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公开(公告)号:US10172230B1
公开(公告)日:2019-01-01
申请号:US15621733
申请日:2017-06-13
申请人: Benjamin Andrew Copley , Matthew S. Torpey , David J. Gillooly , Justin B. Kennard , Andrew S. King
发明人: Benjamin Andrew Copley , Matthew S. Torpey , David J. Gillooly , Justin B. Kennard , Andrew S. King
摘要: A surface mount technology (SMT) device can include an SMT interface on a given side of the SMT device. The SMT interface can include an interface ground plane formed of conductive material. The SMT interface can also include a plurality of signal pads formed of the conductive material. Each signal pad can be encircled by one of a plurality of isolation regions formed from a non-conductive region of the SMT interface. The SMT device is configured for mounting on a printed wiring board (PWB) that includes a board interface having substantially the same shape at the SMT interface.
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公开(公告)号:US20180359847A1
公开(公告)日:2018-12-13
申请号:US15621733
申请日:2017-06-13
申请人: BENJAMIN ANDREW COPLEY , MATTHEW S. TORPEY , DAVID J. GILLOOLY , JUSTIN B. KENNARD , ANDREW S. KING
发明人: BENJAMIN ANDREW COPLEY , MATTHEW S. TORPEY , DAVID J. GILLOOLY , JUSTIN B. KENNARD , ANDREW S. KING
CPC分类号: H05K1/0216 , H05K1/111 , H05K1/115 , H05K1/181 , H05K2201/0723
摘要: A surface mount technology (SMT) device can include an SMT interface on a given side of the SMT device. The SMT interface can include an interface ground plane formed of conductive material. The SMT interface can also include a plurality of signal pads formed of the conductive material. Each signal pad can be encircled by one of a plurality of isolation regions formed from a non-conductive region of the SMT interface. The SMT device is configured for mounting on a printed wiring board (PWB) that includes a board interface having substantially the same shape at the SMT interface.
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