content. This allows rf power to be delivered to the plasma with greater accuracy than would otherwise be possible with conventional power control device and methods.

    摘要翻译: 本发明提供了一种用于等离子体应用的改进的射频功率控制装置,用于在存在谐波和非谐波杂散频率的情况下优化反馈控制电压。 在该系统中,类似于在无线电接收机应用中通常使用的振荡器和混频器被放置在用于等离子体点火的固态rf信号源的采样输出端。 将采样输出混合到低频并进行滤波以去除在非线性等离子体中产生的杂散频率。 以这种方式,反馈功率控制基本上忽略了杂散频率。 在本应用中,振荡器和混频器不会干扰其他所需的系统特性,并有效地将反馈控制电压与等离子体杂散内容的变化隔离开来。 这允许rf功率以比常规功率控制装置和方法可能的方式更高的精度传送到等离子体。