公开(公告)号：US20120152545A1

公开(公告)日：2012-06-21

申请号：US13316588

申请日：2011-12-12

Applicant: JIRO TAKEDA ,  LAHCEN GARANDO ,  JOSE GREGORIO LABANDA

Inventor： JIRO TAKEDA ,  LAHCEN GARANDO ,  JOSE GREGORIO LABANDA

IPC: E21B36/00

CPC classification number: E21B36/001 ,  E21B47/011 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Subterranean devices are provided that are configured or designed for high temperature downhole use. The downhole devices comprise an electronic device configured or designed for downhole use in the well and a heat dissipation system. The heat dissipation may include one or more active coolers and a micro-particulate radiation improving coating applied to the active cooler.

Abstract translation: 提供地下装置，其配置或设计用于高温井下使用。 井下装置包括配置或设计用于井中井下使用的电子装置和散热系统。 散热可以包括一个或多个有源冷却器和施加到主动式冷却器的微粒辐射改进涂层。

公开(公告)号：US09097088B2

公开(公告)日：2015-08-04

申请号：US13316588

申请日：2011-12-12

Applicant: Jiro Takeda ,  Lahcen Garando ,  Jose Gregorio Labanda

Inventor： Jiro Takeda ,  Lahcen Garando ,  Jose Gregorio Labanda

IPC: E21B36/00 ,  E21B47/01 ,  H01L23/36

CPC classification number: E21B36/001 ,  E21B47/011 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Subterranean devices are provided that are configured or designed for high temperature downhole use. The downhole devices comprise an electronic device configured or designed for downhole use in the well and a heat dissipation system. The heat dissipation may include one or more active coolers and a micro-particulate radiation improving coating applied to the active cooler.

Abstract translation: 提供地下装置，其配置或设计用于高温井下使用。 井下装置包括配置或设计用于井中井下使用的电子装置和散热系统。 散热可以包括一个或多个有源冷却器和施加到主动式冷却器的微粒辐射改进涂层。