公开(公告)号：US09097088B2

公开(公告)日：2015-08-04

申请号：US13316588

申请日：2011-12-12

Applicant: Jiro Takeda ,  Lahcen Garando ,  Jose Gregorio Labanda

Inventor： Jiro Takeda ,  Lahcen Garando ,  Jose Gregorio Labanda

IPC: E21B36/00 ,  E21B47/01 ,  H01L23/36

CPC classification number: E21B36/001 ,  E21B47/011 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Subterranean devices are provided that are configured or designed for high temperature downhole use. The downhole devices comprise an electronic device configured or designed for downhole use in the well and a heat dissipation system. The heat dissipation may include one or more active coolers and a micro-particulate radiation improving coating applied to the active cooler.

Abstract translation: 提供地下装置，其配置或设计用于高温井下使用。 井下装置包括配置或设计用于井中井下使用的电子装置和散热系统。 散热可以包括一个或多个有源冷却器和施加到主动式冷却器的微粒辐射改进涂层。

公开(公告)号：US07793712B2

公开(公告)日：2010-09-14

申请号：US11844339

申请日：2007-08-23

Applicant: Tsutomu Yamate ,  Hiroshi Inoue ,  Jiro Takeda ,  Yukio Sudo ,  Emmanuel Desroques ,  Satoru Umemoto

Inventor： Tsutomu Yamate ,  Hiroshi Inoue ,  Jiro Takeda ,  Yukio Sudo ,  Emmanuel Desroques ,  Satoru Umemoto

IPC: E21B29/02 ,  E21B47/00 ,  E21B49/00 ,  E21B47/12

CPC classification number: E21B47/00

Abstract: A downhole tool, configured to be suspended in a borehole traversing an earth formation, includes a downhole data acquisition system placed in the tool body and electrically connected to an electric power generator at the formation surface. The downhole data acquisition system includes a sensor for detecting local conditions in the borehole, and a transducer for transducing the voltage of an input signal from high to low or low to high. The transducer having a gallium nitride or silicon carbide based discrete semiconductor device.

Abstract translation: 构造成悬挂在穿过地层的钻孔中的井下工具包括放置在工具主体中并与形成表面处的发电机电连接的井下数据采集系统。 井下数据采集系统包括用于检测钻孔中的局部状况的传感器，以及用于将输入信号的电压从高到低转换为高的换能器。 换能器具有基于氮化镓或碳化硅的分立半导体器件。

公开(公告)号：US20090139244A1

公开(公告)日：2009-06-04

申请号：US11948639

申请日：2007-11-30

Applicant: John Ullo ,  Tsutomu Yamate ,  Jiro Takeda

Inventor： John Ullo ,  Tsutomu Yamate ,  Jiro Takeda

IPC: F25B21/02 ,  F25B21/00 ,  B21D53/02

CPC classification number: F25B21/02 ,  H01L23/38 ,  H01L35/26 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y10T29/4935 ,  H01L2924/00

Abstract: Certain embodiments disclosed herein are directed to devices for cooling. In certain examples, a thermoelectric device comprising a substrate and a superlattice coupled to the substrate is disclosed. In some examples, the superlattice includes a first semi-conducting material and a second semi-conducting material coupled to the first semi-conducting material to provide an interface between the first and second semi-conducting materials.

Abstract translation: 本文公开的某些实施例涉及用于冷却的装置。 在某些实例中，公开了一种包括衬底和耦合到衬底的超晶格的热电器件。 在一些示例中，超晶格包括耦合到第一半导体材料的第一半导体材料和第二半导体材料，以提供第一和第二半导电材料之间的界面。

公开(公告)号：US20080047751A1

公开(公告)日：2008-02-28

申请号：US11844339

申请日：2007-08-23

Applicant: Tsutomu Yamate ,  Hiroshi Inoue ,  Jiro Takeda ,  Yukio Sudo ,  Emmanuel Desroques ,  Satoru Umemoto

Inventor： Tsutomu Yamate ,  Hiroshi Inoue ,  Jiro Takeda ,  Yukio Sudo ,  Emmanuel Desroques ,  Satoru Umemoto

IPC: E21B49/00

CPC classification number: E21B47/00

Abstract: A downhole tool, configured to be suspended in a borehole traversing an earth formation, includes a downhole data acquisition system placed in the tool body and electrically connected to an electric power generator at the formation surface. The downhole data acquisition system includes a sensor for detecting local conditions in the borehole, and a transducer for transducing the voltage of an input signal from high to low or low to high. The transducer having a gallium nitride or silicon carbide based discrete semiconductor device.

Abstract translation: 构造成悬挂在穿过地层的钻孔中的井下工具包括放置在工具主体中并与形成表面处的发电机电连接的井下数据采集系统。 井下数据采集系统包括用于检测钻孔中的局部状况的传感器，以及用于将输入信号的电压从高到低转换为高的换能器。 换能器具有基于氮化镓或碳化硅的分立半导体器件。

公开(公告)号：US20120152545A1

公开(公告)日：2012-06-21

申请号：US13316588

申请日：2011-12-12

Applicant: JIRO TAKEDA ,  LAHCEN GARANDO ,  JOSE GREGORIO LABANDA

Inventor： JIRO TAKEDA ,  LAHCEN GARANDO ,  JOSE GREGORIO LABANDA

IPC: E21B36/00

CPC classification number: E21B36/001 ,  E21B47/011 ,  H01L23/36 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1461 ,  H01L2924/00

Abstract: Subterranean devices are provided that are configured or designed for high temperature downhole use. The downhole devices comprise an electronic device configured or designed for downhole use in the well and a heat dissipation system. The heat dissipation may include one or more active coolers and a micro-particulate radiation improving coating applied to the active cooler.

Abstract translation: 提供地下装置，其配置或设计用于高温井下使用。 井下装置包括配置或设计用于井中井下使用的电子装置和散热系统。 散热可以包括一个或多个有源冷却器和施加到主动式冷却器的微粒辐射改进涂层。

公开(公告)号：US20080219096A1

公开(公告)日：2008-09-11

申请号：US11681788

申请日：2007-03-05

Applicant: WILLIAM UNDERHILL ,  MASAHIRO KAMATA ,  JIRO TAKEDA ,  COLIN WILSON

Inventor： WILLIAM UNDERHILL ,  MASAHIRO KAMATA ,  JIRO TAKEDA ,  COLIN WILSON

IPC: G01V1/00

CPC classification number: G01V1/42

Abstract: Methods and apparatus for creating a velocity profile of a formation surrounding a borehole by checkshot measurements while moving the tool along the borehole. A conveyance and a sensor section are configured to move the sensor section in the borehole. At least one receiver is configured to detect signals generated at or near the surface while the sensor section is moving in the borehole.

Abstract translation: 用于通过在沿着钻孔移动工具的同时通过检查测量来产生围绕钻孔的地层的速度分布的方法和装置。 输送和传感器部分被配置成使钻孔中的传感器部分移动。 至少一个接收器被配置为在传感器部分在钻孔中移动时检测在表面处或附近产生的信号。

公开(公告)号：US07566592B2

公开(公告)日：2009-07-28

申请号：US11552973

申请日：2006-10-26

Applicant: Shigeru Sato ,  Jiro Takeda ,  Atsushi Kayama ,  So Suzuki ,  Lionel Beneteau

Inventor： Shigeru Sato ,  Jiro Takeda ,  Atsushi Kayama ,  So Suzuki ,  Lionel Beneteau

IPC: H05K1/14 ,  H01L21/00 ,  H05K5/00 ,  H02B1/00

CPC classification number: H05K3/3426 ,  C23C18/31 ,  C23C18/32 ,  H01L23/49582 ,  H01L2924/0002 ,  H05K3/26 ,  H05K2201/10909 ,  Y02P70/613 ,  H01L2924/00

Abstract: The principles described herein relate to methods for soldering electrode terminals, pins or lead-frames of commercial electric components for high temperature reliability. In one embodiment, prior to soldering the electric components, a pre-plated solder layer is removed from the lead frame or pins, and nickel and/or gold films are formed with electroless plating. The removal of the pre-plated solder layer avoids excess pre-plated Sn with high-Pb solder that lowers the melting point to between 180° C. and 220° C. and weakens solder joints. The nickel layer formed with an electroless plating acts as a barrier to the interdiffusion of tin from solder with copper of the lead frame material, which may otherwise occur at high temperatures. Interdiffusion forms an intermetallic compound layer of copper and tin and degrades solder joint strength. The novel soldering processes improve high temperature reliability of solder joints and extend electronics life-time.

Abstract translation: 本文描述的原理涉及用于焊接商业电气部件的电极端子，引脚或引线框架以实现高温可靠性的方法。 在一个实施例中，在焊接电气部件之前，从引线框或引脚去除预镀焊料层，并且用无电镀形成镍和/或金膜。 去除预镀焊料层避免了具有高Pb焊料的过量预镀Sn，将熔点降低到180℃和220℃之间，并削弱焊点。 用无电电镀形成的镍层作为阻挡锡从焊料与铜框架材料的铜的相互扩散，否则可能会在高温下发生。 相互扩散形成铜和锡的金属间化合物层，并降低焊点强度。 新颖的焊接工艺提高了焊点的高温可靠性，延长了电子设备的使用寿命。

公开(公告)号：US20090160047A1

公开(公告)日：2009-06-25

申请号：US11963766

申请日：2007-12-21

Applicant: AKIRA OTSUKA ,  SHOHACHI MIYAMAE ,  JIRO TAKEDA

Inventor： AKIRA OTSUKA ,  SHOHACHI MIYAMAE ,  JIRO TAKEDA

IPC: H01L23/49 ,  H01L21/50

CPC classification number: H01L21/56 ,  H01L23/10 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A downhole tool having at least one semiconductor device, including: a die; a bonding pad which is attached to the surface of the die; a bonding wire which is attached to the bonding pad; a bonding point which is formed on the bonding pad for connecting the bonding wire to the bonding pad; an encapsulating resin encapsulating the die and being provided with a cavity such that a connecting portion of the bonding point and the bonding pad is exposed out of the resin in the cavity; and a lid on the encapsulating resin to cover the cavity.

Abstract translation: 一种具有至少一个半导体器件的井下工具，包括：模具; 连接到模具的表面的焊盘; 连接到所述接合焊盘的接合线; 接合点，其形成在用于将接合线连接到接合焊盘的接合焊盘上; 密封模具的封装树脂，并且设置有空腔，使得接合点和接合焊盘的连接部分从空腔中的树脂露出; 以及封装树脂上的盖以覆盖空腔。

公开(公告)号：US20080102561A1

公开(公告)日：2008-05-01

申请号：US11552987

申请日：2006-10-26

Applicant: YASUNORI GOTO ,  JIRO TAKEDA ,  TSUTOMU MASAKI

Inventor： YASUNORI GOTO ,  JIRO TAKEDA ,  TSUTOMU MASAKI

IPC: H01L21/00

CPC classification number: H05K3/3489 ,  H05K3/305 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/0195 ,  H05K2203/086 ,  H05K2203/107 ,  Y02P70/613

Abstract: Methods of manufacturing printed circuit board assemblies include placing a semiconductor chip having a plurality of lead terminals on a board formed with a plurality of solder lands at its surface such that each of the plurality of lead terminals is in touch with a corresponding one of the solder lands; supplying a solder material on the plurality of lead terminal s and the plurality of solder lands; supplying a flux including mono salt of adipic acid and alkyl secondary amine; and locally heating the plurality of lead terminals such that the solder material and the flux are melted to join together the lead terminals and the solder lands.

Abstract translation: 制造印刷电路板组件的方法包括将具有多个引线端子的半导体芯片放置在其表面上形成有多个焊接区域的板上，使得多个引线端子中的每一个与相应的一个焊料接触 土地 在多个引线端子和多个焊接区域上提供焊料材料; 提供包含己二酸单烷基酯和烷基仲胺的助熔剂; 并且对多个引线端子进行局部加热，使得焊料材料和焊剂熔化，以将引线端子和焊盘接合在一起。

公开(公告)号：US4857831A

公开(公告)日：1989-08-15

申请号：US947314

申请日：1986-12-29

Applicant: Dylan H. Davies ,  Jiro Takeda

Inventor： Dylan H. Davies ,  Jiro Takeda

IPC: E21B47/00 ,  G01R27/02 ,  G01V3/24 ,  G01V11/00

CPC classification number: G01V11/005 ,  E21B47/00 ,  G01R27/02 ,  G01V3/24 ,  H03F2200/261

Abstract: Apparatus and method for investigating a borehole casing. The preferred apparatus generally comprises: a housing which is connected to a cable; sets of electrodes, each set being axially spaced from another set, with the electrodes in each set being circumferentially spaced at an axial depth; a positioning device provided in the housing for bringing the electrodes into contact with the casing; a measuring circuit provided inside of the housing and electrically connected to the electrodes for measuring at least the potential difference of the casing between the electrode locations, wherein the potential difference information is amplified by the measuring circuit, and the amplified information is transmitted through the cable for processing; and a control circuit provided in the housing for controlling the operation of the positioning device and the measuring circuit. Preferably, a digitizing circuit is provided so that the amplified information is digitized before it is transmitted to the surface and processed.

Abstract translation: 钻孔套管调查装置及方法。 优选的装置通常包括：连接到电缆的外壳; 每组电极与另一组轴向间隔开，每组中的电极在轴向深度上周向间隔开; 定位装置，设置在所述壳体中，用于使所述电极与所述壳体接触; 设置在壳体的内部并电连接到电极的测量电路，用于至少测量电极位置之间的壳体的电位差，其中电位差信息由测量电路放大，放大的信息通过电缆传输 用于加工; 以及设置在壳体中用于控制定位装置和测量电路的操作的控制电路。 优选地，提供数字化电路，使得放大的信息在被传输到表面之前被数字化并被处理。