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公开(公告)号:US06765394B1
公开(公告)日:2004-07-20
申请号:US09868538
申请日:2001-11-26
申请人: Günter Igel , Ulrich Sieben , Jürgen Giehl
发明人: Günter Igel , Ulrich Sieben , Jürgen Giehl
IPC分类号: G01R2726
CPC分类号: G01R33/038
摘要: The invention relates to a capacitive magnetic field sensor. This sensor has a first electrode (2) and a second electrode (3), which are spaced apart from one another and which form a measurement capacitance. The first electrode (2) is situated on a first substrate body (4), and the second electrode (3) on a second substrate body (5). The second substrate body (5) is designed as a deformable membrane in the vicinity of the second electrode (3). A magnetic body (6) is situated in the vicinity of the second electrode (3) and the membrane, and is rigidly connected to the membrane and to the second electrode (3). As a result of this rigid connection, the influence of an external magnetic field on the magnetic body causes not only the magnetic body (6) to change its position but also causes the membrane and the second electrode (3) to change their position, since they are rigidly connected to said magnetic body. Because the second electrode (3) changes its position, its distance from the first electrode (2) changes, and thus the measurement capacitance, which acts as a measure of the externally applied magnetic field. This capacitive magnetic field sensor is distinguished by very small exterior dimensions, great mechanical stability, and low temperature dependence.
摘要翻译: 本发明涉及电容式磁场传感器。 该传感器具有彼此间隔开并形成测量电容的第一电极(2)和第二电极(3)。 第一电极(2)位于第一基板主体(4)上,第二电极(3)位于第二基板主体(5)上。 第二基板体(5)被设计为在第二电极(3)附近的可变形膜。 磁体(6)位于第二电极(3)和膜附近,并且刚性地连接到膜和第二电极(3)。 作为这种刚性连接的结果,外部磁场对磁体的影响不仅使磁体(6)改变其位置,而且还使膜和第二电极(3)改变其位置,因为 它们刚性地连接到所述磁体。 因为第二电极(3)改变其位置,所以其与第一电极(2)的距离改变,因此测量电容用作外部施加的磁场的量度。 该电容式磁场传感器的外形尺寸非常小,机械稳定性好,温度依赖性低。
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公开(公告)号:US06413474B1
公开(公告)日:2002-07-02
申请号:US09441769
申请日:1999-11-17
申请人: Günter Igel , Ulrich Sieben , Jürgen Giehl , Bernhard Wolf
发明人: Günter Igel , Ulrich Sieben , Jürgen Giehl , Bernhard Wolf
IPC分类号: G01N1506
CPC分类号: G01L19/147 , H01L2224/16225 , H01L2924/00014 , H01L2224/0401
摘要: A measuring device (1) has a semiconductor arrangement, which includes a semiconductor chip (2) connected to a carrier (4) having at least one through-hole (3). The semiconductor chip (2) has at least one sensor (6) with an active sensor surface (5) facing the through-hole (3). The semiconductor chip (2) has electrical terminal points (9), which are connected using flip-chip connections (10) to terminal contacts (11) facing the terminal points (9) and located on the carrier (4). The carrier (4) has electrical strip conductors (12), which connect the terminal contacts (11) to contact elements (13) located on the carrier. To the rear side of the carrier (4) having the contact elements (13) a strip conductor carrier (16) is provided, which has strip conductors (12) connected to opposing contacts (14). The opposing contacts (14) are each electrically connected using flip-chip connections (17), to a contact element (13), which are allocated to each of them. The semiconductor chip (2) and the carrier (4) enclose a measuring chamber. Between the carrier (4) and the semiconductor chip (2) a seal (7) is arranged, which is constructed to be porous or semi-porous, at least in certain areas, or is constructed as a selectively permeable membrane, for bringing a substance into the measuring chamber.
摘要翻译: 测量装置(1)具有半导体装置,其包括连接到具有至少一个通孔(3)的载体(4)的半导体芯片(2)。 半导体芯片(2)具有至少一个具有面向通孔(3)的有源传感器表面(5)的传感器(6)。 半导体芯片(2)具有电气端点(9),它们使用倒装芯片连接(10)连接到面向终端点(9)并位于载体(4)上的端子触点(11)。 载体(4)具有将端子触点(11)连接到位于载体上的接触元件(13)的电条导体(12)。 在具有接触元件(13)的载体(4)的后侧设置带状导体载体(16),该带状导体载体(16)具有连接到相对触点(14)的带状导体(12)。 每个相对的触点(14)都使用倒装芯片连接(17)电连接到分配给它们中的每一个的接触元件(13)。 半导体芯片(2)和载体(4)包围测量室。 在载体(4)和半导体芯片(2)之间,至少在某些区域中布置密封件(7),其被构造为多孔或半孔的,或被构造为选择性渗透膜,用于使 物质进入测量室。
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